公开(公告)号：US10418737B2

公开(公告)日：2019-09-17

申请号：US16320653

申请日：2017-08-23

Applicant: NSK Ltd.

Inventor： Takashi Sunaga ,  Tadayoshi Osakabe

IPC: H01R13/11 ,  H01R13/04 ,  H01R13/52 ,  H02K5/22 ,  B62D5/04 ,  H02K11/33 ,  H01R13/05

Abstract: A terminal connection component including press-fit terminals and terminal metal-fittings. The press-fit terminals have a plate shape in which a taper is disposed at one tip, and the terminal metal-fittings also have a plate shape in which a fitting section is disposed at one end side. The fitting sections of the terminal metal-fittings have a first hole part and a second hole part from the one end in parallel. The tips of the press-fit terminals are press-fitted and are connected to the fitting sections of the terminal metal-fittings, and a portion between the first hole part and the second hole part of the fitting section, which serves as an elastic deformation section, is elastically deformed in a thickness direction of the press-fit terminal and biases the press-fit terminal so that the press-fit terminals are surely press-fitted to the fitting sections of the terminal metal-fittings.

公开(公告)号：US10249558B2

公开(公告)日：2019-04-02

申请号：US15523478

申请日：2015-11-20

Applicant: NSK Ltd.

Inventor： Shigeru Shimakawa ,  Takashi Sunaga ,  Takaaki Sekine ,  Teruyoshi Kogure ,  Ryoichi Suzuki

IPC: H01L23/495 ,  H02K11/33 ,  B62D5/04 ,  G01R1/20 ,  H01L23/498 ,  H01L49/02 ,  H01L25/07 ,  H01L23/00 ,  H01L23/12 ,  H01L23/36 ,  H01L23/50 ,  H01L23/48 ,  H05K1/18 ,  H05K3/20

Abstract: An electronic heat-dissipating substrate including: lead frames of wiring pattern shapes on a conductor plate; and an insulating member between the lead frames. A plate surface of the lead frames and a top surface of the insulating member form one continuous surface. The part arrangement surface is on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.

公开(公告)号：US10192818B2

公开(公告)日：2019-01-29

申请号：US15516723

申请日：2015-11-20

Applicant: NSK Ltd.

Inventor： Shigeru Simakawa ,  Takashi Sunaga ,  Takaaki Sekine ,  Teruyoshi Kogure ,  Ryoichi Suzuki

IPC: H01L23/50 ,  H01L23/00 ,  H01L23/36 ,  H01L23/12 ,  H01L23/48

Abstract: An electronic part mounting heat-dissipating substrate which includes: a conductor plate which is formed on lead frames of wiring pattern shapes; and an insulating member which is provided between the lead frames of the wiring pattern shapes on the conductor plate; wherein a plate surface of a part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the part arrangement surface form one continuous surface, wherein a plate surface of a back surface of the part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane, wherein the substrate is formed in a circular shape.

公开(公告)号：US09633967B2

公开(公告)日：2017-04-25

申请号：US14910355

申请日：2014-10-06

Applicant: NSK Ltd.

Inventor： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi ,  Ryoichi Suzuki

IPC: H01L29/66 ,  H01L27/08 ,  H01L23/00 ,  H01L25/07 ,  H01L25/18 ,  H01L23/373 ,  H01L23/498 ,  H01L23/492 ,  H01L29/739 ,  H01L29/78

CPC classification number: H01L24/41 ,  H01L23/3735 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L29/7393 ,  H01L29/78 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/2732 ,  H01L2224/29101 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/4001 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4099 ,  H01L2224/4112 ,  H01L2224/73263 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84138 ,  H01L2224/8421 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/9221 ,  H01L2924/00015 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/19105 ,  H01L2924/35121 ,  H01L2924/365 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/291 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/48 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2924/01029 ,  H01L2924/013 ,  H01L2924/00013

Abstract: To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.

公开(公告)号：US10784753B2

公开(公告)日：2020-09-22

申请号：US16617731

申请日：2018-06-01

Applicant: NSK LTD.

Inventor： Shigeru Shimakawa ,  Yuri Shimizu ,  Takashi Sunaga ,  Masakazu Morimoto ,  Ryoichi Suzuki

IPC: H02K11/33 ,  H02K5/10 ,  H02K5/22 ,  H02K9/22 ,  H02K11/00 ,  B62D5/04 ,  H02K11/215

Abstract: An electric drive device and an electric power steering device that reduce temperature increase of a magnetic sensor are provided. The electric drive device includes: an electric motor; an electronic control device including a magnet at an anti-load side end of a shaft to control drive of the electric motor, and a circuit board on the anti-load side of the shaft on an extended line in an axial direction of the shaft; first coil wiring connecting the first coil groups of the electric motor to the circuit board; and second coil wiring connecting the second coil groups of the electric motor to the circuit board. Each of the first and second coil wiring includes a first portion projecting in a direction intersecting the axial direction of the shaft to the outside of the housing, and a second portion projecting outside the housing from the first portion toward the circuit board.

公开(公告)号：US10388596B2

公开(公告)日：2019-08-20

申请号：US15516730

申请日：2015-11-20

Applicant: NSK LTD.

Inventor： Shigeru Shimakawa ,  Takashi Sunaga ,  Takaaki Sekine ,  Teruyoshi Kogure ,  Ryoichi Suzuki

IPC: B62D5/04 ,  G01R1/20 ,  H01C1/14 ,  H05K7/20 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/48 ,  H01L25/07 ,  H02K11/33 ,  H01L23/373 ,  H01L23/495 ,  H01L23/498

Abstract: An electronic part mounting heat-dissipating substrate which includes lead frames of wiring pattern shapes formed by conductor plate and an insulating member 130 which is provided between the lead frames 110, wherein a plate surface of a part arrangement surface of said conductor plate and a top surface of said insulating member at a side of said part arrangement surface form one continuous surface, the lead frames have different thicknesses, the thick lead frame 110H is used for a large current signal and the thin lead frame 110L is used for a small current signal, a plate surface of a back surface of the part arrangement surface and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane.

公开(公告)号：USD853913S1

公开(公告)日：2019-07-16

申请号：US29628617

申请日：2017-12-06

Applicant: NSK LTD.

Designer： Takashi Sunaga ,  Masakazu Morimoto

公开(公告)号：US09402311B2

公开(公告)日：2016-07-26

申请号：US14435686

申请日：2013-10-25

Applicant: NSK Ltd.

Inventor： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC: H05K7/00 ,  H05K1/09 ,  H01L25/07 ,  H01L25/18 ,  H01L23/373 ,  H01L23/498 ,  H01L23/495 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H01L23/00

CPC classification number: H05K1/09 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/48 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/9221 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/05 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10166 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width W1 of the electrode jointing portion in a direction perpendicular to one direction is smaller than the width W2 of the substrate jointing portion in the direction perpendicular to the one direction.

Abstract translation: 半导体模块包括通过焊料将形成在裸芯片晶体管的顶表面上的电极和多个布线图案中的布线图案连接的铜连接器。 铜连接器包括连接到裸芯片晶体管的电极的电极接合部分和布置成面对电极接合部分并且接合到布线图案的基板接合部分。 电极接合部在与一个方向垂直的方向上的宽度W1小于基板接合部在垂直于该一个方向的方向上的宽度W2。

公开(公告)号：US09318821B2

公开(公告)日：2016-04-19

申请号：US14401887

申请日：2014-01-15

Applicant: NSK LTD.

Inventor： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC: H05K1/00 ,  H01R12/52 ,  H01R13/405 ,  H01R43/24 ,  H01R12/58 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/24 ,  H01R107/00

CPC classification number: H01R12/523 ,  H01R12/58 ,  H01R13/405 ,  H01R43/24 ,  H01R2107/00 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/042 ,  H05K2201/1028 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10522

Abstract: A multipolar connector is provided. It is possible to prevent deformation of a particular pin-shaped terminal of plural pin-shaped terminals arranged in a line in a direction perpendicular to a connection direction of the multipolar connector, and also possible to prevent positional displacements of the particular pin-shaped terminal and other pin-shaped terminals. The multipolar connector (101) includes plural pin-shaped terminals (110) arranged in a line in a direction (arrow X direction) perpendicular to a connection direction (arrow Y direction) of the multipolar connector to extend in the connection direction, and a hold member (120) configured to extend in the direction perpendicular to the connection direction and hold the plural pin-shaped terminals (110) at a predefined pitch.

Abstract translation: 提供多极连接器。 可以防止在垂直于多极连接器的连接方向的方向上排列成一行的多个销状端子的特定销状端子的变形，并且还可以防止特定销状端子的位置偏移 和其他针形端子。 多极连接器（101）包括沿垂直于多极连接器的连接方向（箭头Y方向）的方向（箭头X方向）排成一列的多个销状端子110，该连接方向在连接方向上延伸， 保持构件（120），其构造成在垂直于连接方向的方向上延伸，并以预定的间距保持多个销状端子（110）。

公开(公告)号：US20150270199A1

公开(公告)日：2015-09-24

申请号：US14435690

申请日：2013-10-25

Applicant: NSK LTD.

Inventor： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC: H01L23/495

CPC classification number: H01L23/49551 ,  B62D5/0406 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40106 ,  H01L2224/40159 ,  H01L2224/40225 ,  H01L2224/4103 ,  H01L2224/41175 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84095 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/15724 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/1305 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor module is provided for shortening a manufacturing tact time, reducing manufacturing costs and for ensuring reliability of a bonding portion. The semiconductor module includes a substrate formed of a metal, an insulating layer formed on the substrate, a plurality of wiring patterns formed on the insulating layer, a bare-chip transistor mounted on one wiring pattern via a solder, and copper connectors that connect electrodes formed on the bear-chip transistor and other wiring patterns via a solder. The copper connectors have a bridge shape, have a width-reduced portion formed in the vicinity of the bonding face to the electrodes, and have a stress-reducing portion formed on the bonding face bonded to the electrode.

Abstract translation: 提供了一种半导体模块，用于缩短制造节拍时间，降低制造成本并确保结合部的可靠性。 半导体模块包括由金属形成的基板，形成在基板上的绝缘层，形成在绝缘层上的多个布线图案，通过焊料安装在一个布线图案上的裸芯片晶体管和连接电极的铜连接器 通过焊料形成在承载芯片晶体管和其它布线图案上。 铜连接器具有桥接形状，在与电极的接合面附近形成有宽度减小部，并且在与电极接合的接合面上形成有应力减小部。