公开(公告)号：US12287538B2

公开(公告)日：2025-04-29

申请号：US17820673

申请日：2022-08-18

Applicant: Nokia Solutions and Networks Oy

Inventor： Ruizhi Shi ,  Ari Novack ,  Alexander Rylyakov ,  Eu-Jin Andy Lim

IPC: G02F1/035 ,  G02B6/12 ,  G02F1/21

Abstract: An apparatus includes a lithium niobate (LN) layer, and a planar electro-optical modulator having at least one hybrid optical core segment formed of a portion of the LN layer and an optical guiding rib. The optical guiding rib may be located in a top silicon layer of a silicon photonics (SiP) chip, to which a thin-film LN chip is flip-chip mounted, and may be coupled to optical waveguide cores in a first silicon core layer of the SiP chip. One or more drive electrodes are disposed between a substrate of the SiP chip and the LN layer. In some embodiments hybrid optical core segments may include silicon nitride core segments and may form an MZM configured to be differentially or dual-differentially driven.

公开(公告)号：US11280971B2

公开(公告)日：2022-03-22

申请号：US16988890

申请日：2020-08-10

Applicant: Nokia Solutions and Networks Oy

Inventor： Ari Novack

IPC: G02B6/42

Abstract: An underfill adhesive may be used to mechanically stabilize a photonic integrated circuit chip (PIC) onto an electrical substrate; however, when the PIC is optically coupled to an external optical fiber at or near an edge of the chip, e.g. using an edge coupler, the underfill may flow into the optical interface impacting optical coupling quality. A photonic integrated circuit apparatus according to the disclosure comprises an electrical substrate, which includes a cavity underneath the edge coupler for preventing underfill material from entering the optical interface by impeding capillary action thereof.