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公开(公告)号：US20250151201A1
公开(公告)日：2025-05-08
申请号：US18883882
申请日：2024-09-12
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Katherine M. Nelson , Charles J. Kinzel
Abstract: A flexible hybrid electronic system includes a first structure electrically coupled to a second structure through a via. The first structure includes a first flexible substrate, a first electronic component secured to the first flexible substrate, and a first flexible conductive trace formed in part from a fluid phase conductor and enclosed within the first flexible substrate. The second structure includes a second flexible substrate, a second electronic component secured to the second flexible substrate, and a second flexible conductive trace formed in part from the fluid phase conductor and enclosed within the second flexible substrate. The via is filled with a conductive medium and extends between and electrically couples the first flexible conductive trace to the second flexible conductive trace. The first structure is bonded to the second structure at an interconnect region and the via is located within the interconnect region.
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公开(公告)号：US20250016931A1
公开(公告)日：2025-01-09
申请号：US18292757
申请日：2022-07-29
Applicant: Liquid Wire Inc.
Inventor： Trevor Antonio Rivera , Michael Adventure Hopkins , Mark William Ronay
Abstract: Devices, systems, and methods include a substrate layer, a metal layer coupled to the substrate layer, an encapsulant coupled to the substrate layer and the metal layer, and a stencil-in-place structure. The encapsulant is configured to electrically isolate the metal layer from environmental conditions. The stencil-in-place structure includes a stencil substrate and conductive gel secured within a channel and a via formed by the stencil substrate, the conductive gel electrically coupled to the metal layer.
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公开(公告)号：US20240418495A1
公开(公告)日：2024-12-19
申请号：US18701705
申请日：2022-10-21
Applicant: Liquid Wire Inc.
Inventor： Casey Culbertson , Mark William Ronay , Michael Adventure Hopkins
IPC: G01B7/16
Abstract: A strain sensor system and method include a strain sensor, an electronic parameter sensor, and a processor. The strain sensor includes a medium, a plurality of reference points positioned at different locations on the medium, and a plurality of conductive traces formed from conductive gel. At least two of the plurality of conductive traces are operatively coupled to each of the plurality of reference points. Each of the plurality of conductive traces has an electronic property equivalent to a length thereof. The medium and the conductive traces are configured to deform in response to a force placed on the strain sensor, wherein the deformation causes at least one of the plurality of traces to change length. The processor is configured to determine a relative location of each of the plurality of reference points based, at least in part, on the electronic property of each of the plurality of conductive traces.
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公开(公告)号：US20240021337A1
公开(公告)日：2024-01-18
申请号：US18256257
申请日：2021-12-10
Applicant: Liquid Wire Inc.
Inventor： Jesse Michael Martinez , Micheal Adventure Hopkins , Charles J. Kinzel , Trevor Antonio Rivera , Mark William Ronay , Edward Martin Godshalk
CPC classification number: H01B1/22 , H01B7/0027 , H01B3/48 , H01B3/40 , H01B13/0036 , H01B19/04
Abstract: Systems, structures, and methods include a structure formed from a plurality of layers of matrix material. A bus is secured between adjacent layers of the plurality of layers of the matrix material. The bus includes a conductive gel configured to propagate an electrical signal through the structure.
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公开(公告)号：US11594480B2
公开(公告)日：2023-02-28
申请号：US17395130
申请日：2021-08-05
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Edward Martin Godshalk , Charles J. Kinzel
IPC: H01L23/498 , H01L23/31 , H01L21/48
Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.
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Patent Agency Ranking
公开(公告)号：US20240431077A1
公开(公告)日：2024-12-26
申请号：US18823089
申请日：2024-09-03
Applicant: Liquid Wire Inc.
IPC: H05K7/20
Abstract: A thermal interface applique and system includes a containment structure and conductive gel. The containment structure has an adhesive property and a first thermal coefficient. The conductive gel is configured to thermally couple a heat source to a heatsink. The adhesive property of the containment structure is configured to adhere at least one of the heat source and the heatsink to the containment structure
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公开(公告)号：US20240381536A1
公开(公告)日：2024-11-14
申请号：US18777838
申请日：2024-07-19
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay
Abstract: An applique and system includes a substrate having an adhesive property and conductive gel. The conductive gel is contained within the substrate. The conductive gel is configured to electrically couple with a first electronic component and a second electronic component to electrically couple the first electronic component to the second electronic component. The adhesive property of the substrate is configured to adhere at least one of the first electronic component and the second electronic component to the substrate.
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公开(公告)号：US12096563B2
公开(公告)日：2024-09-17
申请号：US17446598
申请日：2021-08-31
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Katherine M. Nelson , Charles J. Kinzel
CPC classification number: H05K1/189 , H05K1/0283 , H05K1/147 , H05K1/092 , H05K1/115 , H05K2201/0129 , H05K2201/0195 , H05K2201/049 , H05K2201/10098 , H05K2201/10106 , H05K2201/10128 , H05K2201/10151 , H05K2201/10219
Abstract: A flexible hybrid electronic system and method includes a first structure and a second structure. The first structure includes a first flexible substrate, a first electronic component secured to the first flexible substrate, and a first flexible conductive trace formed in part from conductive gel. The second structure includes a second flexible substrate, a second electronic component secured to the second flexible substrate, and a second flexible conductive trace formed in part from conductive gel. The first structure is bonded to the second structure at an interconnect region, the first conductive trace is electrically coupled to the second conductive trace within the interconnect region, and the first electronic component is operatively coupled to the second electronic component.
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公开(公告)号：US20230221105A1
公开(公告)日：2023-07-13
申请号：US18001443
申请日：2021-06-11
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Jorge E. Carbo, JR. , Michael Adventure Hopkins
IPC: G01B7/16
CPC classification number: G01B7/18
Abstract: A flexible differential strain sensor, system, and method includes a deformable substrate having a first axis and a second axis different than the first axis and a first sensing element and a second sensing element. The first and second sensing elements are comprised of conductive gel. The first sensing element is arranged to sense strain in the deformable substrate along the first axis. The second sensing element has a first portion arranged to sense strain in the deformable substrate along the first axis and a second portion arranged to sense strain in the deformable substrate along the second axis. The second sensing element is arranged to cancel at least a portion of the stimulus sensed by the first sensing element in the along the first axis.
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公开(公告)号：US12205878B2
公开(公告)日：2025-01-21
申请号：US18316586
申请日：2023-05-12
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Jorge E. Carbo, Jr. , Trevor Antonio Rivera , Charles J. Kinzel , Michael Adventure Hopkins , Sai Srinivas Desabathina
Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
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