公开(公告)号：US10598316B2

公开(公告)日：2020-03-24

申请号：US16086824

申请日：2017-03-17

Applicant: OSRAM OLED GmbH

Inventor： Markus Hofmann ,  Thomas Schlereth ,  Michael Bestele

IPC: F21V33/00 ,  F21K9/232 ,  H01L33/50 ,  H01L25/075 ,  F21V29/85 ,  H01L33/44 ,  F21Y115/10 ,  H01L25/16 ,  F21Y103/10

Abstract: A filament includes a radiation-transmissive substrate, a plurality of light emitting diodes and a converter layer, wherein the substrate has an upper side and a lower side facing away from the upper side, and the LEDs are arranged on the upper side of the substrate, the converter layer covers the LEDs, the upper side and the lower side of the substrate, and the converter layer has a first sublayer on the upper side and a second sublayer on the lower side, and the converter layer is configured to obtain an improved radiation profile of the filament such that the converter layer has a varying vertical layer thickness along a lateral direction, and/or the first sublayer and the second sublayer differ from one another in their geometry and/or material composition.

公开(公告)号：US10731797B2

公开(公告)日：2020-08-04

申请号：US16087949

申请日：2017-03-23

Applicant: OSRAM OLED GmbH

Inventor： Thomas Schlereth ,  Elena Rachkova ,  Michael Bestele ,  Ivar Tangring

IPC: F21K9/232 ,  H01L25/075 ,  F21K9/275 ,  H01L33/54 ,  H01L33/50 ,  H01L33/62 ,  F21Y115/10 ,  F21Y103/10

Abstract: A filament includes a multiplicity of light-emitting semiconductor chips, wherein the semiconductor chips are arranged on a carrier, the semiconductor chips being electrically contacted, a scattering structure is configured to scatter light of the light-emitting semiconductor chips, the scattering structure is formed by structuring a surface, a converter covers the light-emitting semiconductor chips, and the structuring of the surface is formed on a surface of the converter.

公开(公告)号：US11094689B2

公开(公告)日：2021-08-17

申请号：US16649826

申请日：2018-09-20

Applicant: OSRAM OLED GmbH

Inventor： Ivar Tangring ,  Thomas Schlereth

IPC: H01L27/02 ,  H01L29/86 ,  H01L25/16 ,  H01L29/861

Abstract: An electronic component includes a first contact point for n-side contacting, a second contact point for p-side contacting, and a protective diode, which is connected antiparallel to the first contact point and to the second contact point. The protective diode includes a first diode structure which is p-conductive and a second diode structure which is n-conductive. The first diode structure is formed as a layer which overlaps in places with the first contact point in a first overlap region. The second diode structure is formed as a layer which overlaps in places with the second contact point in a second overlap region. The first diode structure and the second diode structure overlap each other in a third overlap region.

公开(公告)号：US20200173611A1

公开(公告)日：2020-06-04

申请号：US16785003

申请日：2020-02-07

Applicant: OSRAM OLED GmbH

Inventor： Markus Hofmann ,  Thomas Schlereth ,  Michael Bestele

IPC: F21K9/232 ,  H01L33/50 ,  H01L25/075 ,  F21V29/85 ,  H01L33/44

Abstract: A filament includes a radiation-transmissive substrate, a plurality of LEDs, and a converter layer, wherein the substrate has an upper side and a lower side facing away from the upper side, the LEDs being arranged on the upper side of the substrate, the converter layer covers the LEDs, the upper side and the lower side of the substrate, and the converter layer has a first sublayer on the upper side and a second sublayer on the lower side, the converter layer is configured to obtain an improved radiation profile of the filament, along a lateral direction, the converter layer has a continuously varying vertical layer thickness, the lateral direction is a lateral longitudinal direction parallel to a main extension surface of the substrate, and the substrate has a length expanding along the lateral longitudinal direction that is greater than a width of the substrate along a lateral transverse direction.