公开(公告)号：US20250055064A1

公开(公告)日：2025-02-13

申请号：US18933069

申请日：2024-10-31

Applicant: Purdue Research Foundation

Inventor： Xiulin Ruan ,  Amy Marie Marconnet ,  Tingting Du ,  Luis Delgado

IPC: H01M10/6551 ,  H01M10/613 ,  H01M10/653

Abstract: Variable thermal resistors, systems, and methods suitable for modulating heat transport between a heat source and a heat sink based on a degree of compression of a reversibly-compressible, open-pore graphene foam within the variable thermal resistors. The variable thermal resistor is configured to controllably vary heat transport therethrough by controlling the degree of compression of the graphene foam.

公开(公告)号：US12136718B2

公开(公告)日：2024-11-05

申请号：US17485630

申请日：2021-09-27

Applicant: Purdue Research Foundation

Inventor： Xiulin Ruan ,  Amy Marie Marconnet ,  Tingting Du ,  Luis Delgado

IPC: H01M10/6551 ,  H01M10/613 ,  H01M10/653

Abstract: Variable thermal resistors, systems, and methods suitable for modulating heat transport between a heat source and a heat sink based on a degree of compression of a reversibly-compressible, open-pore graphene foam within the variable thermal resistors. The variable thermal resistor is configured to controllably vary heat transport therethrough by controlling the degree of compression of the graphene foam.

公开(公告)号：US20220102775A1

公开(公告)日：2022-03-31

申请号：US17485630

申请日：2021-09-27

Applicant: Purdue Research Foundation

Inventor： Xiulin Ruan ,  Amy Marie Marconnet ,  Tingting Du ,  Luis Delgado

IPC: H01M10/6551 ,  H01M10/613 ,  H01M10/653

Abstract: Variable thermal resistors, systems, and methods suitable for modulating heat transport between a heat source and a heat sink based on a degree of compression of a reversibly-compressible, open-pore graphene foam within the variable thermal resistors. The variable thermal resistor is configured to controllably vary heat transport therethrough by controlling the degree of compression of the graphene foam.