公开(公告)号：US09212790B2

公开(公告)日：2015-12-15

申请号：US14336420

申请日：2014-07-21

Applicant: Lextar Electronics Corporation

Inventor： Ching-Chi Chiang ,  Kun-Hsiung Wang ,  Chien-Hsin Tu

IPC: H01R33/06 ,  F21K99/00 ,  F21V17/00 ,  F21Y101/02 ,  H01R33/09

CPC classification number: F21K9/1355 ,  F21K9/23 ,  F21V17/002 ,  F21Y2101/00 ,  H01R33/06 ,  H01R33/09

Abstract: A light-emitting diode includes an electrical connecting base, a lamp holder, a power driving module, an adapter plate and a lamp plate. One end of the lamp holder is connected to the electrical connecting base and the other end of the lamp holder is configured to be a supporting surface. The electrical connecting base and the lamp holder form an accommodation space which accommodates the power driving module. The adapter plate has a first surface and a second surface opposite to each other. The first surface is contacted with the supporting surface and the second surface includes a first connector which has a plugging direction parallel to the second surface. The lamp plate has a second connector which is detachably plugged to the first connector, so as to be disposed on the adapter plate.

Abstract translation: 发光二极管包括电连接基座，灯座，电源驱动模块，适配器板和灯板。 灯座的一端连接到电连接基座，并且灯座的另一端构造为支撑表面。 电连接基座和灯座形成容纳动力驱动模块的容置空间。 适配板具有彼此相对的第一表面和第二表面。 第一表面与支撑表面接触，并且第二表面包括具有平行于第二表面的堵塞方向的第一连接器。 灯板具有可拆卸地插入第一连接器的第二连接器，以便设置在适配器板上。

公开(公告)号：US12284853B2

公开(公告)日：2025-04-22

申请号：US18393602

申请日：2023-12-21

Applicant: Lextar Electronics Corporation

Inventor： Chien-Hsin Tu

IPC: H01L33/58 ,  H10H20/85 ,  H10H20/851 ,  H10H20/855

Abstract: A light emitting diode (LED) package structure include an electrically-insulated frame, a trough, a LED chip, a fluorescent colloid and at least two spacing members. The electrically-insulated frame has a surface with four corners. The trough is recessed in the surface. The LED chip is located in the trough. The fluorescent colloid is filled within the trough to cover the LED chip. The spacing members protrude from two of the four corners on the surface, wherein a glue escape gap is defined between each spacing member and a boundary of the trough.

公开(公告)号：US20140159087A1

公开(公告)日：2014-06-12

申请号：US13903292

申请日：2013-05-28

Applicant: Lextar Electronics Corporation

Inventor： Chien-Hsin Tu ,  Wei-Yi Hsu ,  Kun-Hsiung Wang

IPC: H01L33/60

CPC classification number: F21K9/52 ,  F21K9/61 ,  F21V3/04 ,  F21V3/049 ,  F21V5/002 ,  F21V7/05 ,  F21Y2115/10 ,  G02B6/0021 ,  G02B6/0053 ,  G02B6/0073 ,  G02B6/0096

Abstract: A light emitting device comprising a carrier, a first and a second reflective layers, a first and a second micro-structures, a LED package device, a light guide device and a light directing cover is provided. The carrier comprises an upper plate and a lower plate each having a first surface and a second surface. The lower plate has a through hole. The first and second reflective layers are formed on the edges of the second surface of the upper plate and the first surface of the lower plate, respectively. The first and second micro-structures are formed on the edges of the second surface of the upper plate and the first surface of the lower plate, respectively. The LED package device is disposed below the through hole. The light guide device is connected to the LED package device. The light directing cover surrounds the light guide device.

Abstract translation: 提供了包括载体，第一和第二反射层，第一和第二微结构，LED封装装置，导光装置和导光盖的发光装置。 载体包括每个具有第一表面和第二表面的上板和下板。 下板具有通孔。 第一和第二反射层分别形成在上板的第二表面和下板的第一表面的边缘上。 第一和第二微结构分别形成在上板的第二表面和下板的第一表面的边缘上。 LED封装器件设置在通孔下方。 导光装置连接到LED封装装置。 导光罩围绕导光装置。

公开(公告)号：US11888099B2

公开(公告)日：2024-01-30

申请号：US17386561

申请日：2021-07-28

Applicant: Lextar Electronics Corporation

Inventor： Chien-Hsin Tu

IPC: H01L33/58 ,  H01L33/50 ,  H01L33/48

CPC classification number: H01L33/58 ,  H01L33/483 ,  H01L33/50

Abstract: A light emitting diode (LED) package structure include an electrically-insulated frame, a trough, a LED chip, a fluorescent colloid and at least two spacing members. The electrically-insulated frame has a surface with four corners. The trough is recessed in the surface. The LED chip is located in the trough. The fluorescent colloid is filled within the trough to cover the LED chip. The spacing members protrude from two of the four corners on the surface, wherein a glue escape gap is defined between each spacing member and a boundary of the trough.

公开(公告)号：US08957446B2

公开(公告)日：2015-02-17

申请号：US13903292

申请日：2013-05-28

Applicant: Lextar Electronics Corporation

Inventor： Chien-Hsin Tu ,  Wei-Yi Hsu ,  Kun-Hsiung Wang

IPC: H01L33/00 ,  F21K99/00 ,  F21V3/04 ,  F21V5/00 ,  F21V7/05 ,  F21Y101/02 ,  F21V8/00

CPC classification number: F21K9/52 ,  F21K9/61 ,  F21V3/04 ,  F21V3/049 ,  F21V5/002 ,  F21V7/05 ,  F21Y2115/10 ,  G02B6/0021 ,  G02B6/0053 ,  G02B6/0073 ,  G02B6/0096

Abstract: A light emitting device comprising a carrier, a first and a second reflective layers, a first and a second micro-structures, a LED package device, a light guide device and a light directing cover is provided. The carrier comprises an upper plate and a lower plate each having a first surface and a second surface. The lower plate has a through hole. The first and second reflective layers are formed on the edges of the second surface of the upper plate and the first surface of the lower plate, respectively. The first and second micro-structures are formed on the edges of the second surface of the upper plate and the first surface of the lower plate, respectively. The LED package device is disposed below the through hole. The light guide device is connected to the LED package device. The light directing cover surrounds the light guide device.

Abstract translation: 提供了包括载体，第一和第二反射层，第一和第二微结构，LED封装装置，导光装置和导光盖的发光装置。 载体包括每个具有第一表面和第二表面的上板和下板。 下板具有通孔。 第一和第二反射层分别形成在上板的第二表面和下板的第一表面的边缘上。 第一和第二微结构分别形成在上板的第二表面和下板的第一表面的边缘上。 LED封装器件设置在通孔下方。 导光装置连接到LED封装装置。 导光罩围绕导光装置。