Abstract:
A method and apparatus for transporting an object from one workstation to another, or for manipulating an object within a workstation, where the object or workstations may be contaminated with unwanted dirt or dust particles, are disclosed. The object is gripped at one work station with a movable transfer arm a movable transfer arm having an end effector composed of an array of nano-scale projections, where each projection provides one or more distal contact ends, the density of contact ends is such as to grip a surface of the object with an intermolecular force sufficient to hold the object for movement, where the relative sizes of the object and particles are such that the object makes contact with severalfold times of the number of contact ends than contacted by such particles. After moving the gripped object to the other workstation, the end effector is manipulated to release the gripped object at the other workstation. Before, during or after transport of the object, the arm's end effector is brought into contact with a cleaning surface having a surface energy interaction with particles carried on said effector as great or greater than the surface energy interaction between particles and effector, thereby to transfer such particles to the cleaning surface. Also disclosed is an apparatus for transporting small elements or objects in a nano- or micro-fabrication assembly or in printing, and a self-cleaning adhesive tape.
Abstract:
An apparatus for transporting an object from one workstation to another, where the object or workstations may be contaminated with unwanted dirt or dust particles. A movable transfer arm connected to a control unit has an end effector including an array of nano-scale projections, where each projection provides one or more distal contact ends. The density of the contact ends is such as to grip a surface of the object with an intermolecular force sufficient to hold the object for movement in accordance with a control unit program. In accordance with a control unit program, after moving the gripped object to the workstation, the end effector is manipulated to release the gripped object, and before, during or after transport of the object, bring the arm's end effector into contact with a cleaning surface.
Abstract:
A method and apparatus for transporting an object from one workstation to another, or for manipulating an object within a workstation, where the object or workstations may be contaminated with unwanted dirt or dust particles, are disclosed. The object is gripped at one work station with a movable transfer arm a movable transfer arm having an end effector composed of an array of nano-scale projections, where each projection provides one or more distal contact ends, the density of contact ends is such as to grip a surface of the object with an intermolecular force sufficient to hold the object for movement, where the relative sizes of the object and particles are such that the object makes contact with severalfold times of the number of contact ends than contacted by such particles. After moving the gripped object to the other workstation, the end effector is manipulated to release the gripped object at the other workstation. Before, during or after transport of the object, the arm's end effector is brought into contact with a cleaning surface having a surface energy interaction with particles carried on said effector as great or greater than the surface energy interaction between particles and effector, thereby to transfer such particles to the cleaning surface. Also disclosed is an apparatus for transporting small elements or objects in a nano- or micro-fabrication assembly or in printing, and a self-cleaning adhesive tape.
Abstract:
A method of forming an adhesive force includes removing a seta from a living specimen, attaching the seta to a substrate, and applying the seta to a surface so as to establish an adhesive force between the substrate and the surface. The seta is applied to the surface with a force perpendicular to the surface. The seta is then pulled with a force parallel to the surface so as to preload the adhesive force of the seta.
Abstract:
A fabricated microstructure includes a base and one or more nano-structures disposed on one or more portions of the base to adhere to a contact surface. The one or more portions of the base with the one or more nano-structures are located on the base such that, when the one or more nano-structures adhere to the contact surface and an external force is applied to peel the base from the contact surface, the one or more nano-structures in the one or more portions of the base facilitate or resist peeling of the nano-structures from the contact surface.
Abstract:
An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers are configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package.
Abstract:
A method of forming an adhesive force includes removing a seta from a living specimen, attaching the seta to a substrate, and applying the seta to a surface so as to establish an adhesive force between the substrate and the surface. The seta is applied to the surface with a force perpendicular to the surface. The seta is then pulled with a force parallel to the surface so as to preload the adhesive force of the seta.
Abstract:
A method of forming an adhesive force includes removing a seta from a living specimen, attaching the seta to a substrate, and applying the seta to a surface so as to establish an adhesive force between the substrate and the surface. The seta is applied to the surface with a force perpendicular to the surface. The seta is then pulled with a force parallel to the surface so as to preload the adhesive force of the seta.
Abstract:
An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers are configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package.
Abstract:
An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers are configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package.