公开(公告)号：US09559266B2

公开(公告)日：2017-01-31

申请号：US14786573

申请日：2014-04-07

Applicant: OSRAM GmbH

Inventor： Ralph Wirth ,  Axel Kaltenbacher

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/52 ,  H01L33/62 ,  H01L23/00 ,  H01L25/075 ,  H01L33/50

CPC classification number: H01L33/483 ,  H01L24/19 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/505 ,  H01L33/52 ,  H01L33/62 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: The invention relates to an illumination device (1) specifically a packaged LED (2), which is embedded in a casing body leaving the bottom side of the LED (2) exposed; on the bottom side, a contacting element (7) is vacuum deposited onto the LED (2), which contacting element protrudes laterally above the LED (2) and allows on a macroscopic level for an electric contacting of the LED (2), namely by connection of flat surfaces, such as welding.

Abstract translation: 本发明涉及一种照明装置（1），特别是封装的LED（2），其被嵌入到暴露于LED（2）的底侧的壳体中; 在底侧上，将接触元件（7）真空沉积到LED（2）上，该接触元件横向于LED（2）上方突出，并且在宏观水平上允许LED（2）的电接触，即 通过连接平面等焊接。

公开(公告)号：US20160087161A1

公开(公告)日：2016-03-24

申请号：US14786573

申请日：2014-04-07

Applicant: OSRAM GMBH

Inventor： Ralph Wirth ,  Axel Kaltenbacher

IPC: H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L33/52

CPC classification number: H01L33/483 ,  H01L24/19 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/505 ,  H01L33/52 ,  H01L33/62 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: The invention relates to an illumination device (1) specifically a packaged LED (2), which is embedded in a casing body leaving the bottom side of the LED (2) exposed; on the bottom side, a contacting element (7) is vacuum deposited onto the LED (2), which contacting element protrudes laterally above the LED (2) and allows on a macroscopic level for an electric contacting of the LED (2), namely by connection of flat surfaces, such as welding.

Abstract translation: 本发明涉及一种照明装置（1），特别是封装的LED（2），其被嵌入到暴露于LED（2）的底侧的壳体中; 在底侧上，将接触元件（7）真空沉积到LED（2）上，该接触元件横向于LED（2）上方突出，并且在宏观水平上允许LED（2）的电接触，即 通过连接平面等焊接。

公开(公告)号：US20150014711A1

公开(公告)日：2015-01-15

申请号：US14371739

申请日：2013-01-08

Applicant: OSRAM GmbH

Inventor： Krister Bergenek ,  Ralph Wirth ,  Axel Kaltenbacher ,  Andreas Biebersdorf ,  Joerg Sorg ,  Christine Maier ,  Harald Jaeger ,  Gertrud Kraeuter ,  Frank Jermann ,  Stefan Lange

IPC: H01L33/56 ,  H01L33/40 ,  H01L33/50

CPC classification number: H01L33/56 ,  H01L33/40 ,  H01L33/483 ,  H01L33/502 ,  H01L33/507

Abstract: Various embodiments relate to an optoelectronic component, including a carrier element, on which at least one optoelectronic semiconductor chip is arranged, and a cover, which is mounted on the carrier element in a region extending circumferentially around the semiconductor chip and together with the carrier element forms a sealed cavity in which the at least one optoelectronic semiconductor chip is arranged in an inert gas.

