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公开(公告)号：US20140061692A1
公开(公告)日：2014-03-06
申请号：US14017351
申请日：2013-09-04
Applicant: OSRAM GmbH
Inventor： Thomas Preuschl
IPC: H01L33/64
CPC classification number: H01L33/641 , H01L25/167 , H01L2924/0002 , H05K1/0204 , H05K1/0206 , H05K1/185 , H05K2201/0187 , H05K2201/10106 , H01L2924/00
Abstract: A multilayered LED printed circuit board with electrically insulating layers includes at least one electrically insulating material and electrically conductive layers consisting of an electrically conductive material, wherein at least one of the electrically conductive layers is structured with a conductor track structure, wherein the at least one structured electrically conductive layer is arranged on an upper side of the LED printed circuit board, and wherein a plurality of LEDs is arranged on the at least one structured electrically conductive layer on the upper side. The LED printed circuit board further includes: a thermally conducting element, and thermal paths comprising an electrically conductive material, which are arranged, in each case in contact-making fashion, between the LEDs and the thermally conducting element.
Abstract translation: 具有电绝缘层的多层LED印刷电路板包括至少一个电绝缘材料和由导电材料组成的导电层，其中至少一个导电层由导体轨道结构构成，其中至少一个 结构化导电层设置在LED印刷电路板的上侧，并且其中多个LED布置在上侧的至少一个结构化导电层上。 LED印刷电路板还包括：导热元件，以及包括导电材料的热路径，其以接触方式在LED和导热元件之间以接触方式布置。
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公开(公告)号：US09961781B2
公开(公告)日：2018-05-01
申请号：US14646036
申请日：2013-11-15
Applicant: OSRAM GmbH
Inventor： Thomas Preuschl , Robert Kraus
CPC classification number: H05K3/341 , F21K9/20 , F21V3/02 , F21V19/001 , F21V23/006 , F21Y2115/10 , H05K3/36 , Y10T29/49128
Abstract: An optoelectronic assembly may include a substrate, which has a first contact region at a first side thereof, an optoelectronic component arranged on the first side of the substrate, which has a first contact coupled to the first contact region, a printed circuit board with conductor tracks, which is coupled to the first side of the substrate at a first side of the printed circuit board and which has a central cutout, in which the optoelectronic component is exposed, and which has a first contact cutout, which overlaps the first contact region, at least one electronic component arranged on a second side of the printed circuit board, which is coupled to the conductor tracks, and a connection element, which is arranged in the first contact cutout and electrically couples the first contact region to the conductor tracks, wherein the connection element fixes the substrate to the printed circuit board.
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公开(公告)号：US09029881B2
公开(公告)日：2015-05-12
申请号：US13938293
申请日：2013-07-10
Applicant: OSRAM GmbH
Inventor： Thomas Preuschl
CPC classification number: H01L33/08 , F21K9/00 , F21V23/06 , F21Y2115/10 , H05B33/083
Abstract: In various embodiments, a light emitting diode module is provided. The light emitting diode module may include at least one light emitting diode; wherein the at least one light emitting diode is connected in parallel with at least one first capacitor; wherein the at least one light emitting diode is arranged in a first structural unit, and the at least one first capacitor is arranged in a second structural unit, wherein the first structural unit and the second structural unit are electrically coupled to one another via a first cable.
Abstract translation: 在各种实施例中，提供了一种发光二极管模块。 发光二极管模块可以包括至少一个发光二极管; 其中所述至少一个发光二极管与至少一个第一电容器并联连接; 其中所述至少一个发光二极管布置在第一结构单元中，并且所述至少一个第一电容器布置在第二结构单元中，其中所述第一结构单元和所述第二结构单元经由第一结构单元彼此电耦合， 电缆。
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公开(公告)号：US20140027800A1
公开(公告)日：2014-01-30
申请号：US13952784
申请日：2013-07-29
Applicant: OSRAM GmbH
Inventor： Thomas Preuschl
IPC: H01L33/62
CPC classification number: H01L33/62 , F21S4/24 , F21Y2103/10 , F21Y2115/10 , H01L2924/0002 , H01L2924/00
Abstract: A method for producing a striplight is disclosed. Said method utilizing at least the following steps: (a) providing a strip-shaped carrier, which is populated on at least one side with a plurality of semiconductor light sources; (b) arranging at least one electrical line on the carrier; and (c) casting the at least one electrical line on the carrier. A striplight which has: a strip-shaped carrier, populated on at least one side with a plurality of semiconductor light sources; at least one electrical line, which is arranged on the carrier; and joint casting of the carrier and the at least one electrical line, is likewise disclosed.
