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1.发明授权公开(公告)号：US11715815B2
公开(公告)日：2023-08-01
申请号：US17053800
申请日：2019-05-08
Applicant: Osram OLED GmbH
Inventor： Michael Völkl , Siegfried Herrmann
CPC classification number: H01L33/14 , H01L33/10 , H01L33/502
Abstract: An optoelectronic semiconductor device may include a first semiconductor layer, a second semiconductor layer, first and second current spreading structures, and an insulating intermediate layer. The second semiconductor layer may be arranged over a substrate. The first semiconductor layer may be arranged between the second semiconductor layer and the substrate. The first current spreading structure may be electrically connected to the first semiconductor layer, and the second current spreading structure electrically may be connected to the second semiconductor layer. The insulating intermediate layer may include a dielectric mirror and may be arranged between the second current spreading structure and the second semiconductor layer. The current spreading structures may overlap one another in a plane perpendicular to a main surface of the substrate. The first current spreading structure may be arranged at a larger distance from the first semiconductor layer than the second current spreading structure.
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2.发明授权公开(公告)号：US11476398B2
公开(公告)日：2022-10-18
申请号：US16624913
申请日：2018-06-14
Applicant: OSRAM OLED GmbH
Inventor： Siegfried Herrmann
IPC: H01L33/62 , H01L33/00 , H01L33/24 , H01L25/075
Abstract: A semiconductor display may include a multiplicity of semiconductor pillars as well as first contact strips and second electrical contact strips. The semiconductor pillars each comprise a semiconductor core of a first conductivity type and a semiconductor shell of a second conductivity type different from the first conductivity type, as well as an active layer between them for radiation generation. The semiconductor pillars each comprise an energization shell which is applied onto the respective semiconductor shell for energization. The semiconductor pillars can be electrically driven independently of one another individually or in small groups by means of the first and second electrical contact strips.
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公开(公告)号：US20210280748A1
公开(公告)日：2021-09-09
申请号：US17265475
申请日：2019-08-02
Applicant: OSRAM OLED GmbH
Inventor： Sebastian Taeger , Siegfried Herrmann , Adrian Stefan Avramescu , Alexander Behres
Abstract: An electromagnetic radiation emitting device and a method for applying a converter layer to an electromagnetic radiation emitting device are disclosed. In an embodiment, a method includes applying converter elements to a surface of a carrier, applying the converter elements to an electromagnetic radiation emitting device by applying the carrier to the electromagnetic radiation emitting device such that the surface of the carrier with the applied converter elements faces the electromagnetic radiation emitting device and forming a converter layer on the electromagnetic radiation emitting device by depositing a plurality of thin layers on the converter elements using an atomic layer deposition process.
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4.发明授权公开(公告)号：US10672962B2
公开(公告)日：2020-06-02
申请号：US16091080
申请日：2017-04-10
Applicant: OSRAM OLED GMBH
Inventor： Siegfried Herrmann , Michael Völkl
IPC: H01L33/62 , H01L33/38 , H01L33/48 , H01L27/15 , H01L33/00 , H01L33/22 , H01L33/32 , H01L33/44 , H01L33/50 , H01L33/56 , H01L33/60 , H01L25/075
Abstract: A light-emitting semiconductor chip, a light-emitting component and a method for producing a light-emitting component are disclosed. In an embodiment a light-emitting semiconductor chip includes a substrate having a top surface, a bottom surface opposite the top surface and a first side surface extending transversely or perpendicularly to the bottom surface, a semiconductor body arranged on the top surface of the substrate, the semiconductor body comprising an active region configured to generate light and a contacting comprising a first current distribution structure and a second current distribution structure, which is formed to supply current to the active region, wherein the semiconductor chip is free of any connection point on a side of the semiconductor body facing away from the substrate and on the bottom surface of the substrate, and wherein the connection point is a connection point for electrically contacting the first and second current distribution structures.
