Processes and systems for double-pulse laser micro sintering

    公开(公告)号:US11440099B2

    公开(公告)日:2022-09-13

    申请号:US16427638

    申请日:2019-05-31

    Inventor: Benxin Wu

    Abstract: Processes and systems that include one or more laser beam sources configured to provide laser irradiation with one or more laser pulse groups to at least a portion of powder particles on a solid surface at one or multiple locations thereof. Sintering laser pulse(s) is provided to induce coalition of at least some of the powder particles into a more continuous medium, and pressing laser pulse(s) is provided to produce pressure pulse(s) on at least a portion of the powder particles and/or the more continuous medium. Laser pulse groups may include one or more of the sintering laser pulses followed by one or more of the pressing laser pulses with a time delay between a last of the sintering laser pulse(s) and a first of the pressing laser pulse(s).

    PROCESSES AND SYSTEMS FOR DOUBLE-PULSE LASER MICRO SINTERING

    公开(公告)号:US20200009655A1

    公开(公告)日:2020-01-09

    申请号:US16427638

    申请日:2019-05-31

    Inventor: Benxin Wu

    Abstract: Processes and systems that include one or more laser beam sources configured to provide laser irradiation with one or more laser pulse groups to at least a portion of powder particles on a solid surface at one or multiple locations thereof. Sintering laser pulse(s) is provided to induce coalition of at least some of the powder particles into a more continuous medium, and pressing laser pulse(s) is provided to produce pressure pulse(s) on at least a portion of the powder particles and/or the more continuous medium. Laser pulse groups may include one or more of the sintering laser pulses followed by one or more of the pressing laser pulses with a time delay between a last of the sintering laser pulse(s) and a first of the pressing laser pulse(s).

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