Abstract translation: 各种实施例涉及包括至少一个光电子半导体芯片布置在其上的载体元件的光电子部件，以及覆盖件，该盖子以围绕半导体芯片周向延伸的区域并与载体元件一起安装在载体元件上 形成密封空腔，其中所述至少一个光电半导体芯片布置在惰性气体中。

公开(公告)号：US20160225747A1

公开(公告)日：2016-08-04

申请号：US15021952

申请日：2014-08-22

Applicant: OSRAM GMBH

Inventor： Farhang Ghasemi Afshar ,  Axel Kaltenbacher

IPC: H01L25/075 ,  H01L33/64 ,  H01L33/48

CPC classification number: H01L25/0753 ,  H01L33/483 ,  H01L33/62 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

Abstract: Various embodiments may relate to a lighting module which is equipped with several semiconductor light sources, in particular LED-chips and includes a metallic carrier plate. Several metallic carrier substrates are arranged on the carrier plate and are electrically insulated therefrom. At least one semiconductor light source is arranged on the carrier substrates and the carrier substrates are electrically connected in series.

Abstract translation: 各种实施例可以涉及配备有几个半导体光源，特别是LED芯片并且包括金属载体板的照明模块。 几个金属载体基板布置在载体板上并与其电绝缘。 至少一个半导体光源被布置在载体基板上，并且载体基板串联电连接。

公开(公告)号：US09659915B2

公开(公告)日：2017-05-23

申请号：US15021952

申请日：2014-08-22

Applicant: OSRAM GmbH

Inventor： Farhang Ghasemi Afshar ,  Axel Kaltenbacher

IPC: H05B33/08 ,  H01L25/075 ,  H01L33/48 ,  H01L33/64 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/483 ,  H01L33/62 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

Abstract: Various embodiments may relate to a lighting module which is equipped with several semiconductor light sources, in particular LED-chips and includes a metallic carrier plate. Several metallic carrier substrates are arranged on the carrier plate and are electrically insulated therefrom. At least one semiconductor light source is arranged on the carrier substrates and the carrier substrates are electrically connected in series.

公开(公告)号：US09640739B2

公开(公告)日：2017-05-02

申请号：US14371739

申请日：2013-01-08

Applicant: OSRAM GmbH

Inventor： Krister Bergenek ,  Ralph Wirth ,  Axel Kaltenbacher ,  Andreas Biebersdorf ,  Joerg Sorg ,  Christine Maier ,  Harald Jaeger ,  Gertrud Kraeuter ,  Frank Jermann ,  Stefan Lange

IPC: H01L29/18 ,  H01L33/56 ,  H01L33/40 ,  H01L33/48 ,  H01L33/50

CPC classification number: H01L33/56 ,  H01L33/40 ,  H01L33/483 ,  H01L33/502 ,  H01L33/507

Abstract: Various embodiments relate to an optoelectronic component, including a carrier element, on which at least one optoelectronic semiconductor chip is arranged, and a cover, which is mounted on the carrier element in a region extending circumferentially around the semiconductor chip and together with the carrier element forms a sealed cavity in which the at least one optoelectronic semiconductor chip is arranged in an inert gas.

公开(公告)号：US20140367708A1

公开(公告)日：2014-12-18

申请号：US14363321

申请日：2012-12-07

Applicant: OSRAM GmbH

Inventor： Joerg Sorg ,  Axel Kaltenbacher ,  Andreas Biebersdorf

IPC: H01L25/075

CPC classification number: H01L25/0753 ,  H01L25/0756 ,  H01L33/56 ,  H01L2224/48137

Abstract: A light-emitting diode arrangement may include a first layer structure including at least one epitaxially formed light-emitting diode, and at least one second layer structure including at least one epitaxially formed light-emitting diode, wherein the at least one second layer structure is arranged on the first layer structure, and wherein contact faces of the at least one epitaxially formed light-emitting diode in the respective layer structure face contact faces of the at least one epitaxially formed light-emitting diode of the layer structure arranged directly therebelow or thereabove.

Abstract translation: 发光二极管装置可以包括包括至少一个外延形成的发光二极管的第一层结构和包括至少一个外延形成的发光二极管的至少一个第二层结构，其中至少一个第二层结构是 布置在第一层结构上，并且其中各层结构中的至少一个外延形成的发光二极管的接触面面向直接在其下方或上方布置的层结构的至少一个外延形成的发光二极管的接触面 。