公开(公告)号：US09184331B2

公开(公告)日：2015-11-10

申请号：US13766568

申请日：2013-02-13

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chun-Hua Chuang ,  Chien-Wei Chang ,  Chen-Pin Peng ,  Chung-Hsien Hsin ,  Chun-Lung Huang ,  Hsiu-Wen Tu ,  Cheng-Chang Wu ,  Chung-Yu Yang ,  Rong-Chang Wang ,  Jo-Wei Yang

IPC: H01L21/00 ,  H01L31/18 ,  H01L27/146

CPC classification number: H01L31/18 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2924/0002 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for reducing the tilt of an optical unit during manufacture of an image sensor includes the steps of: providing a semimanufacture of the image sensor, carrying out a preheating process, carrying out an adhesive application process, carrying out an optical unit mounting process, and carrying out a packaging process. Due to the preheating process, the semimanufacture will be subjected to a stabilized process environment during the adhesive application process and the optical unit mounting process, so as for the optical unit to remain highly flat once attached to the semimanufacture. The method reduces the chances of tilt and crack of the optical unit and thereby contributes to a high yield rate.

Abstract translation: 一种用于在图像传感器制造期间减小光学单元的倾斜的方法包括以下步骤：提供图像传感器的半制造，进行预热处理，执行粘合剂施加过程，执行光学单元安装过程， 并进行包装过程。 由于预热过程，在粘合剂施加过程和光学单元安装过程中，半制造将经受稳定的工艺环境，以使光学单元在附接到半制造时保持高度平坦。 该方法降低了光学单元的倾斜和裂纹的机会，从而有助于高的屈服率。

公开(公告)号：US08969120B2

公开(公告)日：2015-03-03

申请号：US14053743

申请日：2013-10-15

Applicant: Kingpak Technology Inc.

Inventor： Chun-Lung Huang ,  Hsiu-Wen Tu ,  Cheng-Chang Wu ,  Chung-Yu Yang ,  Rong-Chang Wang ,  Jo-Wei Yang

IPC: H01L21/00 ,  G01R31/26 ,  H01L21/66 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L31/0203

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A two-stage packaging method of image sensors is disclosed. The packaging method includes the following steps: providing a substrate, fixing an image sensor chip on the substrate, fixing a transparent board on the image sensor chip, electrically connecting the image sensor chip and the substrate, forming a first encapsulant lay, and forming a second encapsulant layer. The two-stage packaging method prevents excessive pressure from being generated by formation of the encapsulant layers during the image sensor packaging process. Such excessive pressure, if generated, may result in position shift of the image sensor chip or damage of the bonding wires. The two-stage packaging method can increase the yield of the image sensor packaging process as well as the sensitivity of image sensors, thereby improving the quality and production of image sensor packaging while lowering the manufacturing costs.

Abstract translation: 公开了一种图像传感器的两级封装方法。 包装方法包括以下步骤：提供基板，将图像传感器芯片固定在基板上，将透明基板固定在图像传感器芯片上，电连接图像传感器芯片和基板，形成第一密封材料，形成 第二密封剂层。 两级包装方法防止在图像传感器封装过程中通过形成密封剂层而产生过大的压力。 如果产生这种过大的压力，则可能导致图像传感器芯片的位置偏移或接合线的损坏。 两级包装方法可以提高图像传感器封装过程的产量以及图像传感器的灵敏度，从而提高图像传感器封装的质量和生产，同时降低制造成本。

公开(公告)号：US20150011038A1

公开(公告)日：2015-01-08

申请号：US14053743

申请日：2013-10-15

Applicant: Kingpak Technology Inc.

Inventor： Chun-Lung HUANG ,  Hsiu-Wen Tu ,  Cheng-Chang Wu ,  Chung-Yu Yang ,  Rong-Chang Wang ,  Jo-Wei Yang

IPC: H01L31/0203

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A two-stage packaging method of image sensors is disclosed. The packaging method includes the following steps: providing a substrate, fixing an image sensor chip on the substrate, fixing a transparent board on the image sensor chip, electrically connecting the image sensor chip and the substrate, forming a first encapsulant lay, and forming a second encapsulant layer. The two-stage packaging method prevents excessive pressure from being generated by formation of the encapsulant layers during the image sensor packaging process. Such excessive pressure, if generated, may result in position shift of the image sensor chip or damage of the bonding wires. The two-stage packaging method can increase the yield of the image sensor packaging process as well as the sensitivity of image sensors, thereby improving the quality and production of image sensor packaging while lowering the manufacturing costs.

Abstract translation: 公开了一种图像传感器的两级封装方法。 包装方法包括以下步骤：提供基板，将图像传感器芯片固定在基板上，将透明基板固定在图像传感器芯片上，电连接图像传感器芯片和基板，形成第一密封材料，形成 第二密封剂层。 两级包装方法防止在图像传感器封装过程中通过形成密封剂层而产生过大的压力。 如果产生这种过大的压力，则可能导致图像传感器芯片的位置偏移或接合线的损坏。 两级包装方法可以提高图像传感器封装过程的产量以及图像传感器的灵敏度，从而提高图像传感器封装的质量和生产，同时降低制造成本。

公开(公告)号：US08703519B1

公开(公告)日：2014-04-22

申请号：US13796622

申请日：2013-03-12

Applicant: Kingpak Technology Inc.

Inventor： Chun-Lung Huang ,  Hsiu-Wen Tu ,  Cheng-Chang Wu ,  Chung-Yu Yang ,  Rong-Chang Wang ,  Jo-Wei Yang

IPC: H01L21/00

CPC classification number: H04N5/2253 ,  H01L27/14618 ,  H01L2224/16 ,  Y10T29/49117

Abstract: The present invention discloses a structure and a manufacturing method for a high-resolution camera module, wherein the method includes the following steps: providing an image sensor wafer comprising multiple image sensor chips; performing inspection and defining if each image sensor chip is a good chip; disposing an optical cover on the image sensor chip defined as the good chip, wherein the optical cover faces a sensing area and does not cover conductive contacts; cutting the image sensor wafer to obtain the discrete image sensor chip covered with the optical cover; and disposing a first surface of the divided image sensor chip on a bottom surface of a ceramic substrate. The present invention can seal the high resolution camera module during early stage of the manufacturing process to improve the yield rate of the camera module, and downsize the camera module effectively.

Abstract translation: 本发明公开了一种用于高分辨率相机模块的结构和制造方法，其中该方法包括以下步骤：提供包括多个图像传感器芯片的图像传感器晶片; 执行检查和定义每个图像传感器芯片是否是一个好的芯片; 将光学盖放置在作为好芯片的图像传感器芯片上，其中光学盖面向感测区域并且不覆盖导电触点; 切割图像传感器晶片以获得覆盖有光学盖的分立图像传感器芯片; 以及将分割图像传感器芯片的第一表面设置在陶瓷基板的底面上。 本发明可以在制造过程的早期阶段密封高分辨率相机模块，以提高相机模块的成品率，并且有效地缩小相机模块的尺寸。