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公开(公告)号：US11888097B2
公开(公告)日：2024-01-30
申请号：US17253566
申请日：2019-07-01
Applicant: OSRAM OLED GmbH
Inventor： Konrad Wagner , Daniel Richter , Gunnar Petersen , Nicole Berner , Michael Förster
IPC: H01L33/54 , H01L25/075 , H01L33/56
CPC classification number: H01L33/54 , H01L25/0753 , H01L33/56 , H01L2933/005
Abstract: An optoelectronic component (1) is specified, with at least one radiation-emitting semiconductor chip generating electromagnetic radiation during operation, a coating surrounding the at least one semiconductor chip in lateral directions, a magnetic structure covered by the coating, wherein the magnetic structure enables the component to be identified. Furthermore, a process for the manufacture of such an optoelectronic component is given.
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公开(公告)号：US11480744B2
公开(公告)日：2022-10-25
申请号：US17252908
申请日：2019-07-16
Applicant: OSRAM OLED GmbH
Inventor： Luca Haiberger , Daniel Richter
IPC: G02B6/42 , H01L33/58 , H01L25/075
Abstract: In one embodiment, the optoelectronic component comprises a first emission zone, which emits electromagnetic radiation during operation. Furthermore, the component comprises an optical waveguide with an entrance side facing the first emission zone, a distribution element and with output coupling structures on a side of the distribution element facing away from the first emission zone. The optical waveguide is a simply connected solid body. In a top view of the side of the optical waveguide facing away from the first emission zone, the distribution element completely covers the first emission zone. The output coupling structures are individual, spaced-apart elevations, each of which extends away from the distribution element and comprises an output coupling surface at an end facing away from the distribution element. A structure that is nontransmissive to the radiation of the first emission zone is arranged on the optical waveguide in the region between the output coupling structures.
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公开(公告)号：US20210135068A1
公开(公告)日：2021-05-06
申请号：US16632613
申请日：2018-07-31
Applicant: OSRAM OLED GmbH
Inventor： Daniel Leisen , Herbert Brunner , Emilia Dinu , Jens Eberhard , Christina Keith , Markus Pindl , Thomas Reeswinkel , Daniel Richter , Christopher Wiesmann , Ludwig Peyker , Alexander Linkov
IPC: H01L33/54 , H01L33/50 , H01L33/56 , H01L31/0203 , H01L31/0232 , H01L31/18
Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.
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公开(公告)号：US11211524B2
公开(公告)日：2021-12-28
申请号：US16631294
申请日：2018-07-31
Applicant: OSRAM OLED GmbH
Inventor： Daniel Leisen , Herbert Brunner , Emilia Dinu , Jens Eberhard , Christina Keith , Markus Pindl , Thomas Reeswinkel , Daniel Richter
Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.
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Patent Agency Ranking
公开(公告)号：US20210217941A1
公开(公告)日：2021-07-15
申请号：US17270732
申请日：2019-08-13
Applicant: OSRAM OLED GmbH
Inventor： Daniel Richter
IPC: H01L33/62 , H01L33/54 , H01L25/075 , H01L23/00
Abstract: In an embodiment a method for manufacturing a printed circuit board with at least one optoelectronic component integrated into the printed circuit board includes arranging the at least one optoelectronic component on a first metal layer, pressing a first electrically insulating layer onto the at least one optoelectronic component and creating at least one recess in the first metal layer and/or the first electrically insulating layer thereby at least partially exposing the at least one optoelectronic component, wherein the first electrically insulating layer comprises a fiber reinforced plastic or a glass fiber fabric.
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公开(公告)号：US20210043615A1
公开(公告)日：2021-02-11
申请号：US16969153
申请日：2019-02-25
Applicant: OSRAM OLED GmbH
Inventor： Daniel Richter , Tobias Gebuhr , Michael Betz , Markus Boss
Abstract: An optoelectronic component and a manufacturing method are disclosed. In an embodiment an optoelectronic component includes an optoelectronic semiconductor chip, a housing having a top side and two protrusions on the top side projecting beyond the top side and a transparent structure, wherein the optoelectronic semiconductor chip is arranged between the protrusions, and wherein the transparent structure is at least partially arranged on the top side of the housing between the protrusions and partially above the optoelectronic semiconductor chip.
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公开(公告)号：US11038090B2
公开(公告)日：2021-06-15
申请号：US16632613
申请日：2018-07-31
Applicant: OSRAM OLED GmbH
Inventor： Daniel Leisen , Herbert Brunner , Emilia Dinu , Jens Eberhard , Christina Keith , Markus Pindl , Thomas Reeswinkel , Daniel Richter , Christopher Wiesmann , Ludwig Peyker , Alexander Linkov
IPC: H01L33/54 , H01L33/50 , H01L33/56 , H01L31/0203 , H01L31/18 , H01L31/0232
Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.
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公开(公告)号：US11728321B2
公开(公告)日：2023-08-15
申请号：US16969153
申请日：2019-02-25
Applicant: OSRAM OLED GmbH
Inventor： Daniel Richter , Tobias Gebuhr , Michael Betz , Markus Boss
CPC classification number: H01L25/167 , H01L33/005 , H01L33/486 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2933/005
Abstract: An optoelectronic component and a manufacturing method are disclosed. In an embodiment an optoelectronic component includes an optoelectronic semiconductor chip, a housing having a top side and two protrusions on the top side projecting beyond the top side and a transparent structure, wherein the optoelectronic semiconductor chip is arranged between the protrusions, and wherein the transparent structure is at least partially arranged on the top side of the housing between the protrusions and partially above the optoelectronic semiconductor chip.
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公开(公告)号：US20210126156A1
公开(公告)日：2021-04-29
申请号：US16631294
申请日：2018-07-31
Applicant: OSRAM OLED GmbH
Inventor： Daniel Leisen , Herbert Brunner , Emilia Dinu , Jens Eberhard , Christina Keith , Markus Pindl , Thomas Reeswinkel , Daniel Richter
Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.
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