Stitchless direct imaging for high resolution electronic patterning

    公开(公告)号:US10429742B2

    公开(公告)日:2019-10-01

    申请号:US15772728

    申请日:2016-11-02

    Abstract: A method of manufacture of objects including receiving a CAD file containing electrical circuit design data for direct writing on a surface, the CAD file including CAD data for a multiplicity of objects to be produced on the surface, automatically configuring a direct write machine to direct write direct writing data based on the CAD data on the surface in plural scans, each having a scan width less than a width of the surface, including arranging the direct writing data for the multiplicity of objects to be written in a side by side manner in each of the plural scans so as to be within the scan width, whereby stitching of direct writing data between adjacent scans is obviated and operating the direct write machine to create the multiplicity of objects on the surface.

    Apparatus for use in preparing a printed circuit board and photosensitive ink for in an ink jet printer

    公开(公告)号:US11596070B2

    公开(公告)日:2023-02-28

    申请号:US17425023

    申请日:2020-02-11

    Applicant: Orbotech Ltd.

    Abstract: An apparatus is used in preparing a printed circuit board (PCB). The apparatus can include a common chassis, an inkjet printer mounted on the common chassis, and a pattern exposer mounted on the common chassis. The inkjet printer can selectively print unexposed photosensitive patterns on a PCB substrate with a photosensitive ink. The pattern exposer can expose said photosensitive patterns to radiation thereby defining exposed patterns. A photosensitive ink for use in an ink jet printer can include a photoresist, a solvent, a humectant, a surfactant, an adhesion promoter, and a basic solution. The adhesion promoter is operative to increase anisotropy of a wet etching process of a copper component on which said photosensitive ink is printed.

    System and method for direct imaging
    4.
    发明授权
    System and method for direct imaging 有权
    用于直接成像的系统和方法

    公开(公告)号:US08964274B2

    公开(公告)日:2015-02-24

    申请号:US13956797

    申请日:2013-08-01

    Abstract: A direct imaging system comprises an illumination unit comprising a plurality of light sources, the plurality of light sources configured to emit a plurality of beams, an optical system for forming the plurality of beams to be aligned in position or angle, an acoustic optical modulator positioned to receive the plurality of beams aligned in one of position or angle and to consecutively diffract different portions of the plurality of beams as an acoustic wave propagates in an acoustic direction, and a scanning element adapted to scan an exposure plane with the plurality of beams modulated by the acoustic optical modulator at a scanning velocity, wherein the scanning velocity is selected to incoherently unite the different portions of the plurality of beams into a single exposure spot.

    Abstract translation: 直接成像系统包括包括多个光源的照明单元,所述多个光源被配置为发射多个光束,用于形成要在位置或角度对准的多个光束的光学系统,定位 以接收以一个位置或角度对准的多个光束,并且当声波在声学方向上传播时,连续地衍射多个光束的不同部分,以及适于扫描具有多个光束的曝光平面的扫描元件 通过声光学调制器以扫描速度,其中选择扫描速度以将多个光束的不同部分非均匀地组合成单个曝光点。

    A Method and Apparatus for Preparing a PCB Product Having Highly Dense Conductors

    公开(公告)号:US20220104360A1

    公开(公告)日:2022-03-31

    申请号:US17425023

    申请日:2020-02-11

    Applicant: Orbotech Ltd.

    Abstract: A method for preparing a PCB product having highly dense conductors, the method including providing a PCB substrate including a conductive layer, employing an inkjet printer to selectively print unexposed photosensitive patterns on the PCB substrate, the unexposed photosensitive patterns having a thickness of less than 5 pm, exposing the photosensitive patterns to radiation thereby to define exposed patterns, the exposed patterns having a pitch less than 20 pm and wet etching the conductive layer in accordance with a pattern defined by the exposed patterns thereby to define the highly dense conductors having a pitch of less than 30 pm.

    Electrical inspection of electronic devices using electron-beam induced plasma probes
    6.
    发明授权
    Electrical inspection of electronic devices using electron-beam induced plasma probes 有权
    使用电子束感应等离子体探针对电子设备进行电气检查

    公开(公告)号:US09523714B2

    公开(公告)日:2016-12-20

    申请号:US14155808

    申请日:2014-01-15

    CPC classification number: G01R1/072 G01R31/305 H01J33/00 H01J2237/164

    Abstract: A non-mechanical contact signal measurement apparatus includes a first conductor on a structure under test and a gas in contact with the first conductor. At least one electron beam is directed into the gas so as to induce a plasma in the gas where the electron beam passes through the gas. A second conductor is in electrical contact with the plasma. A signal source is coupled to an electrical measurement device through the first conductor, the plasma, and the second conductor when the plasma is directed on the first conductor. The electrical measurement device is responsive to the signal source.

    Abstract translation: 非机械接触信号测量装置包括被测结构上的第一导体和与第一导体接触的气体。 至少一个电子束被引导到气体中,以便在电子束通过气体的气体中引入等离子体。 第二导体与等离子体电接触。 当等离子体被引导到第一导体上时,信号源通过第一导体,等离子体和第二导体耦合到电测量装置。 电测量装置响应于信号源。

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