公开(公告)号：US10651342B2

公开(公告)日：2020-05-12

申请号：US16315463

申请日：2017-07-11

Applicant: OSRAM OLED GmbH

Inventor： Roland Zeisel ,  Michael Binder ,  Jens Ebbecke ,  Tobias Meyer

IPC: H01L33/22 ,  H01L33/02 ,  H01L33/06

Abstract: An optoelectronic semiconductor chip is disclosed. In an embodiment an optoelectronic semiconductor chip includes a semiconductor body comprising a first semiconductor structure, a second semiconductor structure and an active region between the first and the second semiconductor structure and a plurality of recesses, each penetrating at least one of the semiconductor structures and the active region, wherein a cover surface of the active region is a continuous surface, and wherein at least in some of the recesses, surfaces of the recesses are completely covered with an electrically insulating material.

公开(公告)号：US10580938B2

公开(公告)日：2020-03-03

申请号：US15777633

申请日：2016-11-17

Applicant: OSRAM OLED GmbH

Inventor： Jens Ebbecke ,  Petrus Sundgren ,  Roland Zeisel

IPC: H01L33/44 ,  H01L33/30 ,  H01L33/00

Abstract: A light-emitting diode chip and a method for manufacturing a light-emitting diode chip are disclosed. In an embodiment a light-emitting diode chip includes an epitaxial semiconductor layer sequence having an active zone configured to generate electromagnetic radiation during operation and a passivation layer comprising statically fixed electrical charge carriers, wherein the passivation layer is located on a side surface of the semiconductor layer sequence covering at least the active zone.