公开(公告)号：USD1031738S1

公开(公告)日：2024-06-18

申请号：US29796877

申请日：2021-06-28

Applicant: MPI CORPORATION

Designer： Chin-Yi Lin ,  Keng-Min Su ,  Che-Wei Lin ,  Hsin-Cheng Hung

Abstract: FIG. 1 is a perspective view of a die plate assembly for probe head, showing the upper die plate and lower die plate in an assembled position according to our design;
FIG. 2 is a front view thereof, showing the upper die plate and lower die plate in an assembled position, the rear side, the left side and the right side being an identical image;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is an enlarged sectional view taken along line 5-5 of FIG. 3, showing the upper die plate and lower die plate of the die plate assembly for probe head in an assembled position;
FIG. 6 is an enlarged sectional view taken along line 6-6 of FIG. 3, showing the upper die plate and lower die plate of the die plate assembly for probe head in an assembled position;
FIG. 7 is a top perspective view of the upper die plate of the die plate assembly for probe head;
FIG. 8 is a front view of the upper die plate of the die plate assembly for probe head, the rear side being an identical image;
FIG. 9 is a left side elevational view of the upper die plate of the die plate assembly for probe head, the right side being an identical image;
FIG. 10 is a top plan view of the upper die plate of the die plate assembly for probe head;
FIG. 11 is a bottom plan view of the upper die plate of the die plate assembly for probe head;
FIG. 12 is a bottom perspective view of the upper die plate of the die plate assembly for probe head;
FIG. 13 is a top perspective view of the lower die plate of the die plate assembly for probe head;
FIG. 14 is a front view of the lower die plate of the die plate assembly for probe head, the rear side, the left side and the right side being an identical image;
FIG. 15 is a top plan view of the lower die plate of the die plate assembly for probe head;
FIG. 16 is a bottom plan view of the lower die plate of the die plate assembly for probe head; and,
FIG. 17 is a bottom perspective view of the lower die plate of the die plate assembly for probe head.
The broken lines depict portions of the die assembly and form no part of the claimed design.

公开(公告)号：US11733267B2

公开(公告)日：2023-08-22

申请号：US16822896

申请日：2020-03-18

Applicant: MPI Corporation

Inventor： Che-Wei Lin ,  Ting-Ju Wu ,  Keng-Min Su ,  Chin-Yi Lin

IPC: G01R1/073 ,  G01R1/067

CPC classification number: G01R1/07314 ,  G01R1/06733

Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.

公开(公告)号：US12050235B2

公开(公告)日：2024-07-30

申请号：US17569080

申请日：2022-01-05

Applicant: MPI CORPORATION

Inventor： Chin-Yi Lin ,  Keng-Min Su ,  Che-Wei Lin ,  Ko-Chun Wu

IPC: G01R1/00 ,  G01R1/073 ,  G01R1/44

CPC classification number: G01R1/44 ,  G01R1/07342

Abstract: A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.

公开(公告)号：US11619656B2

公开(公告)日：2023-04-04

申请号：US17565075

申请日：2021-12-29

Applicant: MPI CORPORATION

Inventor： Chin-Yi Lin ,  Keng-Min Su ,  Che-Wei Lin ,  Hsin-Cheng Hung

IPC: G01R1/073

Abstract: A probe head includes a middle die, upper and lower die units, at least one of which includes inner and outer dies detachably fastened to the middle die and each other, and a plurality of buckled probes inserted through the upper and lower die units. The inner die has an outer connecting surface connected with an inner surface of the outer die, where an installation recess is provided, an inner connecting surface connected with the middle die, and a probe installation section having a protruding portion protruding from the outer connecting surface and located in the installation recess, and a recessed portion recessed from the inner connecting surface and located correspondingly to the protruding portion. The protruding portion and the installation recess have a horizontal distance therebetween. Therefore, the outer die is horizontally fine adjustable to make the positions of the probes meet the requirement.

公开(公告)号：US20200309819A1

公开(公告)日：2020-10-01

申请号：US16822896

申请日：2020-03-18

Applicant: MPI Corporation

Inventor： Che-Wei Lin ,  Ting-Ju Wu ,  Keng-Min Su ,  Chin-Yi Lin

IPC: G01R1/073 ,  G01R1/067

Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.