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公开(公告)号：US10825851B2
公开(公告)日：2020-11-03
申请号：US16390280
申请日：2019-04-22
Applicant: KINGPAK TECHNOLOGY INC.
Inventor： Sheng Yang , Li-Chun Hung , Hsiu-Wen Tu , Jo-Wei Yang , Chien-Chen Lee , Jian-Ru Chen
IPC: H01L23/498 , H01L27/146 , H01L23/00 , H01L23/31 , H01L23/04
Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically connecting the substrate and the sensor chip, a glass cover disposed on the sensor chip, and an adhesive layer connecting the glass cover to the substrate. The substrate is made of a material having a coefficient of thermal expansion (CTE) that is less than 10 ppm/° C. The glass cover includes a board body and an annular supporting body connected to the board body. The annular supporting body of the glass cover is fixed onto the substrate through the adhesive layer, so that the glass cover and the substrate jointly surround an enclosed accommodating space. The sensor chip and the metal wires are arranged in the accommodating space, and the sensing region of the sensor chip faces the light-permeable portion of the board body.
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公开(公告)号：US10600830B2
公开(公告)日：2020-03-24
申请号：US15819741
申请日：2017-11-21
Applicant: KINGPAK TECHNOLOGY INC.
Inventor： Jian-Ru Chen , Jo-Wei Yang , Li-Chun Hung , Hsiu-Wen Tu , Chung-Hsien Hsin
IPC: H01L27/146 , H01L23/00 , H01L23/31
Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically connected to the substrate and the sensor chip, a transparent layer facing the sensor chip, a support disposed on the substrate, and a packaging compound disposed on the substrate and covering side edges of the support and the transparent layer. A part of each wire is embedded in the support. A height from the upper surface of the substrate to the top of the support is larger than a height from the upper surface of the substrate to the top of any of the wires. The bottom surface of the transparent layer has a central region facing the sensor chip and a ring-shaped supporting region surrounded by the central region. The support is arranged outside the sensor chip and abuts against the supporting region.
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公开(公告)号：US20190057952A1
公开(公告)日：2019-02-21
申请号：US15911574
申请日：2018-03-05
Applicant: KINGPAK TECHNOLOGY INC.
Inventor： Jian-Ru Chen , Jo-Wei Yang , Li-Chun Hung , Hsiu-Wen Tu
CPC classification number: H01L24/85 , B81B7/0009 , B81B7/0032 , B81B7/02 , B81C3/001 , H01L24/17 , H01L24/24 , H01L24/30 , H01L24/46 , H01L27/14634 , H01L27/14636 , H01L2224/16225 , H01L2224/32147 , H01L2224/32225 , H01L2224/48091 , H01L2224/48177 , H01L2224/48227 , H01L2924/15311 , H01L2924/181 , H04N5/2253 , H01L2924/00014 , H01L2924/00012
Abstract: A stack type sensor package structure includes a substrate, a semiconductor chip disposed on the substrate, a frame disposed on the substrate and aside the semiconductor chip, a sensor chip disposed on the frame, a plurality of wires electrically connecting the sensor chip and the substrate, a transparent layer being of its position corresponding to the sensor chip, a support maintaining the relative position between the sensor chip and the transparent layer, and a package compound disposed on the substrate and partially covering the frame, the support, and the transparent layer. Thus, through disposing a frame within the stack type sensor package structure, the structural strength of the overall sensor package structure is reinforced, and the stability of the wiring of the sensor chip is effectively increased.
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公开(公告)号：US10692917B2
公开(公告)日：2020-06-23
申请号：US16133874
申请日：2018-09-18
Applicant: KINGPAK TECHNOLOGY INC.
Inventor： Hsiu-Wen Tu , Chung-Hsien Hsin , Jian-Ru Chen
IPC: H01L31/0203 , H01L27/146 , H01L23/00 , H01L23/498
Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically connecting the sensor chip to the substrate, a light-permeable layer, a combining layer connecting a portion of the light-permeable layer onto the sensor chip, and a packaging compound covering lateral sides of the sensor chip, the light-permeable layer, and the combining layer. Each of the metal wires is embedded in the combining layer and the packaging compound, and has a diameter within a range of 0.8-1.1 mil. Each of the metal wires includes a first segment connected to the substrate and a second segment connected to the sensor chip. In each of the metal wires, the second segment integrally and curvedly extends from the first segment, and the second segment and a top surface of the sensor chip have a sloping angle within a range of 5-45 degrees.
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Patent Agency Ranking
公开(公告)号：US10186538B2
公开(公告)日：2019-01-22
申请号：US15641378
申请日：2017-07-05
Applicant: KINGPAK TECHNOLOGY INC.