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公开(公告)号：US20210313500A1
公开(公告)日：2021-10-07
申请号：US17266631
申请日：2019-07-23
Applicant: Osram OLED GmbH
Inventor： Andreas Leber , Siegfried Herrmann , Christine Rafael
Abstract: An optoelectronic semiconductor chip may include a substrate and a semiconductor layer sequence having a first region, a second region, and an active layer between the first and second region. The chip may further include a first contact ridge configured to energize a first region, a second contact ridge configured to energize the second region, a first connection point to contact the first contact ridge, and a second connection point to contact the second contact ridge. The first and second contact ridge may each extend over at least 50% of the length of the semiconductor chip. The first and second contact ridge may vertically overlap where at least one through-connection extends from the first contact ridge through the second contact ridge into the first region.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20200343420A1
公开(公告)日：2020-10-29
申请号：US16769586
申请日：2018-12-06
Applicant: Osram Oled GmbH
Inventor： Adrian Stefan Avramescu , Siegfried Herrmann , Alexander Behres
Abstract: A light-emitting semiconductor component may include a semiconductor body having an active region configured to emit a primary radiation, a first conversion element to convert the primary radiation to a first secondary radiation, a second conversion element to convert the primary radiation to a second secondary radiation, and a mask. The first conversion element and the second conversion element may be arranged at a top side of the semiconductor body, may be configured as bodies that partly cover the semiconductor body, and may be connected to the semiconductor body. The mask may be arranged between the first conversion element, the second conversion element, and the semiconductor body. The mask may have an opening in the region of each conversion element.
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公开(公告)号：US12176467B2
公开(公告)日：2024-12-24
申请号：US17265475
申请日：2019-08-02
Applicant: OSRAM OLED GmbH
Inventor： Sebastian Taeger , Siegfried Herrmann , Adrian Stefan Avramescu , Alexander Behres
Abstract: An electromagnetic radiation emitting device and a method for applying a converter layer to an electromagnetic radiation emitting device are disclosed. In an embodiment, a method includes applying converter elements to a surface of a carrier, applying the converter elements to an electromagnetic radiation emitting device by applying the carrier to the electromagnetic radiation emitting device such that the surface of the carrier with the applied converter elements faces the electromagnetic radiation emitting device and forming a converter layer on the electromagnetic radiation emitting device by depositing a plurality of thin layers on the converter elements using an atomic layer deposition process.
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公开(公告)号：US11942572B2
公开(公告)日：2024-03-26
申请号：US16768594
申请日：2018-12-13
Applicant: OSRAM OLED GMBH
Inventor： Siegfried Herrmann , Michael Völkl
IPC: H01L33/20 , F21K9/90 , H01L23/00 , H01L25/075 , H01L33/52 , H01L33/64 , H05K1/05 , H05K3/00 , H05K3/28 , H10K19/00 , H10K50/10 , F21Y115/10
CPC classification number: H01L33/20 , F21K9/90 , H01L24/97 , H01L25/0753 , H01L33/52 , H01L33/64 , H01L33/644 , H05K1/05 , H05K3/0014 , H05K3/284 , H10K19/901 , H10K50/10 , F21Y2115/10 , H01L2924/181 , H05K2201/0129 , H05K2201/10106
Abstract: The invention relates to a method for producing a semiconductor component comprising a radiation-emitting optical semiconductor chip or a plurality of radiation-emitting optical semiconductor chips, said method comprising: applying the radiation-emitting optical semiconductor chip or the plurality of radiation-emitting optical semiconductor chips to a deformable flat support deforming the support; and permanently fixing the deformation.
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公开(公告)号：US11574952B2
公开(公告)日：2023-02-07
申请号：US16772741
申请日：2018-12-17
Applicant: OSRAM OLED GmbH
Inventor： Siegfried Herrmann
Abstract: An optoelectronic semiconductor component and a method for producing optoelectronic semiconductor components are disclosed. In an embodiment a optoelectronic semiconductor component includes a plurality of semiconductor pillars, each pillar having a tip and a base region at opposite ends, an electrical isolation layer surrounding at least part of the semiconductor pillars on side faces and at least one first electrical contact pad and at least one second electrical contact pad for energizing the semiconductor pillars, wherein a first portion of the semiconductor pillars are emitter pillars configured to generate radiation, wherein a second portion of the semiconductor pillars are non-radiating electrical contact pillars, wherein the contact pillars extend through the isolation layer such that all contact pads are located on the same side of the isolation layer, and wherein each contact pillars is coated with an electrically ohmically conductive outer layer.
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公开(公告)号：US11473221B2
公开(公告)日：2022-10-18
申请号：US16766442
申请日：2018-11-30
Applicant: OSRAM OLED GmbH
Inventor： Luca Haiberger , Siegfried Herrmann
Abstract: The invention relates to an embodiment in which the textile component comprises at least one flexible thread that can be woven. A plurality of semiconductor columns are attached in or on the thread and are configured to generate radiation. Furthermore, a plurality of electrical lines are located in or on the thread, by means of which lines the semiconductor columns are electrically contacted. An average height (H) of the semiconductor columns in a direction transverse to a longitudinal direction (L) of the thread is at most 20% of an average diameter (D) of the thread.
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