公开(公告)号：US11437336B2

公开(公告)日：2022-09-06

申请号：US16886782

申请日：2020-05-29

Applicant: Powertech Technology Inc.

Inventor： Jeffrey Wang ,  Jen-I Huang ,  Kun-Yung Huang

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package structure includes a first redistribution layer, a plurality of conductive connectors, a chip, and an encapsulant. The first redistribution layer has a first surface and a second surface opposite to the first surface. The first redistribution layer includes at least one conductive pattern and at least one dielectric layer stacked on each other. The conductive pattern includes a plurality of landing pads, and each of the landing pads is separated from the dielectric layer. The conductive connectors are located on the first surface. Each of the conductive connectors is corresponding to and electrically connected to one of the landing pads. The chip is located on the first surface. The chip is electrically connected to the first redistribution layer. The encapsulant encapsulates the chip and the conductive connectors. A manufacturing method of a semiconductor package structure is also provided.

公开(公告)号：US20210343674A1

公开(公告)日：2021-11-04

申请号：US16886782

申请日：2020-05-29

Applicant: Powertech Technology Inc.

Inventor： Jeffrey Wang ,  Jen-I Huang ,  Kun-Yung Huang

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package structure includes a first redistribution layer, a plurality of conductive connectors, a chip, and an encapsulant. The first redistribution layer has a first surface and a second surface opposite to the first surface. The first redistribution layer includes at least one conductive pattern and at least one dielectric layer stacked on each other. The conductive pattern includes a plurality of landing pads, and each of the landing pads is separated from the dielectric layer. The conductive connectors are located on the first surface. Each of the conductive connectors is corresponding to and electrically connected to one of the landing pads. The chip is located on the first surface. The chip is electrically connected to the first redistribution layer. The encapsulant encapsulates the chip and the conductive connectors. A manufacturing method of a semiconductor package structure is also provided.