公开(公告)号：US06483037B1

公开(公告)日：2002-11-19

申请号：US10008422

申请日：2001-11-13

Applicant: Kevin D. Moore ,  Thomas P. Gall

Inventor： Kevin D. Moore ,  Thomas P. Gall

IPC: H05K109

CPC classification number: H05K3/4691 ,  H05K1/0278 ,  H05K1/0366 ,  H05K3/0061 ,  H05K3/28 ,  H05K2201/09109 ,  H05K2201/09745 ,  H05K2203/302 ,  Y10T29/49135

Abstract: A flexible circuit (100) includes a first circuit path portion (110) and a second rigid circuit path portion (140) to which electronic components (102) may be coupled. Each circuit path portion (110 and 140) including a resin layer (112 and 142) and an adjacent conductive layer (114 and 144). Each circuit path portion (110 and 140) defining a gap (120 and 150) substantially running along a line corresponding to a desired bend location. A central circuit path portion (130) is disposed between the first circuit path portion (110) and the second rigid circuit path portion (140) and includes a first conductive layer (134) in electrical communication with the first circuit path portion (110) and a second conductive layer (136) in electrical communication with the second rigid circuit path portion (140), so as to provide electrical communication across the gaps (120 and 150). A metal plate (160) is disposed adjacent the second rigid circuit path portion (140).

Abstract translation: 柔性电路（100）包括第一电路路径部分（110）和第二刚性电路路径部分（140），电子部件（102）可以耦合到该第一电路路径部分。 每个电路路径部分（110和140）包括树脂层（112和142）和相邻的导电层（114和144）。 每个电路路径部分（110和140）限定基本上沿着对应于期望的弯曲位置的线行进的间隙（120和150）。 中心电路路径部分（130）设置在第一电路路径部分（110）和第二刚性电路路径部分（140）之间，并包括与第一电路路径部分（110）电连通的第一导电层（134） 以及与所述第二刚性电路路径部分（140）电连通的第二导电层（136），以便跨越所述间隙（120和150）提供电连通。 金属板（160）设置成邻近第二刚性电路路径部分（140）。

公开(公告)号：US5217597A

公开(公告)日：1993-06-08

申请号：US678418

申请日：1991-04-01

Applicant: Kevin D. Moore ,  John W. Stafford ,  Mauro Walker

Inventor： Kevin D. Moore ,  John W. Stafford ,  Mauro Walker

IPC: H01L21/48 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/12 ,  H01L21/4853 ,  H01L24/11 ,  H05K3/3473 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K2201/10734 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/0726

Abstract: A method for forming a plurality of solder bumps on an electronic component substrate utilizes a transfer plate to electrodeposit solder deposits and subsequently reflow the deposits onto the substrate. The plate comprises discrete pad electrodes formed of a ceramic material that is suitably electrically conductive to permit electroplating of the solder alloy, but is not wet by the molten solder to permit reflow onto the substrate. A preferred electrode material is an indium oxide compound. The solder deposits are plated onto the electrodes, and the transfer plate is superposed on the substrate such that the bumps rest upon bond pads on the substrate. The assembly is heated and cooled to melt and resolidify the solder alloy, whereupon the solder bonds to the substrate pads to form the bumps.

Abstract translation: 用于在电子元件基板上形成多个焊料凸块的方法利用转印板来电沉积焊料沉积物并随后将沉积物回流到基底上。 该板包括由陶瓷材料形成的分立焊盘电极，其适当地导电以允许电焊合金的电镀，但不被熔融焊料湿润以允许回流到衬底上。 优选的电极材料是氧化铟化合物。 将焊料沉积物电镀到电极上，并且将转印板叠置在基板上，使得凸块抵靠在基板上的接合焊盘上。 将组件加热并冷却以熔化并重新固化焊料合金，于是焊料与衬底焊盘接合以形成凸块。

