公开(公告)号：US11769040B2

公开(公告)日：2023-09-26

申请号：US16517431

申请日：2019-07-19

Applicant: NVIDIA Corp.

Inventor： Yakun Shao ,  Rangharajan Venkatesan ,  Nan Jiang ,  Brian Matthew Zimmer ,  Jason Clemons ,  Nathaniel Pinckney ,  Matthew R Fojtik ,  William James Dally ,  Joel S. Emer ,  Stephen W. Keckler ,  Brucek Khailany

IPC: G06F7/02 ,  G06N3/049 ,  G06F9/445 ,  G06F9/54 ,  G06N3/082

CPC classification number: G06N3/049 ,  G06F9/44505 ,  G06F9/544 ,  G06N3/082

Abstract: A distributed deep neural net (DNN) utilizing a distributed, tile-based architecture implemented on a semiconductor package. The package includes multiple chips, each with a central processing element, a global memory buffer, and processing elements. Each processing element includes a weight buffer, an activation buffer, and multiply-accumulate units to combine, in parallel, the weight values and the activation values.

公开(公告)号：US20200082246A1

公开(公告)日：2020-03-12

申请号：US16517431

申请日：2019-07-19

Applicant: NVIDIA Corp.

Inventor： Yakun Shao ,  Rangharajan Venkatesan ,  Nan Jiang ,  Brian Matthew Zimmer ,  Jason Clemons ,  Nathaniel Pinckney ,  Matthew R. Fojtik ,  William James Dally ,  Joel S. Emer ,  Stephen W. Keckler ,  Brucek Khailany

IPC: G06N3/04 ,  G06N3/08 ,  G06F9/54 ,  G06F9/445

Abstract: A distributed deep neural net (DNN) utilizing a distributed, tile-based architecture implemented on a semiconductor package. The package includes multiple chips, each with a central processing element, a global memory buffer, and processing elements. Each processing element includes a weight buffer, an activation buffer, and multiply-accumulate units to combine, in parallel, the weight values and the activation values.