公开(公告)号：US11776975B2

公开(公告)日：2023-10-03

申请号：US17468824

申请日：2021-09-08

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chien-Chen Lee ,  Jui-Hung Hsu ,  Ya-Han Chang

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L27/14636

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically coupled to the substrate and the sensor chip, a light-permeable layer, and a colloid formed on the substrate to fix the light-permeable layer. The colloid covers the wires, a peripheral portion of the sensor chip, and lateral surfaces of the light-permeable layer. A top curved surface of the colloid is partially arranged beside the lateral surfaces. In a cross section of the sensor package structure, the top curved surface has a reference point spaced apart from one of the lateral surfaces adjacent thereto by 100 μm, a top edge of the top curved surface and the reference point define a connection line, and the connection line and the one of the lateral surfaces have an acute angle within a range from 25 degrees to 36 degrees.

公开(公告)号：US12027545B2

公开(公告)日：2024-07-02

申请号：US17560176

申请日：2021-12-22

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Jui-Hung Hsu ,  Chien-Chen Lee

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L27/14618 ,  H01L23/29 ,  H01L23/3128 ,  H01L23/315 ,  H01L23/3157 ,  H01L23/3171 ,  H01L24/48 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48105 ,  H01L2224/48158 ,  H01L2224/48228 ,  H01L2924/18165

Abstract: A sensor package structure is provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically coupling the sensor chip to the substrate, a supporting colloid layer disposed on the substrate, and a light-permeable sheet that is disposed on the supporting colloid layer. The substrate has a first board surface and a second board surface that is opposite to the first board surface. The substrate has a chip-accommodating slot recessed in the first board surface. The sensor chip is disposed in the chip-accommodating slot, and a gap distance between a top surface of the sensor chip and the first board surface is less than or equal to 10 μm. The supporting colloid layer is ring-shaped and is disposed on the first board surface, and each of the wires is at least partially embedded in the supporting colloid layer.

公开(公告)号：US11792497B2

公开(公告)日：2023-10-17

申请号：US17667625

申请日：2022-02-09

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chia-Shuai Chang ,  Chien-Chen Lee ,  Jui-Hung Hsu

IPC: H04N5/335 ,  H04N23/54 ,  H04N23/51 ,  H04N23/55

CPC classification number: H04N23/54 ,  H04N23/51 ,  H04N23/55

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The circuit board has a chip-receiving slot recessed in the surface thereof. The sensor chip is arranged in the chip-receiving slot, and a top surface of the sensor chip and the surface of the circuit board have a step difference therebetween that is less than or equal to 10 μm. The supporting adhesive layer is in a ringed shape and is disposed on the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.

公开(公告)号：US11723147B2

公开(公告)日：2023-08-08

申请号：US17667486

申请日：2022-02-08

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chia-Shuai Chang ,  Chien-Chen Lee ,  Jui-Hung Hsu

IPC: G02B7/00 ,  H05K1/11 ,  G02B7/02 ,  H05K1/02

CPC classification number: H05K1/111 ,  G02B7/006 ,  G02B7/02 ,  H05K1/0274 ,  H05K2201/09409 ,  H05K2201/09445 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an electronic chip assembled to the circuit board, a sensor chip, a die attach film (DAF) pre-bonded onto the sensor chip, a plurality of wires electrically coupling the electronic chip and the sensor chip to the circuit board, a supporting adhesive layer, a light-permeable sheet, and an optical module that is fixed to the circuit board for surrounding the above components. The sensor chip is adhered to the electronic chip through the DAF such that a sensing region of the sensor chip is perpendicular to a central axis of the optical module. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.