Nanoscale Interconnects Fabricated by Electrical Field Directed Assembly of Nanoelements
    2.
    发明申请
    Nanoscale Interconnects Fabricated by Electrical Field Directed Assembly of Nanoelements 有权
    纳米级互连器件由电场制造,纳米元件组装

    公开(公告)号:US20150371900A1

    公开(公告)日:2015-12-24

    申请号:US14837227

    申请日:2015-08-27

    Abstract: The invention provides a fast, scalable, room temperature process for fabricating metallic nanorods from nanoparticles or fabricating metallic or semiconducting nanorods from carbon nanotubes suspended in an aqueous solution. The assembled nanorods are suitable for use as nanoscale interconnects in CMOS-based devices and sensors. Metallic nanoparticles or carbon nanotubes are assembled into lithographically patterned vias by applying an external electric field. Since the dimensions of nanorods are controlled by the dimensions of vias, the nanorod dimensions can be scaled down to the low nanometer range. The aqueous assembly process is environmentally friendly and can be used to make nanorods using different types of metallic particles as well as semiconducting and metallic nanotubes.

    Abstract translation: 本发明提供了用于从纳米颗粒制造金属纳米棒的快速,可扩展的室温工艺,或者从悬浮在水溶液中的碳纳米管制造金属或半导体纳米棒。 组装的纳米棒适合用作基于CMOS的器件和传感器中的纳米级互连。 通过施加外部电场将金属纳米颗粒或碳纳米管组装成光刻图案化的通孔。 由于纳米棒的尺寸由通孔的尺寸控制,纳米棒尺寸可以缩小到低纳米范围。 水性组合方法是环境友好的,并且可以用于制备使用不同类型的金属颗粒以及半导体和金属纳米管的纳米棒。

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