公开(公告)号：US20210311095A1

公开(公告)日：2021-10-07

申请号：US17221368

申请日：2021-04-02

Applicant: MPI Corporation

Inventor： Chung-Yen Huang ,  Chih-Wei Wen ,  Sheng-Feng Xu ,  Fuh-Chyun Tang ,  Chih-Hao Ho

IPC: G01R1/073

Abstract: A probe card and a probe module thereof are provided. The probe card includes a first strengthening board, a fixed frame, a probe module, and a slidable frame. The first strengthening board includes a top surface, a bottom surface, and a mounting hole. An inner wall of the mounting hole is formed with an inner flange. The fixed frame is disposed on the top surface of the first strengthening board and surrounds the mounting hole. The probe module is disposed in the mounting hole and includes an outer flange including a physical region and multiple gap regions. The physical region abuts against the inner flange of the first strengthening board. The slidable frame is disposed on an inner wall of the fixed frame and is slidable between a released position and a fixed position. Multiple pressing portions are disposed on an inner wall of the slidable frame.

公开(公告)号：US10070512B2

公开(公告)日：2018-09-04

申请号：US15423584

申请日：2017-02-03

Applicant: MPI corporation

Inventor： Wei-Cheng Ku ,  Jun-Liang Lai ,  Chih-Hao Ho

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with two first pads, two second pads, and two first sub-circuits. The first pads and the second pads are electrically connected to the first sub-circuits. The second substrate has a top surface, a bottom surface, a lateral edge, and two openings. The bottom surface of the second substrate is attached to the top surface of the first substrate. The openings extend from the top surface to the bottom surface of the second substrate. The first pads of the first substrate are in the opening of the second substrate; the second pads of the first substrate are not covered by the second substrate. The second substrate is further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.

公开(公告)号：US09927487B2

公开(公告)日：2018-03-27

申请号：US14133603

申请日：2013-12-18

Applicant: MPI Corporation

Inventor： Chao-Ching Huang ,  Chih-Hao Ho ,  Wei-Cheng Ku

IPC: G01R31/28 ,  G01R1/073

CPC classification number: G01R31/2887 ,  G01R1/07314 ,  G01R31/2889

Abstract: A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.

公开(公告)号：US09596769B2

公开(公告)日：2017-03-14

申请号：US14620015

申请日：2015-02-11

Applicant: MPI CORPORATION

Inventor： Wei-Cheng Ku ,  Jun-Liang Lai ,  Chih-Hao Ho

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K1/03

CPC classification number: H05K1/0216 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/113 ,  H05K1/114 ,  H05K1/18 ,  H05K3/421 ,  H05K3/426 ,  H05K3/429 ,  H05K2201/041 ,  H05K2201/09545 ,  H05K2203/0369 ,  H05K2203/1461

Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with a first pad, a second pad, and a first sub-circuit. The first pad and the second pad are electrically connected to the first sub-circuit. The second substrate has a top surface, a bottom surface, and an opening. The bottom surface of the second substrate is attached to the top surface of the first substrate. The opening extends from the top surface to the bottom surface of the second substrate. The first pad of the first substrate is in the opening of the second substrate; the second pad of the first substrate is not covered by the second substrate. The second substrate further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.

Abstract translation: 多层电路板包括第一衬底和堆叠中的第二衬底。 第一基板设置有第一焊盘，第二焊盘和第一子电路。 第一焊盘和第二焊盘电连接到第一子电路。 第二基板具有顶表面，底表面和开口。 第二基板的底表面附接到第一基板的顶表面。 开口从第二基板的顶表面延伸到底表面。 第一基板的第一焊盘在第二基板的开口中; 第一衬底的第二衬垫不被第二衬底覆盖。 第二基板还在顶表面上设置有焊盘，并且电连接到第二基板的焊盘的第二子电路。

公开(公告)号：US09545002B2

公开(公告)日：2017-01-10

申请号：US14619944

申请日：2015-02-11

Applicant: MPI CORPORATION

Inventor： Wei-Cheng Ku ,  Jun-Liang Lai ,  Chih-Hao Ho

IPC: H05K1/11

CPC classification number: H05K1/112 ,  H05K1/0268 ,  H05K1/113 ,  H05K2201/10265 ,  H05K2201/10295

Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate has a first pad, and a first circuit, wherein the first circuit is embedded in the first substrate, and the first pad is electrically connected to the first circuit. The second substrate has a first through hole, a second pad, and a second circuit, wherein the first through hole is opened at both sides of the second substrate, and the first pad of the first substrate is in the first through hole; the second circuit is embedded in the second substrate, and the second pad is electrically connected to the second circuit. The pads on each substrate are exposed by the through hole(s) of the above substrate(s) to shorten the null sections of the interconnectors and reduce the interference from the null sections.

