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    Measuring arrangement having an optical transmitter and an optical receiver
    1.
    发明授权
    Measuring arrangement having an optical transmitter and an optical receiver 有权

    公开(公告)号：US10809358B2

    公开(公告)日：2020-10-20

    申请号：US16483037

    申请日：2018-01-30

    Applicant: OSRAM OLED GmbH

    Inventor： Dirk Becker ,  Martin Haushalter ,  Claus Jaeger

    IPC: H04B10/00 ,  G01S7/481 ,  G01V8/14

    Abstract: A measuring arrangement having an optical transmitter and an optical receiver are disclosed. In an embodiment a measuring arrangement includes an optical transmitter configured to transmit electromagnetic measuring radiation into a transmission space, an optical receiver configured to receive measuring radiation reflected by an object in a reception space and a covering configured to reduce reception of an interference radiation by the receiver, wherein the interference radiation is measuring radiation not reflected by the object.

    Optoelectronic semiconductor component and biometric sensor
    2.
    发明授权
    Optoelectronic semiconductor component and biometric sensor 有权

    公开(公告)号：US11239398B2

    公开(公告)日：2022-02-01

    申请号：US16638142

    申请日：2018-07-26

    Applicant: OSRAM OLED GmbH

    Inventor： Thomas Kippes ,  Claus Jaeger ,  Jason Rajakumaran

    IPC: H01L33/58 ,  G06K9/00

    Abstract: An optoelectronic semiconductor component may include at least one optoelectronic semiconductor chip, a reflector, a lens, and a connecting layer. The reflector may have a reflector recess where the semiconductor chip may be arranged. The lens may be fully located in the reflector recess, and the lens may have a lens recess. The connecting layer may fasten the lens on the reflector. The lens may have a lens outer side facing toward a reflector inner wall of the reflector recess. A gap may be between the reflector and the lens, and the gap may be filled only partially with the connecting layer. The semiconductor chip may not touch the lens. The optoelectronic semiconductor component may be incorporated into a biometric sensor.

    Sensor Device
    3.
    发明申请
    Sensor Device 有权

    公开(公告)号：US20210007604A1

    公开(公告)日：2021-01-14

    申请号：US16980150

    申请日：2019-03-12

    Applicant: OSRAM OLED GmbH

    Inventor： Faina Esser ,  Claus Jaeger ,  Stephan Haslbeck

    IPC: A61B5/00 ,  A63B24/00

    Abstract: In an embodiment a sensor device includes a housing having at least a first cavity and a second cavity, at least one light emitter arranged in the first cavity and at least one light detector arranged in the second cavity, wherein each of the cavities has an opening at an underside of the housing so that light from the respective cavity is passable to the outside and/or from the outside into the respective cavity, wherein each of the cavities includes a bottom opposite the underside of the housing and a peripheral side wall extending between the bottom and the underside of the housing, wherein at least one of the cavities is filled with an absorbing material from the bottom to a specified height, and with a transparent material from the specified height to a height of the underside of the housing, and wherein the light detector is arranged on the bottom of the second cavity.

    Sensor and use of a sensor in a 3-D position detection system
    4.
    发明授权
    Sensor and use of a sensor in a 3-D position detection system 有权

    公开(公告)号：US11567565B2

    公开(公告)日：2023-01-31

    申请号：US16647193

    申请日：2018-09-21

    Applicant: OSRAM OLED GmbH

    Inventor： Daniel Dietze ,  Maximilian Assig ,  Claus Jaeger

    IPC: G06F3/01 ,  G01S1/70 ,  G01S3/789 ,  G06T19/00

    Abstract: A sensor and a 3-D position detection system are disclosed. In an embodiment a sensor includes at least one sensor chip configured to detect radiation, at least one carrier on which the sensor chip is mounted and a cast body that is transmissive for the radiation and that completely covers the sensor chip, wherein a centroid shift of the sensor chip amounts to at most 0.04 mrad at an angle of incidence of up to at least 60°, wherein the cast body comprises a light inlet side that faces away from the sensor chip, and the light inlet side comprises side walls bounding it on all sides, wherein the side walls are smooth, planar and transmissive for the radiation, wherein a free field-of-view on the light inlet side has an aperture angle of at least 140°, and wherein the cast body protrudes in a direction away from the sensor chip beyond a bond wire.

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