公开(公告)号：US09162324B2

公开(公告)日：2015-10-20

申请号：US12084793

申请日：2006-11-10

Applicant: Kosuke Nakano ,  Hidekiyo Takaoka ,  Minoru Ueshima

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka ,  Minoru Ueshima

IPC: B23K35/362 ,  B23K35/26 ,  B23K35/02 ,  B23K35/30 ,  H05K3/34

CPC classification number: B23K35/264 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/302 ,  B23K35/362 ,  H05K3/3484 ,  H05K2201/0272

Abstract: The invention provides a solder paste which has a solidus temperature of 255° C. or above and is improved in the wettability between Bi and Cu or Ag electrode to attain approximately equivalent wettability to those of Pb-containing high-temperature solders even in low-temperature soldering. The solder paste comprises a metal powder component consisting of Bi or a Bi alloy, a solidus temperature lowering metal for Bi, and a solid-phase metal capable of forming an intermetallic compound with the solidus temperature lowering metal, and a flux component.

Abstract translation: 本发明提供了固相线温度为255℃以上的焊锡膏，并且提高了Bi和Cu或Ag电极之间的润湿性，以达到与含Pb高温焊料即使在低温焊料中几乎相同的润湿性， 温度焊接。 焊膏包括由Bi或Bi合金构成的金属粉末成分，Bi的固相降温金属和能够与固相线降温金属形成金属间化合物的固相金属和助熔剂成分。

公开(公告)号：US08975757B2

公开(公告)日：2015-03-10

申请号：US12736053

申请日：2009-03-03

Applicant: Minoru Ueshima ,  Masayuki Suzuki ,  Yoshie Yamanaka ,  Shunsaku Yoshikawa ,  Tokuro Yamaki ,  Tsukasa Ohnishi

Inventor： Minoru Ueshima ,  Masayuki Suzuki ,  Yoshie Yamanaka ,  Shunsaku Yoshikawa ,  Tokuro Yamaki ,  Tsukasa Ohnishi

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  B23K35/26 ,  C22C13/00 ,  H01L23/36 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L24/11 ,  B23K35/262 ,  B23K35/268 ,  C22C13/00 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2224/8191 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/3511 ,  H01L2924/05432 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Solder used for flip chip bonding inside a semiconductor package was a Sn—Pb solder such as a Pb-5Sn composition. Lead-free solders which have been studied are hard and easily form intermetallic compounds with Sn, so they were not suitable for a flip chip connection structure inside a semiconductor package, which requires stress relaxation properties. This problem is eliminated by a flip chip connection structure inside a semiconductor package using a lead-free solder which is characterized by consisting essentially of 0.01-0.5 mass percent of Ni and a remainder of Sn. 0.3-0.9 mass percent of Cu and 0.001-0.01 mass percent of P may be added to this solder composition.

Abstract translation: 用于半导体封装内的倒装芯片焊接的焊料是诸如Pb-5Sn组合物的Sn-Pb焊料。 已经研究的无铅焊料难以容易地与Sn形成金属间化合物，因此它们不适用于半导体封装内的倒装芯片连接结构，这需要应力松弛性能。 该问题通过使用无铅焊料的半导体封装内的倒装芯片连接结构来消除，其特征在于基本上由0.01-0.5质量％的Ni和余量的Sn组成。 可以向该焊料组合物中添加0.3〜0.9质量％的Cu和0.001-0.01质量％的P。

公开(公告)号：US08888932B2

公开(公告)日：2014-11-18

申请号：US12452665

申请日：2008-07-17

Applicant: Yuji Kawamata ,  Minoru Ueshima ,  Tomu Tamura ,  Kazuhiro Matsushita ,  Masashi Sakamoto

Inventor： Yuji Kawamata ,  Minoru Ueshima ,  Tomu Tamura ,  Kazuhiro Matsushita ,  Masashi Sakamoto

IPC: B23K35/34 ,  C22C13/00 ,  B23K35/26 ,  H05K3/34

CPC classification number: C22C13/00 ,  B23K35/26 ,  B23K35/262 ,  H05K3/3463

Abstract: A lead-free solder alloy which can be used for soldering of vehicle-mounted electronic circuits and which exhibits high reliability is provided.The alloy consists essentially of Ag: 2.8-4 mass %, In: 3-5.5 mass %, Cu: 0.5-1.1 mass %, if necessary Bi: 0.5-3 mass %, and a remainder of Sn. In is at least partially in solid solution in the Sn matrix.

