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    MICROACTUATOR WITH SELF-ASSEMBLED MONOLAYER ENCAPSULANT
    2.
    发明申请
    MICROACTUATOR WITH SELF-ASSEMBLED MONOLAYER ENCAPSULANT 有权
    具有自组装单层包装的微处理器

    公开(公告)号：US20100177446A1

    公开(公告)日：2010-07-15

    申请号：US12730444

    申请日：2010-03-24

    Applicant: Mehmet Hancer ,  Marsha A. Huha ,  John S. Wright ,  Lee Walter

    Inventor： Mehmet Hancer ,  Marsha A. Huha ,  John S. Wright ,  Lee Walter

    IPC: G11B21/24

    CPC classification number: G11B5/5552

    Abstract: A microactuator comprises a mounting block, a head suspension, a compliant joint for connecting the mounting block to the head suspension, and a piezoelectric element for deforming the compliant joint in order to rotate the head suspension with respect to the mounting block. An encapsulant covers an exposed surface of the microactuator. The encapsulant comprises a self-assembled monolayer formed of an organosilicone or organosilane, where the self-assembled monolayer has a self-limiting thickness of one layer of a molecule.

    Abstract translation: 微型致动器包括安装块，头部悬挂，用于将安装块连接到头部悬挂件的柔性接头，以及用于使柔性接头变形以使头部悬架相对于安装块旋转的压电元件。 密封剂覆盖微致动器的暴露表面。 密封剂包括由有机硅或有机硅烷形成的自组装单层，其中自组装单层具有一层分子的自限制厚度。

    Microactuator with self-assembled monolayer encapsulant
    3.
    发明授权
    Microactuator with self-assembled monolayer encapsulant 有权
    具有自组装单层密封剂的微致动器

    公开(公告)号：US07855858B2

    公开(公告)日：2010-12-21

    申请号：US12730444

    申请日：2010-03-24

    Applicant: Mehmet Hancer ,  Marsha A. Huha ,  John S. Wright ,  Lee Walter

    Inventor： Mehmet Hancer ,  Marsha A. Huha ,  John S. Wright ,  Lee Walter

    IPC: G11B5/33

    CPC classification number: G11B5/5552

    Abstract: A microactuator comprises a mounting block, a head suspension, a compliant joint for connecting the mounting block to the head suspension, and a piezoelectric element for deforming the compliant joint in order to rotate the head suspension with respect to the mounting block. An encapsulant covers an exposed surface of the microactuator. The encapsulant comprises a self-assembled monolayer formed of an organosilicone or organosilane, where the self-assembled monolayer has a self-limiting thickness of one layer of a molecule.

    Abstract translation: 微型致动器包括安装块，头部悬挂，用于将安装块连接到头部悬挂件的柔性接头，以及用于使柔性接头变形以使头部悬架相对于安装块旋转的压电元件。 密封剂覆盖微致动器的暴露表面。 密封剂包括由有机硅或有机硅烷形成的自组装单层，其中自组装单层具有一层分子的自限制厚度。

    Selective UV-Ozone dry etching of anti-stiction coatings for MEMS device fabrication
    5.
    发明授权
    Selective UV-Ozone dry etching of anti-stiction coatings for MEMS device fabrication 有权
    用于MEMS器件制造的抗静电涂层的选择性UV-臭氧干法蚀刻

    公开(公告)号：US08237296B2

    公开(公告)日：2012-08-07

    申请号：US12796162

    申请日：2010-06-08

    Applicant: Mehmet Hancer

    Inventor： Mehmet Hancer

    IPC: H01L23/29

    CPC classification number: B81C1/00269 ,  B81C2201/0181 ,  B81C2201/112 ,  B81C2203/0118

    Abstract: Organic anti-stiction coatings such as, for example, hydrocarbon and fluorocarbon based self-assembled organosilanes and siloxanes applied either in solvent or via chemical vapor deposition, are selectively etched using a UV-Ozone (UVO) dry etching technique in which the portions of the organic anti-stiction coating to be etched are exposed simultaneously to multiple wavelengths of ultraviolet light that excite and dissociate organic molecules from the anti-stiction coating and generate atomic oxygen from molecular oxygen and ozone so that the organic molecules react with atomic oxygen to form volatile products that are dissipated, resulting in removal of the exposed portions of the anti-stiction coating. A hybrid etching process using heat followed by UVO exposure may be used. A shadow mask (e.g., of glass or quartz), a protective material layer, or other mechanism may be used to selective expose the portions of the anti-stiction coating to be UVO etched. Such selective UVO etching may be used, for example, to expose wafer bond lines prior to wafer-to-wafer bonding in order to increase bond shear and adhesion strength, to expose bond pads in preparation for electrical or other connections, or for general removal of anti-stiction coating materials from metal or other material surfaces. One specific embodiment uses two wavelengths of ultraviolet light, one at around 184.9 nm and the other at around 253.7 nm.