Abstract translation: 公开了一种生产线条的方法。 所述方法至少利用以下步骤：（a）提供一个带状载体，该载体在多个半导体光源的至少一侧上形成; （b）在载体上布置至少一根电线; 和（c）在所述载体上铸造所述至少一条电线。 一种带状物，其具有带状载体，至少在一侧上形成有多个半导体光源; 布置在载体上的至少一条电线; 并且同时公开了载体和至少一个电线的联合铸造。
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公开(公告)号：US20140014978A1
公开(公告)日：2014-01-16
申请号：US13938293
申请日：2013-07-10
Applicant: Osram GmbH
Inventor： Thomas Preuschl
IPC: H01L33/08
CPC classification number: H01L33/08 , F21K9/00 , F21V23/06 , F21Y2115/10 , H05B33/083
Abstract: In various embodiments, a light emitting diode module is provided. The light emitting diode module may include at least one light emitting diode; wherein the at least one light emitting diode is connected in parallel with at least one first capacitor; wherein the at least one light emitting diode is arranged in a first structural unit, and the at least one first capacitor is arranged in a second structural unit, wherein the first structural unit and the second structural unit are electrically coupled to one another via a first cable.
Abstract translation: 在各种实施例中，提供了一种发光二极管模块。 发光二极管模块可以包括至少一个发光二极管; 其中所述至少一个发光二极管与至少一个第一电容器并联连接; 其中所述至少一个发光二极管布置在第一结构单元中，并且所述至少一个第一电容器布置在第二结构单元中，其中所述第一结构单元和所述第二结构单元经由第一结构单元彼此电耦合， 电缆。
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Patent Agency Ranking
公开(公告)号：US09203008B2
公开(公告)日：2015-12-01
申请号：US14017351
申请日：2013-09-04
Applicant: OSRAM GmbH
Inventor： Thomas Preuschl
CPC classification number: H01L33/641 , H01L25/167 , H01L2924/0002 , H05K1/0204 , H05K1/0206 , H05K1/185 , H05K2201/0187 , H05K2201/10106 , H01L2924/00
Abstract: A multilayered LED printed circuit board with electrically insulating layers includes at least one electrically insulating material and electrically conductive layers consisting of an electrically conductive material, wherein at least one of the electrically conductive layers is structured with a conductor track structure, wherein the at least one structured electrically conductive layer is arranged on an upper side of the LED printed circuit board, and wherein a plurality of LEDs is arranged on the at least one structured electrically conductive layer on the upper side. The LED printed circuit board further includes: a thermally conducting element, and thermal paths comprising an electrically conductive material, which are arranged, in each case in contact-making fashion, between the LEDs and the thermally conducting element.
Abstract translation: 具有电绝缘层的多层LED印刷电路板包括至少一个电绝缘材料和由导电材料组成的导电层，其中至少一个导电层由导体轨道结构构成，其中至少一个 结构化导电层设置在LED印刷电路板的上侧，并且其中多个LED布置在上侧的至少一个结构化导电层上。 LED印刷电路板还包括：导热元件，以及包括导电材料的热路径，其以接触方式在LED和导热元件之间以接触方式布置。
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公开(公告)号：US20150300574A1
公开(公告)日：2015-10-22
申请号：US14377180
申请日：2013-02-14
Applicant: OSRAM GmbH
Inventor： Thomas Preuschl , Dieter Eisenhut
CPC classification number: H01R12/714 , F21K9/20 , F21V23/006 , F21Y2115/10 , H01L2224/48091 , H01L2224/48472 , H01R13/08 , H01L2924/00014 , H01L2924/00
Abstract: A lighting module printed circuit board may include at least one electrical contact. The at least one electrical contact may include at least one spring contact, in particular spring contact pin. A lighting module may include at least one printed circuit board. The at least one printed circuit board is a lighting module printed circuit board.
