公开(公告)号：US09704908B2

公开(公告)日：2017-07-11

申请号：US14812197

申请日：2015-07-29

Applicant: MC10, Inc.

Inventor： Bassel de Graff ,  Gilman Callsen ,  William J. Arora ,  Roozbeh Ghaffari

IPC: H01L27/146 ,  A61B1/04 ,  A61B5/01 ,  A61B5/145

CPC classification number: H01L27/14636 ,  A61B1/04 ,  A61B5/01 ,  A61B5/145 ,  A61B2562/02 ,  A61B2562/0204 ,  A61B2562/0209 ,  A61B2562/0233 ,  A61B2562/0247 ,  A61B2562/046 ,  A61B2562/164 ,  H01L27/14609 ,  H01L27/14621 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/24137 ,  H01L2224/82 ,  H01L2924/3512

Abstract: System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface.

公开(公告)号：US20170188942A1

公开(公告)日：2017-07-06

申请号：US15464006

申请日：2017-03-20

Applicant: MC10, Inc.

Inventor： Roozbeh Ghaffari ,  Bassel de Graff ,  Gilman Callsen ,  William J. Arora ,  Benjamin Schlatka ,  Eugene Kuznetsov

IPC: A61B5/00 ,  A61B1/01 ,  A61B5/01 ,  A61B5/0205 ,  A61B18/14 ,  A61B5/145 ,  A61B8/12 ,  A61M5/172 ,  A61N5/06 ,  A61B1/00 ,  A61B5/04

CPC classification number: A61B5/4836 ,  A61B1/00082 ,  A61B1/01 ,  A61B5/00 ,  A61B5/0059 ,  A61B5/01 ,  A61B5/02028 ,  A61B5/02055 ,  A61B5/04001 ,  A61B5/145 ,  A61B5/14532 ,  A61B5/14539 ,  A61B5/14546 ,  A61B5/6879 ,  A61B8/12 ,  A61B8/14 ,  A61B18/02 ,  A61B18/14 ,  A61B18/20 ,  A61B2018/0022 ,  A61B2018/00577 ,  A61B2562/02 ,  A61B2562/0204 ,  A61B2562/0233 ,  A61B2562/0247 ,  A61B2562/046 ,  A61B2562/164 ,  A61M5/1723 ,  A61N1/04 ,  A61N5/062 ,  H01L27/14609

Abstract: System, devices and methods are presented that integrate stretchable or flexible circuitry, including arrays of active devices for enhanced sensing, diagnostic, and therapeutic capabilities. The invention enables conformal sensing contact with tissues of interest, such as the inner wall of a lumen, a nerve bundle, or the surface of the heart. Such direct, conformal contact increases accuracy of measurement and delivery of therapy.

公开(公告)号：US09723711B2

公开(公告)日：2017-08-01

申请号：US14819040

申请日：2015-08-05

Applicant: MC10, Inc.

Inventor： Brian David Elolampi ,  Roozbeh Ghaffari ,  Bassel de Graff ,  William J. Arora ,  Xiaolong Hu

IPC: H05K1/02 ,  H01L21/683 ,  H05K3/46 ,  H05K3/06 ,  H05K1/11 ,  H05K1/03 ,  H01L23/13 ,  H01L25/065 ,  H01L25/07 ,  H01L25/00 ,  H01L23/498 ,  H01L23/538

CPC classification number: H05K1/0278 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/4985 ,  H01L23/5389 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/1461 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/115 ,  H05K3/067 ,  H05K3/4644 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H01L2924/00

Abstract: Flexible electronic structure and methods for fabricating flexible electronic structures are provided. An example method includes applying a first layer to a substrate, creating a plurality of vias through the first layer to the substrate, and applying a second polymer layer to the first layer such that the second polymer forms anchors contacting at least a portion of the substrate. At least one electronic device layer is disposed on a portion of the second polymer layer. At least one trench is formed through the second polymer layer to expose at least a portion of the first layer. At least a portion of the first layer is removed by exposing the structure to a selective etchant to providing a flexible electronic structure that is in contact with the substrate. The electronic structure can be released from the substrate.

公开(公告)号：US20150342036A1

公开(公告)日：2015-11-26

申请号：US14819040

申请日：2015-08-05

Applicant: MC10, Inc.