Abstract translation: 多层电路板包括第一衬底和堆叠中的第二衬底。 第一基板具有第一焊盘和第一电路，其中第一电路嵌入在第一基板中，并且第一焊盘电连接到第一电路。 第二基板具有第一通孔，第二焊盘和第二电路，其中第一通孔在第二基板的两侧开口，第一基板的第一焊盘位于第一通孔中; 第二电路嵌入第二衬底中，第二衬垫电连接到第二电路。 每个衬底上的焊盘由上述衬底的通孔暴露，以缩短互连器的零部分，并减少无效部分的干扰。

公开(公告)号：US10295567B2

公开(公告)日：2019-05-21

申请号：US15172931

申请日：2016-06-03

Applicant: MPI CORPORATION

Inventor： Wei-Cheng Ku ,  Hao Wei ,  Jun-Liang Lai ,  Chih-Hao Ho

IPC: G01R31/00 ,  G01R1/073 ,  G01R31/319 ,  G01R31/28 ,  G01R31/317

Abstract: A probe module, which supports loopback test and is provided between a PCB and a DUT, includes an adapter, two probes, two inductive components provided at the adapter, and a capacitive component. The adapter has two connecting circuits. An end of each of the probes is connected to one of the connecting circuits, while another end thereof, which is a tip, contacts the DUT. Each of the inductive components has an end electrically connected to one of the connecting circuits, and another end electrically connected to the PCB through a conductive member, which is provided at the adapter, wherein two ends of the capacitive component are electrically connected to one of the connecting circuits, respectively. Whereby, the signal paths are changed by the differences between frequencies of signals, and the transmission path of high-frequency signals is effectively shortened.

公开(公告)号：US10054627B2

公开(公告)日：2018-08-21

申请号：US14558302

申请日：2014-12-02

Applicant: MPI CORPORATION

Inventor： Wei-Cheng Ku ,  Hao Wei ,  Chia-Nan Chou ,  Chih-Hao Ho

IPC: G01R31/04 ,  G01R1/04

CPC classification number: G01R31/041 ,  G01R1/0466

Abstract: A testing jig includes a substrate and a plurality of conductive elastic pieces, wherein the substrate has a recess and a plurality of circuits; the recess is located on a top surface of the substrate, while the circuits are provided on the top surface of the substrate. The conductive elastic pieces are provided on the substrate, and are respectively electrically connected to the circuits. Each of the conductive elastic pieces has a contact portion located within an orthographic projection range of the recess, wherein each of the contact portions contacts a pad of a DUT. Whereby, attenuation happens while transmitting test signals with high frequency can be effectively reduces by using the conductive elastic pieces to transmit test signals.

公开(公告)号：US20250147073A1

公开(公告)日：2025-05-08

申请号：US18934482

申请日：2024-11-01

Applicant: MPI Corporation

Inventor： CHIEN-MING LO ,  Hsuan-Ti Yeh ,  Chih-Hao Ho ,  Horng-Chuan Sun ,  Chien-Ming Huang ,  Chia-Hung Liu

IPC: G01R1/073 ,  G01R3/00

Abstract: The present invention provides a probe card. The probe card comprises a circuit board, a cantilever-type space transformer electrically connected to the circuit board, and a vertical probe head electrically connected to the cantilever-type space transformer. The vertical probe head comprises a probe base and a plurality of vertical probes. The cantilever-type space transformer comprises a mounting base and a plurality of cantilever converting probes, wherein each cantilever converting probe has a fixed segment and an exposed segment. The fixed segment is secured to the mounting base, and the exposed segment is located outside the mounting base. The fixing segment enters from the side of the mounting base and forms a contact at the bottom of the mounting base.

公开(公告)号：US11585832B2

公开(公告)日：2023-02-21

申请号：US17221368

申请日：2021-04-02

Applicant: MPI Corporation

Inventor： Chung-Yen Huang ,  Chih-Wei Wen ,  Sheng-Feng Xu ,  Fuh-Chyun Tang ,  Chih-Hao Ho

IPC: G01R1/073

Abstract: A probe card and a probe module thereof are provided. The probe card includes a first strengthening board, a fixed frame, a probe module, and a slidable frame. The first strengthening board includes a top surface, a bottom surface, and a mounting hole. An inner wall of the mounting hole is formed with an inner flange. The fixed frame is disposed on the top surface of the first strengthening board and surrounds the mounting hole. The probe module is disposed in the mounting hole and includes an outer flange including a physical region and multiple gap regions. The physical region abuts against the inner flange of the first strengthening board. The slidable frame is disposed on an inner wall of the fixed frame and is slidable between a released position and a fixed position. Multiple pressing portions are disposed on an inner wall of the slidable frame.

公开(公告)号：US10101362B2

公开(公告)日：2018-10-16

申请号：US14553590

申请日：2014-11-25

Applicant: MPI CORPORATION

Inventor： Wei-Cheng Ku ,  Hao Wei ,  Yu-Hao Chen ,  Chih-Hao Ho

IPC: G01R1/067

Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.