LIGHTING DEVICE WITH OPTOELECTRONIC LIGHT SOURCE
    2.
    发明申请
    LIGHTING DEVICE WITH OPTOELECTRONIC LIGHT SOURCE 有权
    具有光电光源的照明设备

    公开(公告)号:US20160010828A1

    公开(公告)日:2016-01-14

    申请号:US14793765

    申请日:2015-07-08

    Applicant: OSRAM GmbH

    CPC classification number: F21V5/008 F21V5/046 F21V7/0066 F21V13/04 F21Y2115/10

    Abstract: Various embodiments relate to a lighting device with an optoelectronic light source, an optical body downstream thereof for distributing the light, and a diffuser downstream of the latter, onto the light entry surface of which the light emitted by the optical body falls and the light exit surface of which represents a light emission surface of the lighting device. To homogenize the luminous intensity on the light exit surface, in addition to distributing the light with the optical body, the diffuser is not provided to be uniformly scattering to such an extent that light falling thereon in a central region is scattered more intensely than light falling thereon in an edge region.

    Abstract translation: 各种实施例涉及具有光电子光源的照明装置,用于将光分配的下游的光学体以及后者的下游的漫射器到光入射面的光入射面上,光入射面落在光入射面上,光出射口 其表面表示照明装置的发光表面。 为了均匀化光出射面上的发光强度,除了将光与光学体分配之外,漫射器不能均匀地散射到这样的程度,即在中心区域落在其上的光比光的下落更强地散射 在边缘区域上。

    LED module
    3.
    发明授权
    LED module 有权
    LED模块

    公开(公告)号:US09414447B2

    公开(公告)日:2016-08-09

    申请号:US14133747

    申请日:2013-12-19

    Applicant: OSRAM GmbH

    CPC classification number: H05B33/0803

    Abstract: In various embodiments, a light emitting diode module may include a carrier plate, at least one light emitting diode, and at least one sensor configured to register light emitted by the light emitting diode. The light emitting diode is attached to a light emitting diode installation side of the carrier plate. The sensor is installed countersunk through a hole of the carrier plate in relation to the light emitting diode installation side thereof.

    Abstract translation: 在各种实施例中,发光二极管模块可以包括载体板,至少一个发光二极管,以及配置成对发光二极管发射的光进行配准的至少一个传感器。 发光二极管连接到载板的发光二极管安装侧。 传感器相对于其发光二极管安装侧通过承载板的孔安装埋头。

    LIGHTING UNIT HAVING A PLURALITY OF LIGHT EMITTING DIODES
    5.
    发明申请
    LIGHTING UNIT HAVING A PLURALITY OF LIGHT EMITTING DIODES 有权
    具有多个发光二极管的照明单元

    公开(公告)号:US20150233561A1

    公开(公告)日:2015-08-20

    申请号:US14621410

    申请日:2015-02-13

    Applicant: OSRAM GmbH

    Abstract: In various embodiments, a lighting unit is provided. The lighting unit may include a hollow body made of a plastics material as a substrate, which hollow body has an outer surface and an opposite inner surface, wherein the latter at least partially delimits a hollow body internal volume, a plurality of light emitting diodes, which are arranged on the outer surface of the hollow body, and a conductor track structure, which is electrically conductively connected to the light emitting diodes. The conductor track structure is arranged on the inner surface of the hollow body, and the electrically conductive connection to the light emitting diodes is produced by through-contacts, which are passed through the plastics material.

    Abstract translation: 在各种实施例中,提供照明单元。 照明单元可以包括由作为基底的塑料材料制成的中空体,该空心体具有外表面和相对的内表面,其中后者至少部分地限定中空体内部体积,多个发光二极管, 其布置在中空体的外表面上,导体轨道结构与导电连接到发光二极管。 导体轨道结构布置在中空体的内表面上,并且与发光二极管的导电连接通过通过塑料材料的通孔产生。

    LED MODULE
    6.
    发明申请
    LED MODULE 有权
    LED模块

    公开(公告)号:US20140191255A1

    公开(公告)日:2014-07-10

    申请号:US14133747

    申请日:2013-12-19

    Applicant: OSRAM GmbH

    CPC classification number: H05B33/0803

    Abstract: In various embodiments, a light emitting diode module may include a carrier plate, at least one light emitting diode, and at least one sensor configured to register light emitted by the light emitting diode. The light emitting diode is attached to a light emitting diode installation side of the carrier plate. The sensor is installed countersunk through a hole of the carrier plate in relation to the light emitting diode installation side thereof.

    Abstract translation: 在各种实施例中,发光二极管模块可以包括载体板,至少一个发光二极管,以及配置成对发光二极管发射的光进行配准的至少一个传感器。 发光二极管连接到载板的发光二极管安装侧。 传感器相对于其发光二极管安装侧通过承载板的孔安装埋头。

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