Inventor： Brian David Elolampi ,  Roozbeh Ghaffari ,  Bassel de Graff ,  William J. Aurora ,  Xiaolong Hu

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  H05K3/06

CPC classification number: H05K1/0278 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/4985 ,  H01L23/5389 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/1461 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/115 ,  H05K3/067 ,  H05K3/4644 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H01L2924/00

Abstract: Flexible electronic structure and methods for fabricating flexible electronic structures are provided. An example method includes applying a first layer to a substrate, creating a plurality of vias through the first layer to the substrate, and applying a second polymer layer to the first layer such that the second polymer forms anchors contacting at least a portion of the substrate. At least one electronic device layer is disposed on a portion of the second polymer layer. At least one trench is formed through the second polymer layer to expose at least a portion of the first layer. At least a portion of the first layer is removed by exposing the structure to a selective etchant to providing a flexible electronic structure that is in contact with the substrate. The electronic structure can be released from the substrate.

Abstract translation: 提供了灵活的电子结构和制造柔性电子结构的方法。 一个示例性方法包括将第一层施加到衬底，产生通过第一层到衬底的多个通孔，以及向第一层施加第二聚合物层，使得第二聚合物形成与衬底的至少一部分接触的锚固件 。 至少一个电子器件层设置在第二聚合物层的一部分上。 通过第二聚合物层形成至少一个沟槽以暴露第一层的至少一部分。 通过将结构暴露于选择性蚀刻剂以提供与衬底接触的柔性电子结构来去除第一层的至少一部分。 电子结构可以从衬底释放。

公开(公告)号：US09123614B2

公开(公告)日：2015-09-01

申请号：US13747826

申请日：2013-01-23

Applicant: MC10, Inc.

Inventor： Bassel de Graff ,  Gilman Callsen ,  William J. Arora ,  Roozbeh Ghaffari

IPC: H01L21/00 ,  H01L27/146 ,  A61B1/04 ,  A61B5/01 ,  A61B5/145

CPC classification number: H01L27/14636 ,  A61B1/04 ,  A61B5/01 ,  A61B5/145 ,  A61B2562/02 ,  A61B2562/0204 ,  A61B2562/0209 ,  A61B2562/0233 ,  A61B2562/0247 ,  A61B2562/046 ,  A61B2562/164 ,  H01L27/14609 ,  H01L27/14621 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/24137 ,  H01L2224/82 ,  H01L2924/3512

Abstract: System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface.

Abstract translation: 提供了提供成像阵列制造工艺方法的系统，装置和方法，其包括制造半导体成像元件阵列，将元件与可拉伸的互连互连，并将具有预应变弹性体印模的阵列转印到次级非平面 表面。

公开(公告)号：US20180190704A1

公开(公告)日：2018-07-05

申请号：US15620181

申请日：2017-06-12

Applicant: MC10, Inc.

Inventor： Bassel de Graff ,  Gilman Callsen ,  William J. Arora ,  Roozbeh Ghaffari

IPC: H01L27/146 ,  A61B1/04 ,  A61B5/145 ,  A61B5/01

CPC classification number: H01L27/14636 ,  A61B1/04 ,  A61B5/01 ,  A61B5/145 ,  A61B2562/02 ,  A61B2562/0204 ,  A61B2562/0209 ,  A61B2562/0233 ,  A61B2562/0247 ,  A61B2562/046 ,  A61B2562/164 ,  H01L27/14609 ,  H01L27/14621 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/24137 ,  H01L2224/82 ,  H01L2924/3512

Abstract: System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface.

公开(公告)号：US20150099976A1

公开(公告)日：2015-04-09

申请号：US14518856

申请日：2014-10-20

Applicant: MC10 Inc.

Inventor： Roozbeh Ghaffari ,  Bassel de Graff ,  Gilman Callsen ,  William J. Arora ,  Benjamin Schlatka ,  Eugene Kuznetsov

IPC: A61B5/00 ,  A61B18/20 ,  A61B5/02 ,  A61M5/172 ,  A61B5/0205 ,  A61B8/14 ,  A61B18/02 ,  A61B18/14

CPC classification number: A61B5/4836 ,  A61B1/00082 ,  A61B1/01 ,  A61B5/00 ,  A61B5/0059 ,  A61B5/01 ,  A61B5/02028 ,  A61B5/02055 ,  A61B5/04001 ,  A61B5/145 ,  A61B5/14532 ,  A61B5/14539 ,  A61B5/14546 ,  A61B5/6879 ,  A61B8/12 ,  A61B8/14 ,  A61B18/02 ,  A61B18/14 ,  A61B18/20 ,  A61B2018/0022 ,  A61B2018/00577 ,  A61B2562/02 ,  A61B2562/0204 ,  A61B2562/0209 ,  A61B2562/0233 ,  A61B2562/0247 ,  A61B2562/046 ,  A61B2562/164 ,  A61M5/1723 ,  A61N1/04 ,  A61N5/062 ,  H01L27/14609

