公开(公告)号：US10294324B2

公开(公告)日：2019-05-21

申请号：US15562255

申请日：2016-03-28

Applicant: NAMICS CORPORATION

Inventor： Takashi Yamaguchi ,  Shinichi Abe

IPC: C09J9/02 ,  C08G59/56 ,  C08G59/60 ,  C08G73/12 ,  C09J11/06 ,  C09J161/34 ,  C09J163/00 ,  C09J179/04 ,  C08L61/34 ,  C08L63/00 ,  H01L21/288 ,  C09J11/04 ,  C08L79/02

Abstract: There is provided a resin composition which has long-term heat resistance, rapid curing properties, high adhesive strength during heating, a low change ratio of adhesive strength, and a low normal temperature elastic modulus. The resin composition includes (A) a compound having in its molecule an OH group and any one of primary to tertiary amines, (B) dicyandiamide and/or imidazoles, (C) bismaleimides, and (D) a compound having in its molecule one or more epoxy groups, or cyanate ester.