Inventor： Hsiu-Wen Tu , Chung-Hsien Hsin , Jian-Ru Chen
IPC: H01L27/146
Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, several metal wires electrically connected to the substrate and the sensor chip, a translucent layer corresponding in position to the sensor chip, and an adhesive. A top surface of the sensor chip has a sensing region and a spacing region around the sensing region. The sensor chip includes several connecting pads arranged on a first portion of the top surface between the first edge and the spacing region, and a second portion of the top surface between the second edge and the spacing region is provided without any connecting pad. The width of the first portion is greater than that of the second portion. The adhesive covers the surrounding side of the sensor chip, the first portion, and the surrounding side of the translucent layer. Part of each metal wire is embedded in the adhesive.
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公开(公告)号：US11133348B2
公开(公告)日：2021-09-28
申请号：US16744845
申请日：2020-01-16
Applicant: KINGPAK TECHNOLOGY INC.
Inventor： Li-Chun Hung , Chien-Chen Lee , Jian-Ru Chen , Chen-Pin Peng
IPC: H01L27/146 , H01L23/00
Abstract: A sensor package structure and a sensing module thereof are provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer arranged above the sensor chip through the light-curing layer, and a shielding layer disposed on a surface of the light-permeable layer. The light-curing layer has an inner lateral side and an outer lateral side opposite to the inner lateral side, and the inner lateral side is separated from the outer lateral side by a first distance. In a transverse direction parallel to a top surface of the sensor chip, the outer lateral side is separated from an outer lateral edge by a second distance which is within a range of ½ to ⅓ of the first distance.
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公开(公告)号：US10236313B2
公开(公告)日：2019-03-19
申请号：US15641401
申请日：2017-07-05
Applicant: KINGPAK TECHNOLOGY INC.
Inventor： Hsiu-Wen Tu , Chung-Hsien Hsin , Jian-Ru Chen
IPC: H01L27/146
Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, several metal wires electrically connected to the substrate and the sensor chip, a translucent layer corresponding in position to the sensor chip, a combining layer firmly fixing the translucent layer to the sensor chip, and a packaging compound. A top surface of the sensor chip has a sensing region and a spacing region around the sensing region. The sensor chip includes several connecting pads arranged on the top surface between at least part of the edges thereof and the spacing region. The translucent layer has a fixing region arranged outside a portion thereof adhered to the combining layer. The packaging compound covers the fixing region and the external sides of the sensor chip, the combining layer, and the translucent layer. Each metal wire is embedded in the combining layer and the packaging compound.
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公开(公告)号：US10720370B2
公开(公告)日：2020-07-21
申请号：US16172966
申请日：2018-10-29
Applicant: KINGPAK TECHNOLOGY INC.
Inventor： Jian-Ru Chen , Jo-Wei Yang , Chung-Hsien Hsin , Hsiu-Wen Tu
IPC: H01L23/31 , H01L27/146
Abstract: A sensor package structure includes a substrate, an electronic chip fixed on the substrate by flip-chip bonding, a sealant disposed on the substrate and embedding the electronic chip therein, a sensor chip with a size larger than that of the electronic chip, a light-permeable sheet, a plurality of metal wires electrically connected to the substrate and the sensor chip, and a package body. A bottom surface of the sensor chip is disposed on the sealant to be spaced apart from the electronic chip. A lateral surface of the sensor chip is horizontally spaced apart from that of the sealant by a distance less than or equal to 3 mm. The package body is disposed on the substrate and covers the metal wires as well as the lateral sides of the sealant and the sensor chip. The light-permeable sheet is fixed above the sensor chip through the package body.
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公开(公告)号：US10340250B2
公开(公告)日：2019-07-02
申请号：US15911574
申请日：2018-03-05
Applicant: KINGPAK TECHNOLOGY INC.
Inventor： Jian-Ru Chen , Jo-Wei Yang , Li-Chun Hung , Hsiu-Wen Tu
Abstract: A stack type sensor package structure includes a substrate, a semiconductor chip disposed on the substrate, a frame disposed on the substrate and aside the semiconductor chip, a sensor chip disposed on the frame, a plurality of wires electrically connecting the sensor chip and the substrate, a transparent layer being of its position corresponding to the sensor chip, a support maintaining the relative position between the sensor chip and the transparent layer, and a package compound disposed on the substrate and partially covering the frame, the support, and the transparent layer. Thus, through disposing a frame within the stack type sensor package structure, the structural strength of the overall sensor package structure is reinforced, and the stability of the wiring of the sensor chip is effectively increased.
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