公开(公告)号：US07737549B2

公开(公告)日：2010-06-15

申请号：US12263060

申请日：2008-10-31

Applicant: James Douglas Wehrly, Jr. ,  James Wilder ,  Mark Wolfe ,  Paul Goodwin

Inventor： James Douglas Wehrly, Jr. ,  James Wilder ,  Mark Wolfe ,  Paul Goodwin

IPC: H01L23/34 ,  H05K7/20 ,  H01L21/00

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

Abstract translation: 灵活的电路采用集成电路（IC），并且触点沿柔性电路分布，以提供与应用环境的连接。 柔性电路围绕刚性衬底设置，将IC放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或多层集成电路。 衬底优选地由导热材料设计，并且一个或多个热扩散器与至少一些IC热接触。 可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。 在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的放大表面。

公开(公告)号：US07626259B2

公开(公告)日：2009-12-01

申请号：US12258189

申请日：2008-10-24

Applicant: James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

Inventor： James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

IPC: H01L23/34 ,  H01L21/00 ,  H05K7/20

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

Abstract translation: 灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。 衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

公开(公告)号：US20080291747A1

公开(公告)日：2008-11-27

申请号：US11753460

申请日：2007-05-24

Applicant: Paul Goodwin ,  Brian Miller ,  Robert Washburn

Inventor： Paul Goodwin ,  Brian Miller ,  Robert Washburn

IPC: G11C7/10

CPC classification number: G11C7/1051 ,  G11C5/04 ,  G11C7/1066

Abstract: A memory module having a DRAM device configured to generate a low DQS state on a DQS line, and a buffer coupled to the DRAM device, the buffer having a plurality of drivers, wherein the buffer is configured to detect the low DQS state by comparing the low DQS state to a low voltage level of one of the plurality of drivers.

Abstract translation: 一种存储器模块，其具有被配置为在DQS线上产生低DQS状态的DRAM器件，以及耦合到所述DRAM器件的缓冲器，所述缓冲器具有多个驱动器，其中所述缓冲器被配置为通过将所述低DQS状态进行比较来检测所述低DQS状态 低DQS状态到多个驱动器之一的低电压电平。

公开(公告)号：US20080278924A1

公开(公告)日：2008-11-13

申请号：US12147218

申请日：2008-06-26

Applicant: James W. Cady ,  Paul Goodwin

Inventor： James W. Cady ,  Paul Goodwin

IPC: H05K1/11

CPC classification number: H05K1/189 ,  G11C5/04 ,  H01L23/5387 ,  H01L25/0652 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.

Abstract translation: 柔性电路用多个集成电路管芯填充在一侧或两侧。 在优选的模式中，柔性电路装有倒装芯片。 柔性电路的一侧具有在具有边缘连接器触点的优选模式中实现的连接设备。 柔性电路围绕基板设置以形成电路模块，该电路模块可以插入诸如通常在计算机板上找到的边缘连接器。

公开(公告)号：US07446410B2

公开(公告)日：2008-11-04

申请号：US11283355

申请日：2005-11-18

Applicant: James Douglas Wehrly, Jr. ,  James Wilder ,  Mark Wolfe ,  Paul Goodwin

Inventor： James Douglas Wehrly, Jr. ,  James Wilder ,  Mark Wolfe ,  Paul Goodwin

IPC: H01L23/34 ,  H01L21/00 ,  H05K7/20

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

Abstract translation: 灵活的电路装有沿主要侧面或两侧设置的集成电路（IC）。 触点沿柔性电路分布，以提供模块与应用环境之间的连接。 填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或多层集成电路。 衬底形式优选地由导热材料设计，并且一个或多个热扩散器设置成与模块的组成集成电路中的至少一些热接触。 可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。 在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的扩大表面。

公开(公告)号：US20080093724A1

公开(公告)日：2008-04-24

申请号：US11682643

申请日：2007-03-06

Applicant: Leland Szewerenko ,  Paul Goodwin ,  James Douglas Wehrly

Inventor： Leland Szewerenko ,  Paul Goodwin ,  James Douglas Wehrly

IPC: H01L23/02

CPC classification number: H01L25/0657 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/4554

Abstract: The present invention provides a system and method for devising stackable assemblies that may be then stacked to create a stacked circuit module. One or more integrated circuit (IC) die are disposed on one or more sides of a redistribution substrate that is preferably flexible circuitry. In some preferred embodiments, the die and redistribution substrate are bonded together and wire-bond connected. Two or more stackable assemblies are interconnected through frame members to create low profile high density stacked circuit modules.

Abstract translation: 本发明提供了一种用于设计可堆叠组件的系统和方法，所述可堆叠组件可以被堆叠以产生堆叠电路模块。 一个或多个集成电路（IC）管芯设置在再分配衬底的一个或多个侧面上，其优选地是柔性电路。 在一些优选的实施方案中，将芯片和再分布基底结合在一起并进行引线键合。 两个或多个可堆叠组件通过框架构件相互连接，以产生低轮廓的高密度堆叠电路模块。

公开(公告)号：US20060250780A1

公开(公告)日：2006-11-09

申请号：US11124506

申请日：2005-05-06

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H05K7/02

CPC classification number: H01L25/105 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2201/2018 ,  H05K2203/1572 ,  H05K2203/302 ,  H01L2224/0401

Abstract: In some embodiments, a high density circuit module is provided having a support frame supporting a flexible circuit. A main integrated circuit and one or more supporting integrated circuit are mounted to the flexible circuit. Electrical connections between the main integrated circuit and the one or more integrated circuits are made on the flexible circuit. In other embodiments, a main integrated circuit such as, for example, a network processor, is mounted to a flexible circuit. Supporting integrated circuits, such as, for example, memory devices used by the network processor, are mounted on side portions of the flexible circuit. The side portions are folded to place the supporting integrated circuits higher than the main integrated circuit. Such placement may direct cooling airflow over the main integrated circuit's heat sink.