公开(公告)号：US5383321A

公开(公告)日：1995-01-24

申请号：US80571

申请日：1993-06-21

Applicant: Stanely R. Krogman ,  Kevin D. Moore

Inventor： Stanely R. Krogman ,  Kevin D. Moore

IPC: B65B17/02 ,  B65D67/02 ,  B65G47/84 ,  B65G47/86 ,  B65B27/04 ,  B65B53/00

CPC classification number: B65B17/025

Abstract: Improvements are disclosed in a machine for applying carrier stock of resilient polymeric material to substantially identical containers, each having an upper rim of a given diameter and a side wall of a larger diameter. The carrier stock has container-receiving apertures in longitudinal rows. A conveyor conveys the containers in longitudinal rows. A wheel assembly comprising two wheels with paired jaws receives the stock, stretches the stock transversely, and moves the stock downwardly past the rims. The conveyor, the wheel assembly, and the jaws on one wheel are adjustable for applying the stock selectively in a rim-applied carrier position or in a side-applied carrier position. The conveyor is supported by a table and is adjustable vertically, via spacers insertable between the table and a base. The wheel assembly is adjustable longitudinally, via rollers on longitudinal rails. The jaws on one wheel are adjustable transversely, via screws.

Abstract translation: 在用于将弹性聚合物材料的载体原料施加到基本上相同的容器的机器中公开了改进，每个容器具有给定直径的上边缘和较大直径的侧壁。 载体坯料具有纵向排的容器接收孔。 输送机沿纵向排列容器。 包括具有成对夹爪的两个车轮的车轮组件接收该货物，横向延伸该货架，并使该货物向下移动经过轮辋。 输送机，轮组件和一个车轮上的夹爪是可调节的，用于在轮辋施加的行星架位置或侧向施加的行星架位置中选择性地施加该物品。 输送机由桌子支撑并且可以垂直调节，通过可插入桌子和底座之间的间隔件。 轮组件可纵向调节，通过纵向导轨上的滚轮。 一个轮子的夹爪可以通过螺丝横向调节。

公开(公告)号：US5269453A

公开(公告)日：1993-12-14

申请号：US958398

申请日：1992-10-08

Applicant: Cynthia M. Melton ,  Kenneth Cholewczynski ,  Kevin D. Moore ,  Carl Raleigh

Inventor： Cynthia M. Melton ,  Kenneth Cholewczynski ,  Kevin D. Moore ,  Carl Raleigh

IPC: H01L21/60 ,  H01L23/498 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L23/49866 ,  H05K3/3436 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/09781 ,  H05K3/3473 ,  Y02P70/613

Abstract: An integrated circuit component is attached to a printed circuit board by solder bump interconnections that are formed between metal bumps on the component and a metal-plated terminal on the board. The metal plate overlies both a bond pad and an adjacent runner of each terminal and is formed of a first metal, which is preferably a tin-base alloy. The metal bumps on the component are formed of a second metal, which is preferably an indium-base alloy. The component and board are assembled and heated to a temperature less than the melting temperatures of the first and second metals. At the interface between the bumps and the plate, the first and second metals cooperate to form a liquid phase which, upon cooling and solidifying, completes the interconnection.

Abstract translation: 集成电路部件通过形成在部件上的金属凸块和板上的金属镀覆端子之间的焊料凸块互连而附接到印刷电路板。 金属板覆盖每个端子的接合焊盘和相邻的流道两者，并且由优选为锡基合金的第一金属形成。 元件上的金属凸块由优选为铟基合金的第二金属形成。 将组件和板组装并加热到低于第一和第二金属的熔融温度的温度。 在凸块和板之间的界面处，第一和第二金属配合形成液相，其在冷却和凝固时完成互连。

公开(公告)号：US5005335A

公开(公告)日：1991-04-09

申请号：US445934

申请日：1989-12-05

Applicant: Ray A. Yourgalite ,  Malcolm Moore ,  Neal C. Chamberlain ,  Kenneth F. Becicka ,  Samuel J. Hilgeman ,  Kevin D. Moore

Inventor： Ray A. Yourgalite ,  Malcolm Moore ,  Neal C. Chamberlain ,  Kenneth F. Becicka ,  Samuel J. Hilgeman ,  Kevin D. Moore

IPC: B65B11/04 ,  B65G61/00

CPC classification number: B65G61/00 ,  B65B11/045

Abstract: An article stack unifying device having article stacking elements is provided to stack a plurality of articles on a surface on or of a rotatable surface. While the articles are being stacked on the selected surface a quantity of wrapping film is wrapped around the stack of articles at intervals during the stacking process and at the completion of the stack.