Abstract translation: 提供了可用于车载电子电路的焊接并且具有高可靠性的无铅焊料合金。 该合金基本上由Ag：2.8-4质量％，In：3-5.5质量％，Cu：0.5-1.1质量％，如果需要Bi：0.5-3质量％，余量为Sn。 In至少部分为Sn基体中的固溶体。

公开(公告)号：US08334598B2

公开(公告)日：2012-12-18

申请号：US12868375

申请日：2010-08-25

Applicant: Hiroshi Nishibori ,  Kunihiro Yoshihara ,  Minoru Ueshima

Inventor： Hiroshi Nishibori ,  Kunihiro Yoshihara ,  Minoru Ueshima

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/29 ,  B23K35/262 ,  C22C13/00 ,  C22C13/02 ,  H01L23/049 ,  H01L23/3735 ,  H01L23/42 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/83205

Abstract: A power semiconductor device includes a substrate, an element circuit pattern formed on the substrate and made of Cu covered with an electroless Ni—P plating layer, and a power semiconductor element bonded to the element circuit pattern by a solder, wherein the solder is an alloy of Sn, Sb, and Cu, and the weight percent of Cu is in the range of 0.5 to 1%, inclusive.

Abstract translation: 功率半导体器件包括衬底，形成在衬底上的由化学镀Ni-P镀层覆盖的Cu制成的元件电路图案，以及通过焊料接合到元件电路图案的功率半导体元件，其中焊料是 Sn，Sb，Cu的合金，Cu的重量百分比在0.5〜1％的范围内。

公开(公告)号：US20100015004A1

公开(公告)日：2010-01-21

申请号：US11990518

申请日：2006-08-18

Applicant: Minoru Ueshima

Inventor： Minoru Ueshima

IPC: C22C28/00 ,  C22C12/00 ,  C22C30/00

CPC classification number: C22C28/00 ,  B23K35/26 ,  B23K35/264 ,  C22C12/00 ,  H05K3/3463

Abstract: A conventional low-temperature solder containing Pb or Cd had problems with respect to environmental pollution. A conventional low-temperature lead-free solder had a liquidus temperature which was too high for low heat resistance parts having a heat resistance temperature of 130° C., or it was brittle or had low mechanical strength. A lead-free low-temperature solder according to the present invention comprises 48-52.5 mass % of In and a balance of Bi, and most of the structure is constituted by a BiIn2 intermetallic compound which is not brittle. Zn or La can be added in order to further improve solderability, and a small amount of P can be added to prevent corrosion at high temperatures and high humidities.

Abstract translation: 含有Pb或Cd的常规低温焊料在环境污染方面存在问题。 常规的低温无铅焊料的液相线温度对于耐热温度为130℃的低耐热部件而言太高，或者是脆性或机械强度低的。 根据本发明的无铅低温焊料包含48-52.5质量％的In和余量的Bi，并且大部分结构由不脆的BiIn2金属间化合物构成。 可以添加Zn或La以进一步提高可焊性，并且可以加入少量的P以防止在高温和高湿度下的腐蚀。

公开(公告)号：US20090301606A1

公开(公告)日：2009-12-10

申请号：US11920962

申请日：2006-05-24

Applicant: Minoru Ueshima

Inventor： Minoru Ueshima

IPC: B23K35/22

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/262 ,  B23K35/362 ,  H05K2201/0215 ,  H05K2201/0257

Abstract: In a conventional Sn—Zn based lead-free solder, Zn crystallized to a large size of several tens of micrometers, and it was difficult to suppress the formation of coarse crystallizates and to increase the bonding strength without changing the soldering temperature. There were alloys which improved strength by the addition of a minute amount of a Group 1B metal, but the alloys had an increased melting temperature so that reflow could not be performed with the same temperature profile as for Sn—Pb, so the alloys had advantages and disadvantages.By using a solder paste formed by mixing an ethanol solution containing nanoparticles having a particle diameter of 5-300 nm and containing at least one of Ag, Au, and Cu with a flux and solder powder for an Sn—Zn based lead-free solder paste, the formation of an alloy of Au, Au, or Cu with Zn occurs during soldering, thereby forming fine clusters in the resulting liquid phase of molten solder, and a fine solder structure is obtained following melting.

Abstract translation: 在常规的Sn-Zn基无铅焊料中，Zn结晶到几十微米的大尺寸，并且难以抑制粗结晶的形成，并且在不改变焊接温度的情况下提高接合强度。 存在通过添加少量1B族金属来提高强度的合金，但是合金具有增加的熔融温度，使得不能以与Sn-Pb相同的温度分布进行回流，因此合金具有优点 和缺点。 通过使用通过将含有粒径为5-300nm并含有Ag，Au和Cu中的至少一种的纳米颗粒的乙醇溶液与用于Sn-Zn基无铅焊料的助焊剂和焊料粉末混合而形成的焊膏 在焊接中发生Au，Au或Cu与Zn的合金的形成，从而在熔融焊料的液相中形成微细的簇，熔融后得到细小的焊料结构。

