公开(公告)号：US12136718B2

公开(公告)日：2024-11-05

申请号：US17485630

申请日：2021-09-27

Applicant: Purdue Research Foundation

Inventor： Xiulin Ruan ,  Amy Marie Marconnet ,  Tingting Du ,  Luis Delgado

IPC: H01M10/6551 ,  H01M10/613 ,  H01M10/653

Abstract: Variable thermal resistors, systems, and methods suitable for modulating heat transport between a heat source and a heat sink based on a degree of compression of a reversibly-compressible, open-pore graphene foam within the variable thermal resistors. The variable thermal resistor is configured to controllably vary heat transport therethrough by controlling the degree of compression of the graphene foam.

公开(公告)号：US20220102775A1

公开(公告)日：2022-03-31

申请号：US17485630

申请日：2021-09-27

Applicant: Purdue Research Foundation

Inventor： Xiulin Ruan ,  Amy Marie Marconnet ,  Tingting Du ,  Luis Delgado

IPC: H01M10/6551 ,  H01M10/613 ,  H01M10/653

Abstract: Variable thermal resistors, systems, and methods suitable for modulating heat transport between a heat source and a heat sink based on a degree of compression of a reversibly-compressible, open-pore graphene foam within the variable thermal resistors. The variable thermal resistor is configured to controllably vary heat transport therethrough by controlling the degree of compression of the graphene foam.

公开(公告)号：US20250055064A1

公开(公告)日：2025-02-13

申请号：US18933069

申请日：2024-10-31

Applicant: Purdue Research Foundation

Inventor： Xiulin Ruan ,  Amy Marie Marconnet ,  Tingting Du ,  Luis Delgado

IPC: H01M10/6551 ,  H01M10/613 ,  H01M10/653

Abstract: Variable thermal resistors, systems, and methods suitable for modulating heat transport between a heat source and a heat sink based on a degree of compression of a reversibly-compressible, open-pore graphene foam within the variable thermal resistors. The variable thermal resistor is configured to controllably vary heat transport therethrough by controlling the degree of compression of the graphene foam.

公开(公告)号：US11243032B2

公开(公告)日：2022-02-08

申请号：US16905824

申请日：2020-06-18

Applicant: Purdue Research Foundation

Inventor： Collier Stephen Miers ,  Amy Marie Marconnet

IPC: F28F1/02 ,  H05K7/20 ,  H01L23/367 ,  H01L23/427

Abstract: Heat sink devices that use a phase change material (PCM) as a heat sink material, and methods of using such devices in thermal management applications. Such a heat sink device includes a base wall, a top wall spaced apart from the base wall, and an internal structure in intimate thermal and physical contact with the base wall and the top wall. The internal structure includes multiple compartments defined and separated by fins that extend between the base and top walls. At least one PCM is within the compartments and the fins serve as thermal enhancement structures to augment the surface area to volume ratio of the heat sink device.

公开(公告)号：US20210372709A1

公开(公告)日：2021-12-02

申请号：US17330842

申请日：2021-05-26

Applicant: Purdue Research Foundation

Inventor： Soumya Bandyopadhyay ,  Amy Marie Marconnet ,  Justin A. Weibel

IPC: F28D15/02 ,  F28D15/04

Abstract: A vapor chamber device having a first vapor core configured to passively spread heat from a localized first input area to a relatively larger first output area adjacent to and in thermal contact with a heat output side of the vapor chamber device, and a second vapor core configured to passively spread heat from a localized second input area adjacent to and in thermal contact with a heat input side of the vapor chamber device to a relatively larger second output area in thermal contact with the first input area of the first vapor core. The second vapor core is configured to attenuate high heat flux hotspots on the first input area before the heat fluxes thereof pass through the second output area of the second vapor core to the first input area of the first vapor core.