公开(公告)号：US12135338B2

公开(公告)日：2024-11-05

申请号：US17912518

申请日：2021-03-23

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Sung Hyun Byun ,  Dong Hyeok Seo

IPC: G01R1/073 ,  G01R31/28

Abstract: Proposed are a probe head for testing, through a probe, a pattern formed on a wafer, and a probe card having the same. More particularly, proposed are a probe head in which formation of a guide hole into which a probe is inserted and insertion of the probe therein are facilitated, and a probe card having the same.

公开(公告)号：US11691387B2

公开(公告)日：2023-07-04

申请号：US17232029

申请日：2021-04-15

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: B32B15/04 ,  B32B15/20 ,  B32B3/26 ,  G01R1/073 ,  C25D11/04

CPC classification number: B32B15/043 ,  B32B3/266 ,  B32B15/20 ,  C25D11/04 ,  G01R1/07342 ,  B32B2255/06 ,  B32B2255/20

Abstract: Proposed are a laminated anodic aluminum oxide structure in which a plurality of anodic aluminum oxide films are stacked, a guide plate of a probe card using the same, and a probe card having the same. More particularly, proposed are a laminated anodic aluminum oxide structure with a high degree of surface strength, a guide plate of a probe card using the same, and a probe card having the same.

公开(公告)号：US11217464B2

公开(公告)日：2022-01-04

申请号：US16370810

申请日：2019-03-29

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01L21/67 ,  B65G47/91 ,  H01L33/62 ,  H01L27/12 ,  H01L25/075

Abstract: The present invention relates to a system for transferring a micro LED, the system not only releasing a grip force of a transfer head when transferring a micro LED to a substrate but also applying an additional force to the micro LED from below the substrate to attract the micro LED onto the substrate.

公开(公告)号：US11133209B2

公开(公告)日：2021-09-28

申请号：US16216376

申请日：2018-12-11

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01L21/677 ,  H01L25/075 ,  H01L33/06 ,  H01L33/44 ,  H01L33/40 ,  H01L33/42 ,  H01L21/683 ,  H01L27/15 ,  H01L33/00 ,  H01L21/67

Abstract: Disclosed is a transfer head for transferring micro-LEDs from a first substrate to a second substrate, particularly, using a vacuum adsorption method. The transfer head includes a porous member having a plurality of pores, in which the micro-LEDs are transferred by creating or releasing a vacuum pressure in the pore of the porous member.

公开(公告)号：US11049759B2

公开(公告)日：2021-06-29

申请号：US16447852

申请日：2019-06-20

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01L21/683 ,  H01L33/00 ,  B25J15/06

Abstract: The present invention relates to a micro LED transfer head transferring micro LEDs from a first substrate to a second substrate. According to the present invention, vacuum pressure of a grip region where the micro LEDs are gripped is uniformized, so that the micro LED transfer head transfers the micro LEDs efficiently. In addition, the vacuum pressure is distributed over a grip surface where the micro LEDs are gripped, thereby improving efficiency of transferring the micro LEDs.

公开(公告)号：US20190305178A1

公开(公告)日：2019-10-03

申请号：US16370674

申请日：2019-03-29

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01L33/00 ,  H01L33/20 ,  H01L21/02

Abstract: The present invention relates to a system having a transfer head for transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present invention relates to a system having a transfer head for transferring a micro LED, the system being configured such that the transfer head does not use an electrostatic force and preventing the generation of an electrostatic force which may cause a problem. In addition, the present invention relates to a system having a transfer head for transferring a micro LED, the system employing a suction structure using a suction force to transfer a micro LED by a porous member, thereby solving problems of the related art.

公开(公告)号：US10281418B2

公开(公告)日：2019-05-07

申请号：US15247530

申请日：2016-08-25

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01N27/12 ,  G01N33/00 ,  H05B3/03 ,  H05B3/26

Abstract: A micro heater includes a heater electrode formed on a first supporting portion. A micro sensor further includes a sensor electrode formed on the first supporting portion. In the micro heater and the micro sensor an anti-etching dam is formed on the supporting portion. The dam protects the shape of the first supporting portion during etching.

公开(公告)号：US10014455B2

公开(公告)日：2018-07-03

申请号：US14866073

申请日：2015-09-25

Applicant: Point Engineering Co., Ltd.

Inventor： Seung Ho Park ,  Tae Hwan Song ,  Sung Hyun Byun

IPC: H01L33/62 ,  H05K1/05 ,  H05K1/18 ,  H01L33/60 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H05K1/05 ,  H05K1/185 ,  H05K2201/09745 ,  H05K2201/10106

Abstract: A chip substrate includes conductive portions, an insulation portion and a cavity. The conductive portions are laminated in one direction to constitute the chip substrate. The insulation portion is interposed between the conductive portions to electrically isolate the conductive portions. The cavity is formed on an upper surface of the chip substrate at a predetermined depth in a region including the insulation portion. The cavity is defined by a plurality of continuously-extending curved surfaces having predetermined radii of curvature.

公开(公告)号：US20170131252A1

公开(公告)日：2017-05-11

申请号：US15344672

申请日：2016-11-07

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01N33/00 ,  H05B3/06 ,  H05B3/26 ,  H05B3/03

CPC classification number: G01N33/0027 ,  G01N27/123 ,  G01N27/128 ,  H05B3/03 ,  H05B3/06 ,  H05B3/26

Abstract: A micro heater includes a substrate formed of an anodized film and a heater electrode formed on the substrate and provided with a heat generation wiring line. The heat generation wiring line is formed in a laminated state. Also disclosed are a micro sensor and a micro sensor manufacturing method.

公开(公告)号：US11860192B2

公开(公告)日：2024-01-02

申请号：US17161460

申请日：2021-01-28

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01R1/073

CPC classification number: G01R1/07314

Abstract: Proposed are a probe head and a probe card having the same. According to the present disclosure, the probe head of the probe card includes: an upper guide plate having an upper guide hole; a lower guide plate having a lower guide hole; and an intermediate guide plate having an intermediate guide hole and provided between the upper guide plate and the lower guide plate, wherein each of a plurality of probes sequentially passes through the upper guide hole, the intermediate guide hole, and the lower guide hole, and the intermediate guide plate is made of an anodic oxide film.