Abstract translation: 具有物品堆叠元件的物品堆叠统一装置被设置成将多个物品堆叠在可旋转表面上或表面上的表面上。 当物品被堆叠在所选择的表面上时，在堆叠过程期间和堆叠完成时，一定数量的包装膜在堆叠物品周围被间隔缠绕。

公开(公告)号：US4827326A

公开(公告)日：1989-05-02

申请号：US115722

申请日：1987-11-02

Applicant: Leonard F. Altman ,  Kevin D. Moore ,  John D. Shurboff

Inventor： Leonard F. Altman ,  Kevin D. Moore ,  John D. Shurboff

IPC: H01L21/56 ,  H01L21/768 ,  H01L23/48 ,  B29C37/00 ,  B44C1/22

CPC classification number: H01L24/05 ,  H01L21/56 ,  H01L21/7688 ,  H01L24/03 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0405 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05556 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10S438/951

Abstract: This process uses a metal lift-off step and results in a layer of polyimide covering the surface of an integrated circuit, except at the bonding pads which are covered by metals. A layer of polyimide is applied to the surface of an integrated circuit and then partially cured. A layer of positive photo-resist is applied over the polyimide layer and then pattern exposed and developed, resulting in windows being opened up over the bonding pads of the integrated circuit. The remaining photo-resist is then flood exposed. One or more metals are then sputtered over the resist and the bonding pads. The integrated circuit is then immersed in solvent and the remaining layer of photo-resist, including the metal above it, is lifted-off. Only the metal over the bonding pads remains. The polyimide layer is then fully cured.

Abstract translation: 该方法使用金属剥离步骤，并且导致覆盖集成电路表面的聚酰亚胺层，除了被金属覆盖的接合焊盘之外。 将一层聚酰亚胺施加到集成电路的表面，然后部分固化。 将一层正光致抗蚀剂施加在聚酰亚胺层上，然后图案曝光和显影，导致窗口在集成电路的焊盘上打开。 剩下的光刻胶然后被暴露。 然后将一种或多种金属溅射在抗蚀剂和接合焊盘上。 然后将集成电路浸入溶剂中，并将剩余的光致抗蚀剂层（包括其上的金属）剥离。 只有接合垫上的金属仍然存在。 聚酰亚胺层然后完全固化。

公开(公告)号：US20100192512A1

公开(公告)日：2010-08-05

申请号：US12688591

申请日：2010-01-15

Applicant: Kevin D. Moore ,  Christopher J. Samaras

Inventor： Kevin D. Moore ,  Christopher J. Samaras

IPC: B65B11/00 ,  B65B21/24

CPC classification number: B65B5/02 ,  B65B17/025 ,  B65B59/00

Abstract: A machine for packaging multiple containers wherein a flexible carrier stock is fed across a jaw drum. A plurality of containers are also moved through the machine whereby the carrier is subsequently positioned over the plurality of containers so that flexible carrier stock engages with one of the containers to form a package. The jaw drum and/or a connected feed drum are preferably adjustable to accommodate a range of container sizes and carrier configurations.

Abstract translation: 一种用于包装多个容器的机器，其中柔性载体坯料被供给穿过钳口滚筒。 多个容器也移动通过机器，由此托架随后定位在多个容器上方，使得柔性载体坯料与容器之一接合以形成包装。 下巴滚筒和/或连接的进料滚筒优选是可调节的，以适应一定范围的容器尺寸和载体构造。

公开(公告)号：US5194137A

公开(公告)日：1993-03-16

申请号：US740272

申请日：1991-08-05

Applicant: Kevin D. Moore ,  John W. Stafford ,  William M. Beckenbaugh ,  Ken Cholewczynski

Inventor： Kevin D. Moore ,  John W. Stafford ,  William M. Beckenbaugh ,  Ken Cholewczynski

IPC: B23K1/00 ,  H05K1/11 ,  H05K3/34

CPC classification number: B23K1/0016 ,  H05K3/3473 ,  H05K1/11 ,  H05K2203/042 ,  H05K2203/043

Abstract: A method for forming a solder-bumped terminal on a planar dielectric substrate utilizes a terminal of a particular configuration and comprises depositing onto the terminal a thin plate of solder alloy and reflowing the solder alloy to form a bump. The terminal configuration includes an enlarged terminal pad connected to a relatively narrow linear runner section. Preferably, the runner section width is between about 50 and 150 microns, whereas the pad width is between about 1.2 and 2.0 times the runner section width. The terminal is initially fabricated to include a metal layer adjacent the substrate formed, for example, of copper and a thin, outer plate composed of the solder alloy. The solder plate is deposited in a uniform thickness to both the terminal pad and the adjacent runner section. The terminal is then heated to melt the solder plate, whereupon the molten solder is drawn from the runner onto the enlarged pad to form a bump. In a preferred embodiment, a solder plate between about 10 and 25 microns is electrodeposited onto the terminal and reflowed to form a bump having a height between 60 and 80 microns.

