公开(公告)号：US10193004B2

公开(公告)日：2019-01-29

申请号：US15509491

申请日：2015-10-19

Applicant: Orbotech Ltd.

Inventor： Michael Zenou ,  Zvi Kotler

IPC: H01L31/05 ,  H01L31/0224 ,  H05K3/14 ,  H01L21/48 ,  H01L21/285 ,  B23K26/00 ,  C23C14/04 ,  C23C14/28

Abstract: A method for metallization includes providing a transparent donor substrate (34) having deposited thereon a donor film (36) including a metal with a thickness less than 2 pm. The donor substrate is positioned in proximity to an acceptor substrate (22) including a semiconductor material with the donor film facing toward the acceptor substrate and with a gap of at least 0.1 mm between the donor film and the acceptor substrate. A train of laser pulses, having a pulse duration less than 2 ns, is directed to impinge on the donor substrate so as to cause droplets (44) of the metal to be ejected from the donor layer and land on the acceptor substrate, thereby forming a circuit trace (25) in ohmic contact with the semiconductor material.

公开(公告)号：US20170306495A1

公开(公告)日：2017-10-26

申请号：US15644857

申请日：2017-07-10

Applicant: ORBOTECH LTD.

Inventor： Zvi Kotler ,  Michael Zenou

IPC: C23C18/14

Abstract: An apparatus for material deposition on an acceptor surface includes a transparent donor substrate having opposing first and second surfaces, such that at least a part of the second surface is not parallel to the acceptor surface, and including a donor film on the second surface. The apparatus additionally includes an optical assembly, which is configured to direct a beam of radiation to pass through the first surface of the donor substrate and impinge on the donor film at a location on the part of the second surface that is not parallel to the acceptor surface, so as to induce ejection of droplets of molten material from the donor film onto the acceptor surface.

公开(公告)号：US20150382476A1

公开(公告)日：2015-12-31

申请号：US14766749

申请日：2014-02-18

Applicant: ORBOTECH LTD.

Inventor： Michael Zenou ,  Marc Altman ,  Claudio Rottman ,  Zvi Kotler

IPC: H05K3/12 ,  H05K3/22

CPC classification number: H05K3/12 ,  G03F7/039 ,  G03F7/40 ,  H05K1/097 ,  H05K3/02 ,  H05K3/027 ,  H05K3/1283 ,  H05K3/1291 ,  H05K3/227 ,  H05K2201/0257 ,  H05K2201/2054 ,  H05K2203/0514 ,  H05K2203/107 ,  H05K2203/108 ,  H05K2203/111 ,  H05K2203/1131 ,  H05K2203/1194 ,  H05K2203/1476 ,  H05K2203/1484

Abstract: A method for manufacturing includes coating a substrate (22) with a matrix (28) containing a material to be patterned on the substrate. A pattern (42) is fixed in the matrix by directing an energy beam to impinge on the coated substrate so as to fix the pattern in the matrix without fully sintering the pattern. The matrix remaining on the substrate outside the fixed pattern is removed, and after removing the matrix, the material in the pattern is sintered.

Abstract translation: 一种制造方法包括用在衬底上含有要图案化的材料的基体（28）涂覆衬底（22）。 通过将能量束引导到涂覆的基底上以将图案固定在基体中而不完全烧结图案，将图案（42）固定在矩阵中。 除去残留在固定图案外的基板上的基体，在除去基体之后，将图案中的材料烧结。

公开(公告)号：US11881466B2

公开(公告)日：2024-01-23

申请号：US16495112

申请日：2018-04-26

Applicant: ORBOTECH LTD.

Inventor： Michael Zenou ,  Zvi Kotler ,  Ofer Fogel

IPC: H01L23/00 ,  H01L21/48

CPC classification number: H01L24/19 ,  H01L21/4846 ,  H01L24/73 ,  H01L24/76 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/73259 ,  H01L2224/76158 ,  H01L2224/82103

Abstract: A method for producing electronic devices includes fixing a die that includes an electronic component with integral contacts to a dielectric substrate. After fixing the die, a conductive trace is printed over both the dielectric substrate and at least one of the integral contacts, so as to create an ohmic connection between the conductive trace on the substrate and the electronic component.

公开(公告)号：US10471538B2

公开(公告)日：2019-11-12

申请号：US15738134

申请日：2016-06-07

Applicant: Orbotech Ltd.

Inventor： Michael Zenou ,  Zvi Kotler

IPC: B23K26/064 ,  B23K26/067 ,  C23C14/22 ,  C23C14/28 ,  B23K26/34 ,  B23K26/342 ,  B23K26/0622 ,  B23K26/57 ,  B23K26/06 ,  G03F7/16 ,  B23K101/42

Abstract: An apparatus for material deposition on an acceptor surface includes a transparent donor substrate having opposing first and second surfaces, and a donor film on the second surface. The apparatus additionally includes an optical assembly, which is configured to direct a beam of radiation to pass through the first surface of the donor substrate and impinge on the donor film at a location on the second surface so as to induce ejection of droplets of molten material from the donor film at an angle that is not normal to the second surface at the location onto the acceptor surface.

公开(公告)号：US10015887B2

公开(公告)日：2018-07-03

申请号：US14766749

申请日：2014-02-18

Applicant: ORBOTECH LTD.

