In-situ Combined Sensing of Uniaxial Nanomechanical and Micromechanical Stress with Simultaneous Measurement of Surface Temperature Profiles by Raman Shift in Nanoscale and Microscale Structures
    4.
    发明申请
    In-situ Combined Sensing of Uniaxial Nanomechanical and Micromechanical Stress with Simultaneous Measurement of Surface Temperature Profiles by Raman Shift in Nanoscale and Microscale Structures 有权
    单轴纳米机械和微机械应力的原位组合感应,通过纳米尺度和微尺度结构中的拉曼位移同时测量表面温度分布

    公开(公告)号:US20160018334A1

    公开(公告)日:2016-01-21

    申请号:US14800088

    申请日:2015-07-15

    CPC classification number: G01N21/65 G01K13/00 G01L1/24

    Abstract: Embodiments of the present disclosure include separating a measured Raman shift signal into mechanical and thermal components when a uniaxial compressive load is applied in situ. In some embodiments, in situ uniaxial compressive loads are applied on examined specimens from room temperature to 150° C. In alternate embodiments, Raman shift measurements are performed as a function of strain at constant temperature and/or as a function of temperature at constant strain levels. It was realized that the Raman shift measured at a given temperature under a given level of applied stress can be expressed as a summation of stress-induced Raman shift signal and temperature-induced Raman shift signal measured separately. Such a separation of Raman shift signal is utilized by various embodiments to measure localized change in thermal conductivity and/or mechanical stress of structures (e.g., semiconductor structures) under applied stress.

    Abstract translation: 本公开的实施例包括当原位施加单轴压缩载荷时将测量的拉曼移位信号分离成机械和热分量。 在一些实施例中,将原位单轴压缩载荷施加在从室温至150℃的检查样品上。在替代实施例中,拉曼位移测量作为恒定温度下的应变和/或恒定应变下的温度的函数进行 水平。 已经认识到,在给定的施加应力水平下在给定温度下测量的拉曼位移可以表示为单独测量的应力诱导拉曼位移信号和温度诱导拉曼移位信号的总和。 拉曼移位信号的这种分离被各种实施例用于测量施加的应力下的结构(例如,半导体结构)的热导率和/或机械应力的局部变化。

    Arrangement for lithium-ion battery thermal events prediction, prevention, and control

    公开(公告)号:US11431040B2

    公开(公告)日:2022-08-30

    申请号:US16557954

    申请日:2019-08-30

    Abstract: A battery having a thermal protection arrangement is disclosed which includes a housing, a first electrode, a second electrode, a polymer porous separator positioned between the first electrode and the second electrode, an electrolyte interspersed between the first electrode, the second electrode, and the polymer porous separator, at least one sensor holder having an electrode side and a housing side, with at least one cavity provided on the electrode side, the at least one sensor holder in firm contact with the first electrode or the second electrode, and at least one temperature sensor placed in the at least one cavity of the at least one sensor holder, the at least one cavity sized such that the outer surface of the temperature sensor being flush with remaining surface of the at least one sensor holder, and wherein the at least one temperature sensor has no contact with the polymer porous separator.

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