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公开(公告)号:US20160260874A1
公开(公告)日:2016-09-08
申请号:US15058180
申请日:2016-03-02
Applicant: OSRAM GmbH
Inventor: Martin Reiss
IPC: H01L33/58 , H01L25/075 , H01L33/54
CPC classification number: H01L33/0095 , H01L33/56 , H01L2933/005 , H01L2933/0058 , H01L2933/0091
Abstract: A method for producing a lighting module is provided. The method includes providing a light source substrate populated with at least one semiconductor light source, laterally surrounding the at least one semiconductor light source by a wall, applying at least one prefabricated diffuser element to at least one semiconductor light source, introducing potting compound into the space surrounded by the wall up to a height at which both the at least one semiconductor light source, and potting at least part of the at least one diffuser element.
Abstract translation: 提供了一种制造照明模块的方法。 该方法包括提供一个填充有至少一个半导体光源的光源基片,通过一个壁横向包围该至少一个半导体光源,将至少一个预制漫射元件应用于至少一个半导体光源,将封装化合物引入到 空间被壁围绕直至至少一个半导体光源的高度,并且灌封至少一个扩散器元件的至少一部分。
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公开(公告)号:US20130209675A1
公开(公告)日:2013-08-15
申请号:US13753643
申请日:2013-01-30
Applicant: OSRAM GMBH
Inventor: Martin Reiss
IPC: B05D5/06
CPC classification number: B05D5/06 , H01L33/505 , H01L33/507 , H01L2933/0041
Abstract: A method for producing a plate admixed with phosphor for a remote phosphor light source may include: a) providing a base layer with a first ring-shaped elevation; b) introducing a material admixed with phosphor and having a first predefinable viscosity into the first ring-shaped elevation; and c) curing the material admixed with phosphor in order to produce a first layer admixed with phosphor.
Abstract translation: 用于生产与磷光体混合的用于远程荧光体光源的方法可以包括:a)提供具有第一环形高度的基底层; b)将与磷光体混合并且具有第一可预定粘度的材料引入第一环形高度; 和c)固化与磷光体混合的材料,以便产生与磷光体混合的第一层。
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公开(公告)号:US10281090B2
公开(公告)日:2019-05-07
申请号:US15877409
申请日:2018-01-23
Applicant: OSRAM GmbH
Inventor: Martin Reiss , Roberto Didone' , Luigi Pezzato , Lorenzo Baldo
IPC: F21S4/20 , F21S4/22 , F21K9/237 , F21V15/01 , F21V29/00 , F21V29/70 , F21V29/87 , F21V31/04 , H05B33/08 , F21Y103/10 , F21Y115/10
Abstract: A lighting device comprising: an elongated laminar substrate having opposed front and back surfaces, one or more electrically-powered light radiation sources, e.g. LED sources, at the front surface of the substrate, a protective encapsulation sealingly encapsulating the substrate and the light radiation source(s), the encapsulation being light-permeable to facilitate propagation of light radiation from the device. The encapsulation includes thermally-conductive material at the back surface of the substrate.
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公开(公告)号:US09893230B2
公开(公告)日:2018-02-13
申请号:US15058180
申请日:2016-03-02
Applicant: OSRAM GmbH
Inventor: Martin Reiss
CPC classification number: H01L33/0095 , H01L33/56 , H01L2933/005 , H01L2933/0058 , H01L2933/0091
Abstract: A method for producing a lighting module is provided. The method includes providing a light source substrate populated with at least one semiconductor light source, laterally surrounding the at least one semiconductor light source by a wall, applying at least one prefabricated diffuser element to at least one semiconductor light source, introducing potting compound into the space surrounded by the wall up to a height at which both the at least one semiconductor light source, and potting at least part of the at least one diffuser element.
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公开(公告)号:US09923129B2
公开(公告)日:2018-03-20
申请号:US14421153
申请日:2013-08-07
Applicant: OSRAM GmbH
Inventor: Martin Reiss , Simon Schwalenberg
CPC classification number: H01L33/58 , H01L25/0753 , H01L25/50 , H01L33/486 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2924/0002 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091 , H01L2924/00
Abstract: Various embodiments may relate to a method for producing an LED module, including providing a housing implemented as a hollow body, having an opening on a light exit side of the LED module, wherein the housing has a base side, arranged opposite to the light exit side, arranging a circuit board having one LED on the base side of the housing, pouring in one first base layer made of a curable material in a non-cured state through the opening into the housing, and pouring in a scattering layer made of a curable material in a non-cured state through the opening into the housing. The scattering layer is poured in onto the first base layer. The first base layer is not cured during the pouring in of the scattering layer, and after the pouring in of the scattering layer, the one first base layer and the scattering layer are cured.
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公开(公告)号:US09696004B2
公开(公告)日:2017-07-04
申请号:US14864961
申请日:2015-09-25
Applicant: OSRAM GmbH
Inventor: Simon Bobbo , Alberto Alfier , Simone Massaro , Dina Pasqualini , Marco Munarin , Martin Reiss
IPC: F21V3/04 , F21V15/01 , F21K99/00 , F21S4/22 , F21K9/00 , F21V31/00 , F21Y103/10 , F21Y115/10
CPC classification number: F21V3/0625 , F21K9/00 , F21S4/22 , F21V15/012 , F21V15/013 , F21V31/005 , F21Y2103/10 , F21Y2115/10
Abstract: A lighting device, such as for example a LED flexible module, includes an elongated profiled body having a mouth portion, a first and a second lateral sides arranged sidewise of the mouth portion and a web side opposed the mouth portion. The profiled body includes a light-permeable portion, extending between the mouth portion and the first lateral side, and a light-impermeable portion extending between the second lateral side and the web side. A light radiation source assembly including a support member with one or more electrically powered light radiation sources is arranged at the mouth portion with the light radiation source(s) facing the light-permeable portion, whereby light radiation is directed towards the first lateral side for emission from the lighting device.