Abstract translation: 在一些实施例中，提供了具有支撑柔性电路的支撑框架的高密度电路模块。 主要集成电路和一个或多个支持集成电路安装到柔性电路。 主集成电路和一个或多个集成电路之间的电连接在柔性电路上制成。 在其他实施例中，诸如网络处理器的主要集成电路安装到柔性电路。 支持集成电路，例如网络处理器使用的存储器件，安装在柔性电路的侧部上。 侧面部分被折叠以使支撑集成电路比主集成电路高。 这种放置可以引导主集成电路的散热器上的冷却气流。

公开(公告)号：US20050117790A1

公开(公告)日：2005-06-02

申请号：US10949270

申请日：2004-09-23

Applicant: Carl Brown ,  Paul Goodwin

Inventor： Carl Brown ,  Paul Goodwin

IPC: G06T7/00 ,  G06T7/40 ,  G06K9/00 ,  G01N21/00

CPC classification number: G06K9/00 ,  G06T7/0012 ,  G06T7/41 ,  G06T2207/30072

Abstract: Expression profiling using DNA microarrays is an important new method for analyzing cellular physiology. In “spotted” microarrays, fluorescently labeled cDNA from experimental and control cells is hybridized to arrayed target DNA and the arrays imaged at two or more wavelengths. Statistical analysis is performed on microarray images and show that non-additive background, high intensity fluctuations across spots, and fabrication artifacts interfere with the accurate determination of intensity information. The probability density distributions generated by pixel-by-pixel analysis of images can be used to measure the precision with which spot intensities are determined. Simple weighting schemes based on these probability distributions are effective in improving significantly the quality of microarray data as it accumulates in a multi-experiment database. Error estimates from image-based metrics should be one component in an explicitly probabilistic scheme for the analysis of DNA microarray data.

公开(公告)号：US20050006595A1

公开(公告)日：2005-01-13

申请号：US10872329

申请日：2004-06-18

Applicant: Paul Goodwin ,  Carl Brown ,  Steven Reese

Inventor： Paul Goodwin ,  Carl Brown ,  Steven Reese

IPC: G01N15/14 ,  G01N21/64 ,  G01N33/50 ,  G01N33/58 ,  G06T5/00

CPC classification number: G01N33/582 ,  G01N15/1475 ,  G01N21/6428 ,  G01N21/6452 ,  G01N21/6458 ,  G01N33/5005 ,  G06T5/003 ,  G06T2207/10064 ,  G06T2207/30024

Abstract: A system and method employing photokinetic techniques in cell biology imaging applications are disclosed. Systems and methods of acquiring image data of an object may comprise: selectively inducing photoactivation of material at a site on the object; performing an optical axis integration scan; simultaneously executing a time delay integration scan sequence; and processing acquired image data in accordance with one or more desired analyses. Various methodologies and applications may include, inter alia, selective photobleaching of a site on the object, diffusion rate, velocity, and wave-front propagation analyses, multi-dimensional analyses of dispersion characteristics, biomolecular binding in cellular organelles, and photoactivation assisted systematic image segmentation for the study of cellular components.

Abstract translation: 公开了在细胞生物学成像应用中使用光动力学技术的系统和方法。 获取对象的图像数据的系统和方法可以包括：选择性地诱导物体上的物体的材料的光活化; 执行光轴积分扫描; 同时执行时间延迟积分扫描序列; 以及根据一个或多个期望的分析处理获取的图像数据。 各种方法和应用可以包括对物体上的位点的选择性漂白，扩散速率，速度和波前传播分析，分散特征的多维分析，细胞器中的生物分子结合和光活化辅助系统图像 细胞分析研究的细分。

公开(公告)号：US20130034841A1

公开(公告)日：2013-02-07

申请号：US13565104

申请日：2012-08-02

Applicant: Ronald C. Seubert ,  Jackie L. Stilwell ,  Paul Goodwin ,  Martha Stone ,  Arturo Bernardo Ramirez

Inventor： Ronald C. Seubert ,  Jackie L. Stilwell ,  Paul Goodwin ,  Martha Stone ,  Arturo Bernardo Ramirez

IPC: C12Q1/04 ,  C12M1/42 ,  C12M1/34 ,  C12Q1/70

CPC classification number: C12M47/04

Abstract: Systems and methods for isolating and characterizing various target materials of a suspension are disclosed. A suspension suspected of containing the target materials is added to a tube. A float with a specific gravity corresponding to that of the target material is inserted into the tube. The tube, float, and suspension are centrifuged together causing the various materials suspended in the suspension to separate into different layers along the axial length of the tube according to their specific gravities. The float and/or tube are configured to drive the various target materials to a region of space between the float and inner wall of the tube.

Abstract translation: 公开了用于分离和表征悬浮液的各种靶材料的系统和方法。 将疑似含有目标物质的悬浮液加入管中。 将具有对应于目标材料的比重的浮子插入管中。 将管，浮子和悬浮液离心在一起，使得悬浮在悬浮液中的各种材料根据其比重沿管的轴向长度分离成不同的层。 浮子和/或管构造成将各种目标材料驱动到管的浮子和内壁之间的空间区域。