    Abstract translation: 使用UV-臭氧（UVO）干蚀刻技术选择性地蚀刻有机抗静电涂层，例如在溶剂中或通过化学气相沉积施加的烃和氟碳基自组装有机硅烷和硅氧烷，其中部分 待蚀刻的有机抗静电涂层同时暴露于多个波长的紫外线，其激发和解离有机分子与抗静电涂层，并从分子氧和臭氧产生原子氧，使得有机分子与原子氧反应形成 挥发的产物被消散，导致去除抗静电涂层的暴露部分。 可以使用使用热量然后UVO曝光的混合蚀刻工艺。 可以使用荫罩（例如，玻璃或石英），保护材料层或其它机构来选择性地将抗静电涂层的部分暴露于UVO蚀刻。 可以使用这种选择性UVO蚀刻，例如在晶片到晶片接合之前暴露晶片接合线，以增加键合剪切和粘附强度，以暴露接合焊盘以准备电气或其它连接，或用于一般去除 的抗静电涂层材料从金属或其他材料表面。 一个具体实施方案使用两个波长的紫外光，一个在约184.9nm，另一个在约253.7nm。

    Selective UV-Ozone Dry Etching of Anti-Stiction Coatings for MEMS Device Fabrication
    6.
    发明申请
    Selective UV-Ozone Dry Etching of Anti-Stiction Coatings for MEMS Device Fabrication 有权
    用于MEMS器件制造的抗静电涂层的选择性UV-臭氧干蚀刻

    公开(公告)号：US20100314724A1

    公开(公告)日：2010-12-16

    申请号：US12796162

    申请日：2010-06-08

    Applicant: Mehmet Hancer

    Inventor： Mehmet Hancer

    IPC: H01L21/302 ,  H01L23/28

    CPC classification number: B81C1/00269 ,  B81C2201/0181 ,  B81C2201/112 ,  B81C2203/0118

    Abstract: Organic anti-stiction coatings such as, for example, hydrocarbon and fluorocarbon based self-assembled organosilanes and siloxanes applied either in solvent or via chemical vapor deposition, are selectively etched using a UV-Ozone (UVO) dry etching technique in which the portions of the organic anti-stiction coating to be etched are exposed simultaneously to multiple wavelengths of ultraviolet light that excite and dissociate organic molecules from the anti-stiction coating and generate atomic oxygen from molecular oxygen and ozone so that the organic molecules react with atomic oxygen to form volatile products that are dissipated, resulting in removal of the exposed portions of the anti-stiction coating. A hybrid etching process using heat followed by UVO exposure may be used. A shadow mask (e.g., of glass or quartz), a protective material layer, or other mechanism may be used to selective expose the portions of the anti-stiction coating to be UVO etched. Such selective UVO etching may be used, for example, to expose wafer bond lines prior to wafer-to-wafer bonding in order to increase bond shear and adhesion strength, to expose bond pads in preparation for electrical or other connections, or for general removal of anti-stiction coating materials from metal or other material surfaces. One specific embodiment uses two wavelengths of ultraviolet light, one at around 184.9 nm and the other at around 253.7 nm.

    Abstract translation: 使用UV-臭氧（UVO）干蚀刻技术选择性地蚀刻有机抗静电涂层，例如在溶剂中或通过化学气相沉积施加的烃和氟碳基自组装有机硅烷和硅氧烷，其中部分 待蚀刻的有机抗静电涂层同时暴露于多个波长的紫外线，其激发和解离有机分子与抗静电涂层，并从分子氧和臭氧产生原子氧，使得有机分子与原子氧反应形成 挥发的产物被消散，导致去除抗静电涂层的暴露部分。 可以使用使用热量然后UVO曝光的混合蚀刻工艺。 可以使用荫罩（例如，玻璃或石英），保护材料层或其它机构来选择性地将抗静电涂层的部分暴露于UVO蚀刻。 可以使用这种选择性UVO蚀刻，例如在晶片到晶片接合之前暴露晶片接合线，以增加键合剪切和粘附强度，以暴露接合焊盘以准备电气或其它连接，或用于一般去除 的抗静电涂层材料从金属或其他材料表面。 一个具体实施方案使用两个波长的紫外光，一个在约184.9nm，另一个在约253.7nm。

    Encapsulant for a disc drive component
    7.
    发明授权
    Encapsulant for a disc drive component 有权
    磁盘驱动器组件的封装

    公开(公告)号：US07746600B2

    公开(公告)日：2010-06-29

    申请号：US10700031

    申请日：2003-11-03

    Applicant: Mehmet Hancer ,  Marsha A. Huha ,  John S. Wright ,  Lee Walter

    Inventor： Mehmet Hancer ,  Marsha A. Huha ,  John S. Wright ,  Lee Walter

    IPC: G11B5/596

    CPC classification number: G11B5/5552

    Abstract: A slider is used in an actuation system and carries a transducing head for transducing data to and from a rotatable recording disc. The slider includes a slider body having a leading edge and a trailing edge and a transducing head positioned proximate the trailing edge of the slider body. An encapsulant comprised of a self assembled monolayer covers exposed surfaces the slider body.

    Abstract translation: 在致动系统中使用滑块，并且承载用于将数据传送到可旋转记录盘的转换头。 滑块包括具有前缘和后缘的滑动体，以及邻近滑动体的后缘定位的换能头。 由自组装单层组成的密封剂覆盖滑块体的暴露表面。

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