公开(公告)号：US10390432B2

公开(公告)日：2019-08-20

申请号：US15853180

申请日：2017-12-22

Applicant: LG Display Co., Ltd.

Inventor： YeonTaek Yoo

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K3/36 ,  H05K3/30

Abstract: Disclosed is an circuit board module for a display device having a rigid-flex circuit board structure which is capable of improving spatial efficiency of a mother board, and simplifying a structure of the mother board, a method for manufacturing the same, and a display device, wherein a rigid-flex printed circuit board, a rigid printed circuit board, and a flexible printed circuit cable are respectively manufactured on the different mother boards, separately, and then combined with one another, whereby it is possible to realize the more-improved spatial efficiency of the mother board in comparison to a case of manufacturing the rigid-flex printed circuit board, the rigid printed circuit board, and the flexible printed circuit cable on one mother board.

公开(公告)号：US20190342998A1

公开(公告)日：2019-11-07

申请号：US16518409

申请日：2019-07-22

Applicant: LG Display Co., Ltd.

Inventor： YeonTaek Yoo

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K1/11 ,  H05K3/30 ,  H05K1/02

Abstract: Disclosed is an circuit board module for a display device having a rigid-flex circuit board structure which is capable of improving spatial efficiency of a mother board, and simplifying a structure of the mother board, a method for manufacturing the same, and a display device, wherein a rigid-flex printed circuit board, a rigid printed circuit board, and a flexible printed circuit cable are respectively manufactured on the different mother boards, separately, and then combined with one another, whereby it is possible to realize the more-improved spatial efficiency of the mother board in comparison to a case of manufacturing the rigid-flex printed circuit board, the rigid printed circuit board, and the flexible printed circuit cable on one mother board.

公开(公告)号：US10687423B2

公开(公告)日：2020-06-16

申请号：US16518409

申请日：2019-07-22

Applicant: LG Display Co., Ltd.

Inventor： YeonTaek Yoo

IPC: H05K1/00 ,  H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K3/36 ,  H05K3/30 ,  H05K1/18

Abstract: Disclosed is an circuit board module for a display device having a rigid-flex circuit board structure which is capable of improving spatial efficiency of a mother board, and simplifying a structure of the mother board, a method for manufacturing the same, and a display device, wherein a rigid-flex printed circuit board, a rigid printed circuit board, and a flexible printed circuit cable are respectively manufactured on the different mother boards, separately, and then combined with one another, whereby it is possible to realize the more-improved spatial efficiency of the mother board in comparison to a case of manufacturing the rigid-flex printed circuit board, the rigid printed circuit board, and the flexible printed circuit cable on one mother board.

公开(公告)号：US20180184523A1

公开(公告)日：2018-06-28

申请号：US15853180

申请日：2017-12-22

Applicant: LG Display Co., Ltd.

Inventor： YeonTaek Yoo

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/36 ,  H05K3/30

CPC classification number: H05K1/147 ,  H05K1/028 ,  H05K1/111 ,  H05K1/18 ,  H05K3/30 ,  H05K3/361 ,  H05K2201/10128 ,  H05K2201/10962

Abstract: Disclosed is an circuit board module for a display device having a rigid-flex circuit board structure which is capable of improving spatial efficiency of a mother board, and simplifying a structure of the mother board, a method for manufacturing the same, and a display device, wherein a rigid-flex printed circuit board, a rigid printed circuit board, and a flexible printed circuit cable are respectively manufactured on the different mother boards, separately, and then combined with one another, whereby it is possible to realize the more-improved spatial efficiency of the mother board in comparison to a case of manufacturing the rigid-flex printed circuit board, the rigid printed circuit board, and the flexible printed circuit cable on one mother board.