Abstract: System, devices and methods are presented that integrate stretchable or flexible circuitry, including arrays of active devices for enhanced sensing, diagnostic, and therapeutic capabilities. The invention enables conformal sensing contact with tissues of interest, such as the inner wall of a lumen, a nerve bundle, or the surface of the heart. Such direct, conformal contact increases accuracy of measurement and delivery of therapy.

Abstract translation: 提出了集成可伸缩或灵活电路的系统，设备和方法，包括用于增强感测，诊断和治疗能力的有源器件阵列。 本发明使得能够与感兴趣的组织（例如内腔的内壁，神经束或心脏的表面）保形感测接触。 这种直接的共形接触增加了治疗的测量和传递的准确性。

公开(公告)号：US09629586B2

公开(公告)日：2017-04-25

申请号：US14518856

申请日：2014-10-20

Applicant: MC10 Inc.

Inventor： Roozbeh Ghaffari ,  Bassel de Graff ,  Gilman Callsen ,  William J. Arora ,  Benjamin Schlatka ,  Eugene Kuznetsov

IPC: A61N1/04 ,  A61B5/00 ,  A61B1/00 ,  A61B5/04 ,  A61B1/01 ,  A61B5/02 ,  A61B5/0205 ,  A61B8/14 ,  A61B18/02 ,  A61B18/14 ,  A61B18/20 ,  A61M5/172 ,  A61B5/01 ,  A61B5/145 ,  H01L27/146 ,  A61B18/00

CPC classification number: A61B5/4836 ,  A61B1/00082 ,  A61B1/01 ,  A61B5/00 ,  A61B5/0059 ,  A61B5/01 ,  A61B5/02028 ,  A61B5/02055 ,  A61B5/04001 ,  A61B5/145 ,  A61B5/14532 ,  A61B5/14539 ,  A61B5/14546 ,  A61B5/6879 ,  A61B8/12 ,  A61B8/14 ,  A61B18/02 ,  A61B18/14 ,  A61B18/20 ,  A61B2018/0022 ,  A61B2018/00577 ,  A61B2562/02 ,  A61B2562/0204 ,  A61B2562/0209 ,  A61B2562/0233 ,  A61B2562/0247 ,  A61B2562/046 ,  A61B2562/164 ,  A61M5/1723 ,  A61N1/04 ,  A61N5/062 ,  H01L27/14609

Abstract: System, devices and methods are presented that integrate stretchable or flexible circuitry, including arrays of active devices for enhanced sensing, diagnostic, and therapeutic capabilities. The invention enables conformal sensing contact with tissues of interest, such as the inner wall of a lumen, a nerve bundle, or the surface of the heart. Such direct, conformal contact increases accuracy of measurement and delivery of therapy.

公开(公告)号：US20160027834A1

公开(公告)日：2016-01-28

申请号：US14812197

申请日：2015-07-29

Applicant: MC10, Inc.

Inventor： Bassel de Graff ,  Gilman Callsen ,  William J. Arora ,  Roozbeh Ghaffari

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  A61B1/04 ,  A61B5/01 ,  A61B5/145 ,  A61B2562/02 ,  A61B2562/0204 ,  A61B2562/0209 ,  A61B2562/0233 ,  A61B2562/0247 ,  A61B2562/046 ,  A61B2562/164 ,  H01L27/14609 ,  H01L27/14621 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/24137 ,  H01L2224/82 ,  H01L2924/3512

Abstract: System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface.

公开(公告)号：US10325951B2

公开(公告)日：2019-06-18

申请号：US15620181

申请日：2017-06-12

Applicant: MC10, Inc.

Inventor： Bassel de Graff ,  Gilman Callsen ,  William J. Arora ,  Roozbeh Ghaffari

IPC: H01L27/146 ,  A61B1/04 ,  A61B5/145 ,  A61B5/01

Abstract: System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface.