公开(公告)号：US20220199528A1

公开(公告)日：2022-06-23

申请号：US17128597

申请日：2020-12-21

Applicant: NVIDIA Corp.

Inventor： Jacky Qiu ,  Martin Ding ,  Jerry Zhou ,  Minto Zheng

IPC: H01L23/528 ,  H01L23/14 ,  H01L23/367 ,  H01L23/522 ,  H05K7/20 ,  H05K1/11 ,  H05K1/02

Abstract: A semiconductor assembly is described that includes a substrate having top and bottom sides. An integrated circuit die coupled to the substrate includes first and second distinct sets of ground pads. In some embodiments, the first and second sets of ground pads are configured to have distinct ground return paths to a host system. In further embodiments, one of the ground return paths may include a metal plate coupled between ground contacts on the top side of the substrate and ground contacts on a printed circuit board of the host system.

公开(公告)号：US11616019B2

公开(公告)日：2023-03-28

申请号：US17128597

申请日：2020-12-21

Applicant: NVIDIA Corp.

Inventor： Jacky Qiu ,  Martin Ding ,  Jerry Zhou ,  Minto Zheng

IPC: H01L23/13 ,  H01L23/14 ,  H01L23/42 ,  H01L23/60 ,  H01L23/66 ,  H01L23/367 ,  H01L25/16 ,  H01L25/18 ,  H01L23/528 ,  H05K1/02 ,  H05K7/20 ,  H05K1/11 ,  H01L23/522

Abstract: A semiconductor assembly is described that includes a substrate having top and bottom sides. An integrated circuit die coupled to the substrate includes first and second distinct sets of ground pads. In some embodiments, the first and second sets of ground pads are configured to have distinct ground return paths to a host system. In further embodiments, one of the ground return paths may include a metal plate coupled between ground contacts on the top side of the substrate and ground contacts on a printed circuit board of the host system.