Abstract:
Various embodiments may relate to a semiconductor lamp having at least one semiconductor light source, including multiple separately produced components, wherein at least two of the components are connected to one another by means of joint extrusion coating. Various embodiments further relate to a method for producing a semiconductor lamp having at least one semiconductor light source. The method includes at least, inserting at least one open driver housing and a cover for the driver housing into an injection mold, and extrusion coating the components inserted into the mold using potting material so that these components are permanently connected to one another by the potting material.
Abstract:
A semiconductor lamp comprises a housing in which a driver is accommodated and at least one contact pin protruding from the housing outwards, wherein the contact pin is tubular and riveted to the housing and the driver is connected to the contact pin via an electrically conductive connection element which is inserted into a cavity of the contact pin. A method serves for producing a semiconductor lamp, wherein at least one tubular contact pin is inserted into a feedthrough of a housing from outside till the contact pin abuts the housing, the contact pin is next riveted with the housing on the inside and a driver is inserted into the housing, whereby an electrically conductive connection element is inserted into the contact pin. The invention is particularly applicable to LED retrofit lamps for replacing bipin halogen lamps, in particular MR16 lamps.
Abstract:
A light module serves for inserting into a housing of a semiconductor lamp and comprises: a driver (2), a cooling element, a light generator, abutting the cooling element, with at least one semiconductor light source, which is electrically connected with the driver, and an optical refraction element covering the at least one semiconductor light source, wherein the refraction element is fastened on the cooling element and presses the light generator onto the cooling element. A semiconductor lamp comprises a housing open at the front into which the light module is inserted from the front side and on which the light module is fastened. A method serves for producing a semiconductor lamp, wherein at least the driver, the cooling element, the light generator and the refraction element are assembled into an individually manageable light module and the light module is then inserted into a housing. The invention is also applicable to replacement or retrofit lamps, in particular with a pin base, particularly a bipin base, e.g. to retrofit lamps for replacing halogen lamps, for example of the type MR16.
Abstract:
A light module (1) serves for inserting into a housing (23) of a semiconductor lamp (24) and comprises: a driver (2), a cooling element (10), a light generator (15), abutting the cooling element, with at least one semiconductor light source (17), which is electrically connected with the driver (2), and an optical refraction element (18) covering the at least one semiconductor light source, wherein the refraction element is fastened on the cooling element and presses the light generator (15) onto the cooling element. A semiconductor lamp (24) comprises a housing open at the front into which the light module is inserted from the front side and on which the light module is fastened. A method serves for producing a semiconductor lamp, wherein at least the driver, the cooling element, the light generator and the refraction element are assembled into an individually manageable light module and the light module is then inserted into a housing. The invention is also applicable to replacement or retrofit lamps, in particular with a pin base, particularly a bipin base, e.g. to retrofit lamps for replacing halogen lamps, for example of the type MR16.
Abstract:
Various embodiments may relate to a semiconductor lamp having at least one semiconductor light source, including multiple separately produced components, wherein at least two of the components are connected to one another by means of joint extrusion coating. Various embodiments further relate to a method for producing a semiconductor lamp having at least one semiconductor light source. The method includes at least, inserting at least one open driver housing and a cover for the driver housing into an injection mold, and extrusion coating the components inserted into the mold using potting material so that these components are permanently connected to one another by the potting material.
Abstract:
A semiconductor lamp (1) has at least one semiconductor light source (8) arranged on a front face (7) of a substrate (6) and a driver circuit (11) for activating the at least one semiconductor light source (8), at least part of the driver circuit (11) being secured on a rear face (10) of the substrate (6), facing away from the at least one semiconductor light source (8). The invention can be used, in particular, for retrofit lamps, in particular incandescent- or halogen retrofit lamps.
Abstract:
A semiconductor lamp (1) comprises a housing (2) in which a driver (3) is accommodated and at least one contact pin (6) protruding from the housing (2) outwards, wherein the contact pin (6) is tubular and riveted to the housing (2) and the driver (3) is connected to the contact pin (6) via an electrically conductive connection element (12) which is inserted into a cavity (13) of the contact pin (6). A method serves for producing a semiconductor lamp (1), wherein at least one tubular contact pin (6) is inserted into a feedthrough (5) of a housing (2) from outside till the contact pin (6) abuts the housing (2), the contact pin (6) is next riveted with the housing (2) on the inside and a driver (3) is inserted into the housing (2), whereby an electrically conductive connection element (12) is inserted into the contact pin (6). The invention is particularly applicable to LED retrofit lamps for replacing bipin halogen lamps, in particular MR16 lamps.
Abstract:
A semiconductor lamp (1) has at least one semiconductor light source (8) arranged on a front face (7) of a substrate (6) and a driver circuit (11) for activating the at least one semiconductor light source (8), at least part of the driver circuit (11) being secured on a rear face (10) of the substrate (6), facing away from the at least one semiconductor light source (8). The invention can be used, in particular, for retrofit lamps, in particular incandescent- or halogen retrofit lamps.