公开(公告)号：US09142583B2

公开(公告)日：2015-09-22

申请号：US14089769

申请日：2013-11-26

Applicant: Maxchip Electronics Corp.

Inventor： Jin-Wei Chang ,  Hung-Lung Wang ,  Jung-Kai Hung ,  Wei-Chi Su

IPC: H01L27/146 ,  H01L27/144

CPC classification number: H01L27/1463 ,  H01L27/1443 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14647 ,  H01L27/14652

Abstract: Provided is a light sensor including a substrate, a dielectric layer, a plurality of pixels, a plurality of spacers, and a plurality of metal interconnects. The dielectric layer is located on the substrate. The pixels are located in the dielectric layer. The spacers are located on the sidewall of openings between adjacent pixels. The metal interconnects are located in the openings and cover the spacers so as to be electrically connected to the corresponding pixels.

Abstract translation: 提供一种光传感器，其包括基板，电介质层，多个像素，多个间隔物和多个金属互连。 电介质层位于衬底上。 像素位于电介质层中。 间隔物位于相邻像素之间的开口的侧壁上。 金属互连件位于开口中并且覆盖间隔件以便电连接到相应的像素。

公开(公告)号：US20150091123A1

公开(公告)日：2015-04-02

申请号：US14089769

申请日：2013-11-26

Applicant: Maxchip Electronics Corp.

Inventor： Jin-Wei Chang ,  Hung-Lung Wang ,  Jung-Kai Hung ,  Wei-Chi Su

IPC: H01L27/144 ,  H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/1443 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14647 ,  H01L27/14652

Abstract: Provided is a light sensor including a substrate, a dielectric layer, a plurality of pixels, a plurality of spacers, and a plurality of metal interconnects. The dielectric layer is located on the substrate. The pixels are located in the dielectric layer. The spacers are located on the sidewall of openings between adjacent pixels. The metal interconnects are located in the openings and cover the spacers so as to be electrically connected to the corresponding pixels.

Abstract translation: 提供一种光传感器，其包括基板，电介质层，多个像素，多个间隔物和多个金属互连。 电介质层位于衬底上。 像素位于电介质层中。 间隔物位于相邻像素之间的开口的侧壁上。 金属互连件位于开口中并且覆盖间隔件以便电连接到相应的像素。