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公开(公告)号：US20230309245A1
公开(公告)日：2023-09-28
申请号：US18188186
申请日：2023-03-22
Applicant: Luxsentek Microelectronics Corp.
Inventor： Sheng-Cheng Lee , Wen-Sheng Lin , Chao-Yang Hsiao , Chih-Wei Lin , Chen-Hua Hsi , Yueh-Hung Ho
CPC classification number: H05K5/0091 , H05K1/181 , H05K1/11 , H05K2201/10106 , H05K2201/10121
Abstract: The present invention provides an optical sensor package assembly. The light shield is arranged in the groove of a package housing above the photosensitive chip. The connection wires between the substrate, the light emitting unit and the photosensitive chip can be printed or disposed on the surface of the substrate. Further, a distance between the photosensitive element and the chip edge is designed to reduce or avoid side leakage interference.
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公开(公告)号：US11703385B1
公开(公告)日：2023-07-18
申请号：US17952142
申请日：2022-09-23
Applicant: Luxsentek Microelectronics Corp.
Inventor： Wen-Sheng Lin , Sheng-Cheng Lee , Yueh-Hung Ho , Chih-Wei Lin , Chen-Hua Hsi
CPC classification number: G01J1/46 , G01J1/4228 , G01J1/44 , G01J2001/444
Abstract: The present invention provides a light sensor with dark current elimination. A dark current from a covered photodiode and a sensed current from a photodiode are respectively transformed to a dark voltage and a sensed voltage by a controlled integration circuit. A reverse capacitor receives the dark voltage and the sensed voltage to cancel out for each other, and outputs a corrected sensing voltage.
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