Inventor： Michael Zenou ,  Marc Altman ,  Claudio Rottman ,  Zvi Kotler

IPC: H05K3/12 ,  G03F7/40 ,  H05K3/02 ,  G03F7/039 ,  H05K3/22 ,  H05K1/09

CPC classification number: H05K3/12 ,  G03F7/039 ,  G03F7/40 ,  H05K1/097 ,  H05K3/02 ,  H05K3/027 ,  H05K3/1283 ,  H05K3/1291 ,  H05K3/227 ,  H05K2201/0257 ,  H05K2201/2054 ,  H05K2203/0514 ,  H05K2203/107 ,  H05K2203/108 ,  H05K2203/111 ,  H05K2203/1131 ,  H05K2203/1194 ,  H05K2203/1476 ,  H05K2203/1484

Abstract: A method for manufacturing includes coating a substrate (22) with a matrix (28) containing a material to be patterned on the substrate. A pattern (42) is fixed in the matrix by directing an energy beam to impinge on the coated substrate so as to fix the pattern in the matrix without fully sintering the pattern. The matrix remaining on the substrate outside the fixed pattern is removed, and after removing the matrix, the material in the pattern is sintered.

公开(公告)号：US20170365484A1

公开(公告)日：2017-12-21

申请号：US15537885

申请日：2016-01-14

Applicant: ORBOTECH LTD.

Inventor： Zvi Kotler ,  Michael Zenou

IPC: H01L21/3063 ,  H01L21/428 ,  C25F3/12 ,  C23C26/02 ,  C23C14/30 ,  H01L21/48 ,  C23C14/04

CPC classification number: H01L21/3063 ,  B22F3/1055 ,  B22F3/1103 ,  B22F5/10 ,  B22F2003/1056 ,  B22F2003/1058 ,  B22F2005/103 ,  B22F2999/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y80/00 ,  C23C14/048 ,  C23C14/28 ,  C23C14/30 ,  C23C26/00 ,  C23C26/02 ,  C25F3/12 ,  H01L21/428 ,  H01L21/4867 ,  Y02P10/295 ,  C23F1/00 ,  B22F2207/17

Abstract: A method for 3D printing includes printing a first metallic material on a substrate as a support structure (48). A second metallic material, which is less anodic than the first metallic material, is printed on the substrate as a target structure (46), in contact with the support structure. The support structure is chemically removed from the target structure by applying a galvanic effect to selectively corrode the first metallic material.

公开(公告)号：US11464114B2

公开(公告)日：2022-10-04

申请号：US17174337

申请日：2021-02-11

Applicant: Orbotech Ltd.

Inventor： Zvi Kotler ,  Michael Zenou

IPC: B23P19/00 ,  H05K3/02 ,  H05K1/09 ,  H05K3/26 ,  H05K3/22 ,  H05K3/12 ,  H05K3/00

Abstract: A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

公开(公告)号：US11271119B2

公开(公告)日：2022-03-08

申请号：US16194407

申请日：2018-11-19

Applicant: Orbotech Ltd.

Inventor： Michael Zenou ,  Zvi Kotler

IPC: H01L31/0224 ,  H05K3/14 ,  H01L21/48 ,  H01L21/285 ,  C23C14/04 ,  C23C14/28 ,  B23K26/34 ,  B23K26/0622 ,  B23K26/12 ,  B23K26/00 ,  B23K26/08 ,  B23K103/00 ,  B23K101/40 ,  H01L31/05

Abstract: A method for metallization includes providing a transparent donor substrate (34) having deposited thereon a donor film (36) including a metal with a thickness less than 2 μm. The donor substrate is positioned in proximity to an acceptor substrate (22) including a semiconductor material with the donor film facing toward the acceptor substrate and with a gap of at least 0.1 mm between the donor film and the acceptor substrate. A train of laser pulses, having a pulse duration less than 2 ns, is directed to impinge on the donor substrate so as to cause droplets (44) of the metal to be ejected from the donor layer and land on the acceptor substrate, thereby forming a circuit trace (25) in ohmic contact with the semiconductor material.

公开(公告)号：US20180281243A1

公开(公告)日：2018-10-04

申请号：US15763451

申请日：2016-11-01

Applicant: Orbotech Ltd.

Inventor： Michael Zenou ,  Zvi Kotler

IPC: B29C41/08 ,  B22C9/00 ,  B22D23/00 ,  B22D29/00 ,  B29C41/46 ,  B29C41/42 ,  B29C37/00

CPC classification number: B29C41/08 ,  B22C9/00 ,  B22D23/003 ,  B22D29/00 ,  B29C33/38 ,  B29C37/0025 ,  B29C41/42 ,  B29C41/46 ,  G03F7/0002

Abstract: A method for fabrication includes providing a substrate having an upper surface with pattern of one or more recesses formed therein. A laser beam is directed to impinge on a donor film so as to eject droplets of a fluid from the donor film by laser-induced forward transfer (LIFT) into the one or more recesses. The fluid hardens within the one or more recesses to form a solid piece having a shape defined by the one or more recesses. The substrate is removed from the solid piece. In some embodiments, the recesses are coated with a thin-film layer before ejecting the droplets into the recesses, such that the thin-film layer remains as an outer surface of the solid piece after removing the substrate