公开(公告)号：US10591699B2

公开(公告)日：2020-03-17

申请号：US15833768

申请日：2017-12-06

Applicant: Primax Electronics Ltd.

Inventor： Ying-Shou Chen ,  Shu-Ying Chen

IPC: G02B7/10 ,  G03B3/10 ,  G02B27/64 ,  G02B7/09 ,  G02B13/00 ,  G03B13/36 ,  G02B7/08

Abstract: The present invention provides an image focusing method that is applied to an image capture device having an optical image stabilization (OIS) function, including: driving the at least one optical lens to tilt by an angle in response to a first selected target and a second selected target, and enabling a first light beam group from the first selected target and a second light beam group from the second selected target to be focused on a same imaging surface after passing through the at least one optical lens. In addition, the present invention further provides an image capture device and an electronic device that apply the foregoing method.

公开(公告)号：US20190086632A1

公开(公告)日：2019-03-21

申请号：US15833768

申请日：2017-12-06

Applicant: Primax Electronics Ltd.

Inventor： Ying-Shou Chen ,  Shu-Ying Chen

IPC: G02B7/10 ,  G03B3/10 ,  G02B7/09 ,  G02B27/64

Abstract: The present invention provides an image focusing method that is applied to an image capture device having an optical image stabilization (OIS) function, including: driving the at least one optical lens to tilt by an angle in response to a first selected target and a second selected target, and enabling a first light beam group from the first selected target and a second light beam group from the second selected target to be focused on a same imaging surface after passing through the at least one optical lens. In addition, the present invention further provides an image capture device and an electronic device that apply the foregoing method.

公开(公告)号：US20190075223A1

公开(公告)日：2019-03-07

申请号：US15830618

申请日：2017-12-04

Applicant: Primax Electronics Ltd.

Inventor： Shu-Ying Chen

IPC: H04N5/225 ,  G02B7/02

Abstract: A camera module includes a substrate, a sensing chip, an electronic component, a base plate and a lens module. The sensing chip is disposed on a first surface of the substrate. The electronic component is disposed on a second surface of the substrate. The base plate covers the second surface of the substrate. The base plate includes an opening. The electronic component is received within the base plate through the opening. The lens module covers the first surface of the substrate. Since the electronic component is installed on the second surface of the substrate, the electronic component is not covered by the lens module. Since the substrate with small volume is used in the camera module, the volume of the camera module is reduced.