公开(公告)号：US09414447B2

公开(公告)日：2016-08-09

申请号：US14133747

申请日：2013-12-19

Applicant: OSRAM GmbH

Inventor： Farhang Ghasemi Afshar ,  Krister Bergenek ,  Andreas Dobner ,  Holger Huebner ,  Meik Weckbecker ,  Ralph Wirth

IPC: H01L33/52 ,  H01L33/44 ,  H01L23/522 ,  F21V33/00 ,  H05B33/08

CPC classification number: H05B33/0803

Abstract: In various embodiments, a light emitting diode module may include a carrier plate, at least one light emitting diode, and at least one sensor configured to register light emitted by the light emitting diode. The light emitting diode is attached to a light emitting diode installation side of the carrier plate. The sensor is installed countersunk through a hole of the carrier plate in relation to the light emitting diode installation side thereof.

Abstract translation: 在各种实施例中，发光二极管模块可以包括载体板，至少一个发光二极管，以及配置成对发光二极管发射的光进行配准的至少一个传感器。 发光二极管连接到载板的发光二极管安装侧。 传感器相对于其发光二极管安装侧通过承载板的孔安装埋头。

公开(公告)号：US20140191255A1

公开(公告)日：2014-07-10

申请号：US14133747

申请日：2013-12-19

Applicant: OSRAM GmbH

Inventor： Farhang Ghasemi Afshar ,  Krister Bergenek ,  Andreas Dobner ,  Holger Huebner ,  Meik Weckbecker ,  Ralph Wirth

IPC: H01L31/12

CPC classification number: H05B33/0803

Abstract: In various embodiments, a light emitting diode module may include a carrier plate, at least one light emitting diode, and at least one sensor configured to register light emitted by the light emitting diode. The light emitting diode is attached to a light emitting diode installation side of the carrier plate. The sensor is installed countersunk through a hole of the carrier plate in relation to the light emitting diode installation side thereof.

Abstract translation: 在各种实施例中，发光二极管模块可以包括载体板，至少一个发光二极管，以及配置成对发光二极管发射的光进行配准的至少一个传感器。 发光二极管连接到载板的发光二极管安装侧。 传感器相对于其发光二极管安装侧通过承载板的孔安装埋头。