公开(公告)号：US10354944B2

公开(公告)日：2019-07-16

申请号：US13519217

申请日：2010-12-22

Applicant: Minoru Ueshima ,  Minoru Toyoda

Inventor： Minoru Ueshima ,  Minoru Toyoda

IPC: B23K35/26 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L23/433 ,  H05K3/34

Abstract: A method for soldering a surface-mount component onto a circuit board. The melting of die-bonding solder material is prevented by using a mounting solder material when soldering a surface-mount component formed using the die-bonding solder material onto a printed circuit board. The surface-mount component, formed using (Sn—Sb)-based solder material having high melting point, the (Sn—Sb)-based solder material containing Cu but not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material or (Sn—Ag—Cu—Bi—In)-based solder material as the mounting solder material and with the solder material being applied on the terminal portion. Since solidus temperature of the die-bonding solder material is 243 degrees C. and liquidus temperature of the mounting solder material is about 215 through 220 degrees C., the melting of die-bonding solder material is prevented even at the heating temperature (240 degrees C. or less) of a reflow furnace.

公开(公告)号：US09205513B2

公开(公告)日：2015-12-08

申请号：US13261554

申请日：2011-06-17

Applicant: Minoru Ueshima ,  Yoshimi Inagawa ,  Minoru Toyoda

Inventor： Minoru Ueshima ,  Yoshimi Inagawa ,  Minoru Toyoda

IPC: B23K35/26 ,  B23K1/00 ,  C22C12/00 ,  H05K3/34

CPC classification number: B23K35/264 ,  B23K1/0016 ,  B23K35/26 ,  B23K2101/42 ,  C22C12/00 ,  H05K3/3463 ,  H05K3/3494

Abstract: A high-temperature solder alloy is a Bi—Sn based solder alloy containing at least 90 mass % of Bi, further containing 1-5 mass % of Sn, at least one element selected from Sb and/or Ag each in an amount of 0.5-5 mass %, and preferably further containing 0.0004-0.01 mass % of P.

Abstract translation: 高温焊料合金是含有至少90质量％的Bi的Bi-Sn系焊料合金，进一步含有1-5质量％的Sn，至少一种选自Sb和/或Ag的元素的量为0.5 -5质量％，优选进一步含有0.0004〜0.01质量％的P.

公开(公告)号：US20140112710A1

公开(公告)日：2014-04-24

申请号：US14001561

申请日：2012-02-27

Applicant: Hans-Jurgen Albrecht ,  Klaus Wilke ,  Katsuaki Suganuma ,  Minoru Ueshima

Inventor： Hans-Jurgen Albrecht ,  Klaus Wilke ,  Katsuaki Suganuma ,  Minoru Ueshima

IPC: B23K35/26

CPC classification number: B23K35/262 ,  B23K35/0244 ,  C22C1/02 ,  C22C13/00 ,  C22C13/02 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0263 ,  H05K3/3463 ,  Y10T403/479 ,  H01L2924/00

Abstract: A solder joint which is used in power devices and the like and which can withstand a high current density without developing electromigration is formed of a Sn—Ag—Bi—In based alloy. The solder joint is formed of a solder alloy consisting essentially of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn. The solder alloy may further contain at least one of Ni, Co, and Fe.

Abstract translation: 由Sn-Ag-Bi-In系合金形成用于功率器件等中能够承受高电流密度而不显露电迁移的焊点。 焊点由焊料合金形成，焊料合金主要由Ag组成为2-4质量％，Bi为2-4质量％，In为2-5质量％，Sn为余量。 焊料合金还可以含有Ni，Co，Fe中的至少一种。

公开(公告)号：US20140044479A1

公开(公告)日：2014-02-13

申请号：US13261682

申请日：2012-08-08

Applicant: Minoru Ueshima ,  Rei Fujimaki

Inventor： Minoru Ueshima ,  Rei Fujimaki

IPC: B23K35/26 ,  B23K35/24

CPC classification number: B23K35/262 ,  B23K35/025 ,  B23K35/24 ,  B23K35/28 ,  C22C12/00 ,  C22C13/02 ,  C22C30/02 ,  C22C30/04 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2912 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/351 ,  Y10T403/479 ,  H01L2224/45099 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/013 ,  H01L2924/01028 ,  H01L2924/20107 ,  H01L2924/20106 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A Sn—Sb—Ag—Cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, Sb: 35-40%, Ag: 13-18%, Cu: 6-8%, and a remainder of Sn.

Abstract translation: 提供了具有优异的连接可靠性并且即使在通过缓慢冷却固化时也不形成低熔点相的Sn-Sb-Ag-Cu基高温无铅焊料合金。 其具有以质量％计含有Sb：35-40％，Ag：13-18％，Cu：6-8％，余量为Sn的合金组成。