Abstract translation: 照明模块印刷电路板可以包括至少一个电接触。 所述至少一个电触头可以包括至少一个弹簧触头，特别是弹簧触针。 照明模块可以包括至少一个印刷电路板。 所述至少一个印刷电路板是照明模块印刷电路板。
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公开(公告)号：US20150159816A1
公开(公告)日：2015-06-11
申请号：US14413419
申请日：2013-06-28
Applicant: OSRAM GmbH
Inventor： Thomas Preuschl , Guenter Hoetzl , Peter Sachsenweger
CPC classification number: F21K9/20 , F21K9/90 , F21V19/003 , F21V23/006 , F21Y2105/10 , F21Y2115/10 , H05K1/118 , H05K1/147 , H05K1/189 , H05K3/0058 , H05K3/0061 , H05K3/363 , H05K2201/042 , H05K2201/055 , H05K2201/0999 , H05K2201/10015 , H05K2201/10106 , Y10T29/49126
Abstract: Various embodiments may relate to a lighting module, including a first printed circuit board, on which at least one light source is arranged, a covering element, which at least partially covers the first printed circuit board, and a second printed circuit board, on which at least one electronic component is arranged, wherein the second printed circuit board is fastened to the covering element and is electrically connected to the first printed circuit board.
Abstract translation: 各种实施例可以涉及包括第一印刷电路板的照明模块，其上布置有至少一个光源，至少部分地覆盖第一印刷电路板的覆盖元件和第二印刷电路板， 布置至少一个电子部件，其中第二印刷电路板被紧固到覆盖元件并与第一印刷电路板电连接。
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公开(公告)号：US09851058B2
公开(公告)日：2017-12-26
申请号：US14413419
申请日：2013-06-28
Applicant: OSRAM GmbH
Inventor： Thomas Preuschl , Guenter Hoetzl , Peter Sachsenweger
IPC: F21K99/00 , F21V19/00 , F21V23/00 , H05K1/14 , F21K9/20 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/36 , F21K9/90 , F21Y105/10 , F21Y115/10
CPC classification number: F21K9/20 , F21K9/90 , F21V19/003 , F21V23/006 , F21Y2105/10 , F21Y2115/10 , H05K1/118 , H05K1/147 , H05K1/189 , H05K3/0058 , H05K3/0061 , H05K3/363 , H05K2201/042 , H05K2201/055 , H05K2201/0999 , H05K2201/10015 , H05K2201/10106 , Y10T29/49126
Abstract: Various embodiments may relate to a lighting module, including a first printed circuit board, on which at least one light source is arranged, a covering element, which at least partially covers the first printed circuit board, and a second printed circuit board, on which at least one electronic component is arranged, wherein the second printed circuit board is fastened to the covering element and is electrically connected to the first printed circuit board.
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公开(公告)号：US09578697B2
公开(公告)日：2017-02-21
申请号：US14413714
申请日：2013-06-28
Applicant: OSRAM GmbH
Inventor： Thomas Preuschl , Hoetzl Guenter , Peter Sachsenweger
IPC: F21K9/00 , H05B33/08 , F21V7/00 , F21V23/00 , F21V29/70 , F21V19/00 , F21V23/02 , H05K3/32 , F21Y101/00
CPC classification number: H05B33/0803 , F21V7/00 , F21V19/003 , F21V23/006 , F21V23/02 , F21V29/70 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H05K3/32 , Y10T29/49133
Abstract: Various embodiments may relate to a lighting module, including a first printed circuit board, on which at least one light source is arranged, a covering element, which at least partially covers the first printed circuit board, and at least one electronic component, which is integrated in the covering element and is electrically connected to the first printed circuit board.
Abstract translation: 各种实施例可以涉及包括第一印刷电路板的照明模块，其上布置有至少一个光源，覆盖元件至少部分地覆盖第一印刷电路板，以及至少一个电子部件，其是 集成在覆盖元件中并且电连接到第一印刷电路板。
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