Abstract translation: 在平面电介质基板上形成焊料凸起端子的方法利用特定结构的端子，并且包括在端子上沉积焊料合金薄板并回流焊料合金以形成凸块。 端子配置包括连接到相对窄的线性流道部分的放大的端子焊盘。 优选地，流道截面宽度在约50至150微米之间，而垫宽度在流道截面宽度的约1.2和2.0倍之间。 端子最初被制造成包括邻近由例如铜形成的衬底的金属层和由焊料合金组成的薄的外部板。 焊接板以均匀的厚度沉积到端子焊盘和相邻的流道部分。 然后将端子加热以熔化焊料板，然后将熔融的焊料从流道拉出到扩大的焊盘上以形成凸块。 在优选实施例中，约10至25微米之间的焊料电极电沉积到端子上并回流以形成高度在60至80微米之间的凸起。

公开(公告)号：US5148968A

公开(公告)日：1992-09-22

申请号：US653553

申请日：1991-02-11

Applicant: Detlef W. Schmidt ,  Carl Mussele ,  Kevin D. Moore

Inventor： Detlef W. Schmidt ,  Carl Mussele ,  Kevin D. Moore

IPC: H05K3/34 ,  H05K13/04

CPC classification number: H05K3/3436 ,  H05K13/0465 ,  H05K2201/2036 ,  H05K2203/0182 ,  H05K2203/0195 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/53265

Abstract: A solder bump stretch device is disclosed for use in mounting an electronic component to a substrate by a plurality of solder bump interconnections that are produced by reflowing preformed solder bumps carried on the component. the device is fastened to the component, which is in turn assembled with the substrate so that the bumps rest upon the substrate in preparation for solder reflow operations. The device comprises a flexible web that overlies the component outer face and is connected to legs that depend about the component. Prior to solder reflow, the web is held by an expendable spacer in a biased position wherein the legs are raised apart from the substrate. During heating to melt the solder bumps, the spacer is expended, releasing the web, whereupon the legs engage the substrte to lift the component relative to the substrate and thereby stretch the molten solder to form elongated interconnections preferably having hourglass configurations.

Abstract translation: 公开了一种焊料凸块拉伸装置，其用于通过多个焊料凸块互连将电子部件安装到基板上，所述焊料凸块互连是通过将部件上承载的预先形成的焊料凸块进行回流而产生的。 该装置被固定到组件，组件又与衬底组装，使得凸块靠在衬底上以准备用于回流焊接操作。 该装置包括覆盖在部件外表面上并且连接到取决于部件的腿部的柔性卷材。 在焊料回流之前，幅材由偏置位置的消耗性间隔件保持，其中腿部与衬底分开地凸起。 在加热熔化焊料凸块期间，间隔件被消耗，释放网，于是腿接合底板以提升组件相对于衬底，从而拉伸熔融焊料以形成优选具有沙漏构型的细长互连。

公开(公告)号：US20130174513A1

公开(公告)日：2013-07-11

申请号：US13784415

申请日：2013-03-04

Applicant: Kevin D. Moore ,  Christopher J. Samaras

Inventor： Kevin D. Moore ,  Christopher J. Samaras

IPC: B65B5/02

CPC classification number: B65B5/02 ,  B65B17/025 ,  B65B59/00

Abstract: A machine for packaging multiple containers wherein a flexible carrier stock is fed across a jaw drum. A plurality of containers are also moved through the machine whereby the carrier is subsequently positioned over the plurality of containers so that flexible carrier stock engages with one of the containers to form a package. The jaw drum and/or a connected feed drum are preferably adjustable to accommodate a range of container sizes and carrier configurations.

Abstract translation: 一种用于包装多个容器的机器，其中柔性载体坯料被供给穿过钳口滚筒。 多个容器也移动通过机器，由此托架随后定位在多个容器上方，使得柔性载体坯料与容器之一接合以形成包装。 下巴滚筒和/或连接的进料滚筒优选是可调节的，以适应一定范围的容器尺寸和载体构造。