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公开(公告)号:US20160091166A1
公开(公告)日:2016-03-31
申请号:US14864961
申请日:2015-09-25
Applicant: OSRAM GmbH
Inventor: Simon Bobbo , Alberto Alfier , Simone Massaro , Dina Pasqualini , Marco Munarin , Martin Reiss
CPC classification number: F21V3/0625 , F21K9/00 , F21S4/22 , F21V15/012 , F21V15/013 , F21V31/005 , F21Y2103/10 , F21Y2115/10
Abstract: A lighting device, such as for example a LED flexible module, includes an elongated profiled body having a mouth portion, a first and a second lateral sides arranged sidewise of the mouth portion and a web side opposed the mouth portion. The profiled body includes a light-permeable portion, extending between the mouth portion and the first lateral side, and a light-impermeable portion extending between the second lateral side and the web side.A light radiation source assembly including a support member with one or more electrically powered light radiation sources is arranged at the mouth portion with the light radiation source(s) facing the light-permeable portion, whereby light radiation is directed towards the first lateral side for emission from the lighting device.
Abstract translation: 诸如LED柔性模块的照明装置包括具有口部的细长成型体,在口部侧面配置的第一和第二侧面以及与嘴部相对的腹板侧。 成型体包括在口部和第一侧面之间延伸的透光部分和在第二横向侧和腹板侧之间延伸的不透光部分。 包括具有一个或多个电力光辐射源的支撑构件的光辐射源组件布置在口部处,其中光辐射源面向透光部分,由此光辐射被引向第一横向侧面 照明装置的发射。
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公开(公告)号:US20140104838A1
公开(公告)日:2014-04-17
申请号:US14054846
申请日:2013-10-16
Applicant: OSRAM GmbH
Inventor: Martin Reiss , Gerhard Holzapfel
IPC: F21K99/00
CPC classification number: F21K9/90 , F21K9/00 , F21S4/20 , F21V31/04 , F21Y2103/10 , F21Y2115/10
Abstract: In various embodiments, a method for producing a lighting apparatus is provided. The method may include providing a light strip with a strip-shaped carrier and a plurality of semiconductor light sources arranged in a row on the carrier; attaching at least one preshaped wall to the carrier, which wall, when attached to the carrier, consists of a curable but not yet completely cured material; filling regions above the carrier next to the at least one wall with at least one curable filler; and curing at least the filler.
Abstract translation: 在各种实施例中,提供了一种用于制造照明装置的方法。 该方法可以包括提供具有带状载体的光条和在载体上排列成一行的多个半导体光源; 将至少一个预先形成的壁附接到载体上,当连接到载体上时,该壁由可固化但尚未完全固化的材料组成; 用至少一种可固化填料将至少一个壁上方的载体上方的填充区域填充; 并至少固化填料。
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公开(公告)号:US10054292B2
公开(公告)日:2018-08-21
申请号:US15182684
申请日:2016-06-15
Applicant: OSRAM GmbH
Inventor: Marco Munarin , Martin Reiss , Alberto Alfier , Thomas Rieger
IPC: F21V15/00 , F21V15/01 , F21V31/00 , F21V31/04 , F21V19/00 , F21S4/22 , F21Y103/10 , F21Y115/10 , F21Y101/00
CPC classification number: F21V15/012 , F21S4/22 , F21V15/013 , F21V19/004 , F21V31/005 , F21V31/04 , F21Y2101/00 , F21Y2103/10 , F21Y2115/10
Abstract: In various embodiments, a lighting device is provided. The lighting device includes a channel-shaped elongate profiled body having a central or web portion and two side portions sidewise of the web portion, a profiled body having mutually opposed undercuts opening inwardly of the channel shape of profiled body, and a light radiation source assembly including an elongate support board carrying one or more light radiation sources, e.g. LED sources, the support board having longitudinal sides extending into the said undercuts, wherein the light radiation source assembly is retained by the channel-shaped profiled body.
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公开(公告)号:US20160380166A1
公开(公告)日:2016-12-29
申请号:US14421153
申请日:2013-08-07
Applicant: OSRAM GmbH
Inventor: Martin Reiss , Simon Schwalenberg
IPC: H01L33/58 , H01L33/62 , H01L25/075 , H01L33/48
CPC classification number: H01L33/58 , H01L25/0753 , H01L25/50 , H01L33/486 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2924/0002 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091 , H01L2924/00
Abstract: Various embodiments may relate to a method for producing an LED module, including providing a housing implemented as a hollow body, having an opening on a light exit side of the LED module, wherein the housing has a base side, arranged opposite to the light exit side, arranging a circuit board having one LED on the base side of the housing, pouring in one first base layer made of a curable material in a non-cured state through the opening into the housing, and pouring in a scattering layer made of a curable material in a non-cured state through the opening into the housing. The scattering layer is poured in onto the first base layer. The first base layer is not cured during the pouring in of the scattering layer, and after the pouring in of the scattering layer, the one first base layer and the scattering layer are cured.
Abstract translation: 各种实施例可以涉及一种用于制造LED模块的方法,包括提供实现为中空体的壳体,在LED模块的光出射侧具有开口,其中壳体具有基部侧,与光出口 将具有一个LED的电路板布置在壳体的底侧上,通过开口将非固化状态的可固化材料制成的一个第一基底层浇注到壳体中,并且在由 处于非固化状态的可固化材料通过开口进入壳体。 将散射层注入第一基层。 第一基层在散射层的倾倒期间不固化,在散射层倾倒之后,一个第一基底层和散射层被固化。
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