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公开(公告)号：US20250151201A1
公开(公告)日：2025-05-08
申请号：US18883882
申请日：2024-09-12
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Katherine M. Nelson , Charles J. Kinzel
Abstract: A flexible hybrid electronic system includes a first structure electrically coupled to a second structure through a via. The first structure includes a first flexible substrate, a first electronic component secured to the first flexible substrate, and a first flexible conductive trace formed in part from a fluid phase conductor and enclosed within the first flexible substrate. The second structure includes a second flexible substrate, a second electronic component secured to the second flexible substrate, and a second flexible conductive trace formed in part from the fluid phase conductor and enclosed within the second flexible substrate. The via is filled with a conductive medium and extends between and electrically couples the first flexible conductive trace to the second flexible conductive trace. The first structure is bonded to the second structure at an interconnect region and the via is located within the interconnect region.
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公开(公告)号：US20250016931A1
公开(公告)日：2025-01-09
申请号：US18292757
申请日：2022-07-29
Applicant: Liquid Wire Inc.
Inventor： Trevor Antonio Rivera , Michael Adventure Hopkins , Mark William Ronay
Abstract: Devices, systems, and methods include a substrate layer, a metal layer coupled to the substrate layer, an encapsulant coupled to the substrate layer and the metal layer, and a stencil-in-place structure. The encapsulant is configured to electrically isolate the metal layer from environmental conditions. The stencil-in-place structure includes a stencil substrate and conductive gel secured within a channel and a via formed by the stencil substrate, the conductive gel electrically coupled to the metal layer.
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公开(公告)号：US20240021337A1
公开(公告)日：2024-01-18
申请号：US18256257
申请日：2021-12-10
Applicant: Liquid Wire Inc.
Inventor： Jesse Michael Martinez , Micheal Adventure Hopkins , Charles J. Kinzel , Trevor Antonio Rivera , Mark William Ronay , Edward Martin Godshalk
CPC classification number: H01B1/22 , H01B7/0027 , H01B3/48 , H01B3/40 , H01B13/0036 , H01B19/04
Abstract: Systems, structures, and methods include a structure formed from a plurality of layers of matrix material. A bus is secured between adjacent layers of the plurality of layers of the matrix material. The bus includes a conductive gel configured to propagate an electrical signal through the structure.
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公开(公告)号：US11594480B2
公开(公告)日：2023-02-28
申请号：US17395130
申请日：2021-08-05
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Edward Martin Godshalk , Charles J. Kinzel
IPC: H01L23/498 , H01L23/31 , H01L21/48
Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.
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公开(公告)号：US12238870B2
公开(公告)日：2025-02-25
申请号：US17151092
申请日：2021-01-15
Applicant: Liquid Wire Inc.
Inventor： Jorge E. Carbo, Jr. , Trevor Antonio Rivera
IPC: H05K3/12
Abstract: A method may include providing a fluid material, solidifying the fluid material, providing a substrate, and depositing the solidified fluid material on the substrate. Providing the fluid material may include providing a mold, and filling the mold with the fluid material. Solidifying the fluid material may include solidifying the fluid material in a mold, and removing the solidified fluid material from the mold. Providing the substrate may include preparing the substrate for deposition of the solidified fluid material, and adjusting the temperature of the substrate. Depositing the solidified fluid material on the substrate may include fixturing the substrate, and loading the solidified fluid material in a deposition tool. The fluid material may include a liquid phase component, and a solid phase component. The solid phase component may include particles suspended in the liquid phase component. The liquid phase component may include a gallium alloy.
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Patent Agency Ranking
公开(公告)号：US12096563B2
公开(公告)日：2024-09-17
申请号：US17446598
申请日：2021-08-31
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Katherine M. Nelson , Charles J. Kinzel
CPC classification number: H05K1/189 , H05K1/0283 , H05K1/147 , H05K1/092 , H05K1/115 , H05K2201/0129 , H05K2201/0195 , H05K2201/049 , H05K2201/10098 , H05K2201/10106 , H05K2201/10128 , H05K2201/10151 , H05K2201/10219
Abstract: A flexible hybrid electronic system and method includes a first structure and a second structure. The first structure includes a first flexible substrate, a first electronic component secured to the first flexible substrate, and a first flexible conductive trace formed in part from conductive gel. The second structure includes a second flexible substrate, a second electronic component secured to the second flexible substrate, and a second flexible conductive trace formed in part from conductive gel. The first structure is bonded to the second structure at an interconnect region, the first conductive trace is electrically coupled to the second conductive trace within the interconnect region, and the first electronic component is operatively coupled to the second electronic component.
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公开(公告)号：US20230221105A1
公开(公告)日：2023-07-13
申请号：US18001443
申请日：2021-06-11
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Jorge E. Carbo, JR. , Michael Adventure Hopkins
IPC: G01B7/16
CPC classification number: G01B7/18
Abstract: A flexible differential strain sensor, system, and method includes a deformable substrate having a first axis and a second axis different than the first axis and a first sensing element and a second sensing element. The first and second sensing elements are comprised of conductive gel. The first sensing element is arranged to sense strain in the deformable substrate along the first axis. The second sensing element has a first portion arranged to sense strain in the deformable substrate along the first axis and a second portion arranged to sense strain in the deformable substrate along the second axis. The second sensing element is arranged to cancel at least a portion of the stimulus sensed by the first sensing element in the along the first axis.
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公开(公告)号：US12205878B2
公开(公告)日：2025-01-21
申请号：US18316586
申请日：2023-05-12
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Jorge E. Carbo, Jr. , Trevor Antonio Rivera , Charles J. Kinzel , Michael Adventure Hopkins , Sai Srinivas Desabathina
Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
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公开(公告)号：US12125778B2
公开(公告)日：2024-10-22
申请号：US18440381
申请日：2024-02-13
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Edward Martin Godshalk , Charles J. Kinzel
IPC: H01L23/498 , H01L21/48 , H01L23/31
CPC classification number: H01L23/49838 , H01L23/3121 , H01L23/4985 , H01L23/49861 , H01L21/4846
Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.
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公开(公告)号：US11955420B2
公开(公告)日：2024-04-09
申请号：US18114420
申请日：2023-02-27
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Edward Martin Godshalk , Charles J. Kinzel
IPC: H01L23/498 , H01L23/31 , H01L21/48
CPC classification number: H01L23/49838 , H01L23/3121 , H01L23/4985 , H01L23/49861 , H01L21/4846
Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.
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