公开(公告)号：US11656271B2

公开(公告)日：2023-05-23

申请号：US17699610

申请日：2022-03-21

Applicant: MPI CORPORATION

Inventor： Yi-Hsuan Cheng ,  Hung-I Lin ,  Po-Han Peng

IPC: G01R1/067 ,  G01R31/28

CPC classification number: G01R31/2865 ,  G01R1/06727

Abstract: A wafer inspection system includes a supporting device having electrically connected supporting and contact portions for supporting a wafer's back, and a probe device having a probe and elastic contact members. When a probe tip of the probe contacts the wafer's front, a contact tip of the elastic contact member is abutted against a contact surface of the contact portion. The contact tip is higher than the probe tip. The contact surface is higher than the wafer's front. Alternatively, the contact surface having a radius larger than or equal to twice the wafer's radius. The horizontal distance between the probe tip and the contact tip is larger than or equal to twice the wafer's radius. This satisfies the test requirement of short-pulse test signal and prevents the structural design and transmitting stability of the elastic contact members from being affected by the inspection temperature.

公开(公告)号：US20210133948A1

公开(公告)日：2021-05-06

申请号：US17079030

申请日：2020-10-23

Applicant: MPI Corporation

Inventor： Chien-Yu Chen ,  Han-Yu Chuang ,  Po-Han Peng

IPC: G06T7/00

Abstract: A wafer testing method adapted to test a thin wafer. The thin wafer is combined with a vacuum-release substrate to form a wafer-assembly, and the wafer-assembly is placed in a wafer cassette. The vacuum-release substrate is attached to a front surface of the wafer with an attaching force which is sensitive to air pressure. The method includes the following steps. First, taking out the wafer-assembly from the wafer cassette, then transferring the wafer-assembly to a warpage-detection-device and placing the wafer-assembly on a first stage of the warpage-detection-device. Then, detecting warpage of the wafer. If the warpage of the wafer is less than a warpage threshold, the wafer-assembly is taken out from the first stage, and the wafer-assembly is turned over to place the wafer-assembly on a second stage. Then, applying negative pressure to the vacuum-release substrate to eliminate the attaching force. Then, removing the vacuum-release substrate.

公开(公告)号：US12158493B2

公开(公告)日：2024-12-03

申请号：US18105103

申请日：2023-02-02

Applicant: MPI CORPORATION

Inventor： Yi-Hsuan Cheng ,  Hung-I Lin ,  Po-Han Peng

IPC: G01R31/28

Abstract: A wafer inspection system includes probe and supporting devices opposite to each other. The probe device includes a probe and an electrically conductive module for transmitting test signal of a driver IC. The supporting device includes a chuck, an annular elastic module detachably disposed on the chuck, and a carrier. The chuck has a supporting portion located correspondingly to a hollow portion of the annular elastic module, which is larger than or equal to the carrier in size on an imaginary horizontal plane, enabling the carrier carrying a wafer to be placed on the supporting portion to be electrically connected with the annular elastic module. When the wafer is contacted by the probe, the electrically conductive module is abutted against the annular elastic module to form a short-path test loop. As a result, it is convenient to pick and place the carrier and wafer, enhancing inspection efficiency.

公开(公告)号：US11906571B2

公开(公告)日：2024-02-20

申请号：US17700441

申请日：2022-03-21

Applicant: MPI CORPORATION

Inventor： Chien-Yu Chen ,  Po-Han Peng

IPC: G01R31/26 ,  G02B5/00 ,  H01S5/02212 ,  H01S5/00

CPC classification number: G01R31/2635 ,  G02B5/005 ,  H01S5/0085 ,  H01S5/02212

Abstract: An optical detection system and a laser providing module without using an optical fiber thereof are provided. The optical detection system includes a carrier module, a laser light providing module, and an electrical detection module. The carrier module is configured to carry a plurality of photodiodes. The laser light providing module is disposed above the carrier module. The electrical detection module is adjacent to the carrier module. The laser light providing module is configured to convert a laser light source into a plurality of laser light beams, thereby simultaneously and respectively exciting two corresponding ones of the photodiodes. The electrical detection module is configured to simultaneously and electrically contact the corresponding photodiodes so as to obtain an electrical signal generated by each of the photodiodes.

公开(公告)号：US11348221B2

公开(公告)日：2022-05-31

申请号：US17079030

申请日：2020-10-23

Applicant: MPI Corporation

Inventor： Chien-Yu Chen ,  Han-Yu Chuang ,  Po-Han Peng

IPC: G01N21/95 ,  G06T7/00

Abstract: A wafer testing method adapted to test a thin wafer. The thin wafer is combined with a vacuum-release substrate to form a wafer-assembly, and the wafer-assembly is placed in a wafer cassette. The vacuum-release substrate is attached to a front surface of the wafer with an attaching force which is sensitive to air pressure. The method includes the following steps. First, taking out the wafer-assembly from the wafer cassette, then transferring the wafer-assembly to a warpage-detection-device and placing the wafer-assembly on a first stage of the warpage-detection-device. Then, detecting warpage of the wafer. If the warpage of the wafer is less than a warpage threshold, the wafer-assembly is taken out from the first stage, and the wafer-assembly is turned over to place the wafer-assembly on a second stage. Then, applying negative pressure to the vacuum-release substrate to eliminate the attaching force. Then, removing the vacuum-release substrate.