公开(公告)号：US20230013549A1

公开(公告)日：2023-01-19

申请号：US17782211

申请日：2020-09-25

Applicant: NAMICS CORPORATION

Inventor： Pawel Czubarow ,  Daisuke Hashimoto ,  Yoshitaka Kamata ,  Toshiyuki Sato

IPC: H01C7/10 ,  H01C7/102 ,  H01C17/065

Abstract: Provided are a varistor forming paste, a cured product thereof, and a varistor, that can increase the degree of freedom in designing an electronic device, and can exhibit appropriate varistor characteristics. The varistor forming paste contains an epoxy resin (A), a curing agent (B), and a carbon aerogel (C).

公开(公告)号：US09670377B2

公开(公告)日：2017-06-06

申请号：US14196581

申请日：2014-03-04

Applicant: NAMICS CORPORATION

Inventor： Pawel Czubarow ,  Toshiyuki Sato ,  Tsutomu Masuko

IPC: C08K3/04 ,  C08K3/28 ,  C08L63/00 ,  C09D163/00 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  C08K3/22 ,  C08K3/38 ,  H01L25/065 ,  C08K3/34 ,  C08G59/50

CPC classification number: C09D163/00 ,  C08G59/5033 ,  C08K3/04 ,  C08K3/22 ,  C08K3/28 ,  C08K3/34 ,  C08K3/38 ,  C08K2003/282 ,  C08K2201/003 ,  C08L63/00 ,  H01L21/563 ,  H01L23/295 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0652 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2732 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29294 ,  H01L2224/29387 ,  H01L2224/29391 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/00 ,  H01L2924/05432 ,  H01L2924/0542 ,  H01L2924/0103 ,  H01L2924/0532 ,  H01L2924/01004 ,  H01L2924/05342 ,  H01L2924/01012 ,  H01L2924/0665 ,  H01L2924/0493 ,  H01L2924/01005 ,  H01L2924/05042 ,  H01L2924/05032 ,  H01L2924/014 ,  H01L2924/00014

Abstract: An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.

公开(公告)号：US10141090B2

公开(公告)日：2018-11-27

申请号：US15860136

申请日：2018-01-02

Applicant: NAMICS CORPORATION

Inventor： Yoshitaka Kamata ,  Pawel Czubarow ,  Toshiyuki Sato ,  Takayuki Fujita

IPC: H01C7/105 ,  C08L63/00

Abstract: A resin composition which includes (A) an epoxy resin, (B) a curing agent, and (C) carbon nanotubes, wherein the carbon nanotubes contain therein semiconducting single-walled carbon nanotubes in an amount of 70% by weight or more. A cured product of a paste made from the resin composition can be used to form a varistor element.

公开(公告)号：US11935673B2

公开(公告)日：2024-03-19

申请号：US17782211

申请日：2020-09-25

Applicant: NAMICS CORPORATION

Inventor： Pawel Czubarow ,  Daisuke Hashimoto ,  Yoshitaka Kamata ,  Toshiyuki Sato

IPC: H01C7/10 ,  H01C7/102 ,  H01C17/065

CPC classification number: H01C7/1006 ,  H01C7/102 ,  H01C17/0652 ,  H01C17/06586

Abstract: Provided are a varistor forming paste, a cured product thereof, and a varistor, that can increase the degree of freedom in designing an electronic device, and can exhibit appropriate varistor characteristics. The varistor forming paste contains an epoxy resin (A), a curing agent (B), and a carbon aerogel (C).