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公开(公告)号：US20250040081A1
公开(公告)日：2025-01-30
申请号：US18471206
申请日：2023-09-20
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Herman Tan
IPC: H05K7/20
Abstract: An information technology (IT) system is directed to immersion cooling and includes a chassis forming an enclosure between an upstream side and a downstream side. The chassis has a rear opening formed along the downstream side and is configured to receive heat-generating components of the IT system adjacent to the upstream side within the enclosure. The system further includes a supply conduit for delivering an immersion coolant to the upstream side within the enclosure, and a flap mechanism attached to the downstream side near the rear opening. The flap mechanism is movable between an open position and a closed position, which allows accumulated coolant to drain from the chassis in the open position and prevents the accumulated coolant from draining from the chassis in the closed position.
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公开(公告)号：US11921552B2
公开(公告)日：2024-03-05
申请号：US17825836
申请日：2022-05-26
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Jen-Hui Wang
CPC classification number: G06F1/20 , G06F1/187 , G06F1/206 , H05K7/20145
Abstract: A computer chassis includes walls defining an airspace containing heat-generating components (e.g., storage drives). The airspace is divided into first and second regions, such as by a printed circuit board supporting the heat-generating components within the first region. An air input feeds both the first region and second region. Input air going through the first region first passes by a forward set of heat-generating components before continuing to a rearward set of heat-generating components to extract heat therefrom. Input air going through the second region bypasses the forward set of heat-generating components before being directed out through an air opening partway down the length of the chassis, after which this air passes by a rearward set of heat-generating components to extract heat.
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公开(公告)号：US11871536B2
公开(公告)日：2024-01-09
申请号：US17660631
申请日：2022-04-25
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Cheng-Yu Wen , Hung-Yuan Chen
IPC: H05K7/20 , H01L23/473 , F28F3/12
CPC classification number: H05K7/20254 , H01L23/473 , H05K7/20772 , F28F3/12
Abstract: A cooling system for a heat-generating electronic device includes a cold plate module, a flow channel, and a fin arrangement. The cold plate module includes a base plate and a top cover. The flow channel is for a liquid coolant and extends between an inlet connector and an outlet connector. The liquid coolant flows along a flow direction. The fin arrangement is located between the base plate and the top cover. The fin arrangement is thermally coupled to the flow channel and is eccentrically located relative to the cold plate module.
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公开(公告)号：US11553620B2
公开(公告)日：2023-01-10
申请号：US17236509
申请日：2021-04-21
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Tsung-Ta Li , Guo-Xiang Hu
IPC: H05K7/20
Abstract: An immersion liquid cooling tank assembly includes a generally elliptical tank, at least one condenser including a plurality of condenser tubes, at least one cooling fan adjacent to the condenser, a manifold system coupled to the at least one condenser to assist in distributing liquid flow to and from the plurality of condenser tubes, and a top cover disposed over the generally elliptical tank. The top cover includes an air baffle.
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公开(公告)号：US11306828B2
公开(公告)日：2022-04-19
申请号：US17139758
申请日：2020-12-31
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung Chen , Yu-Nien Huang
Abstract: A quick-connector comprises a first body portion, a second body portion, and a ball valve. The first body portion defines a first fluid channel. The second body portion defines a second fluid channel. The second body portion is coupled to the first body portion such that the first fluid channel is aligned with the second fluid channel. The first fluid channel and the second fluid channel form a fluid channel extending through the quick-connector. The ball valve is positioned in the fluid channel extending through the quick-connector. Movement of the first body portion and the second body portion relative to each other causes the ball valve to move between a flow position and a sealed position. In the flow position, the ball valve allows fluid to flow through the quick-connector. In the sealed position, the ball valve prevents fluid from flowing through the quick-connector.
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Patent Agency Ranking
公开(公告)号：US11219142B2
公开(公告)日：2022-01-04
申请号：US16856804
申请日：2020-04-23
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Yung-Hsiang Lu
IPC: H05K7/20
Abstract: An equipment assembly that allows easier replacement of heat-generating electrical components is disclosed. The assembly includes a rack for containing a heat-generating electrical component. The component includes a coolant inlet, a coolant outlet, and a drain connector. A cold manifold supplies coolant to the heat-generating electrical component through the coolant inlet. A hot manifold collects coolant from the heat-generating electrical component through the coolant outlet. A drain manifold includes a coupler. The coolant inlet and the coolant outlet are disconnected from the cold and hot manifolds. The drain connector is fluidly connected to the drain manifold to drain coolant from the heat-generating electrical component before the heat-generating electrical component is removed from the rack.
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公开(公告)号：US11102909B2
公开(公告)日：2021-08-24
申请号：US15939690
申请日：2018-03-29
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Herman Tan , Yung-Hsiang Lu
Abstract: An air duct that can be attached to existing grille of an electronic device to improve airflow and reduce overall system impedance/pressure drop without increasing the power to an air mover. The air duct has a wall configuration to smooth-out airflow while simultaneously delivering more airflow to selected portions of the interior of an electronic device, such as a server.
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公开(公告)号：US20210092868A1
公开(公告)日：2021-03-25
申请号：US16743958
申请日：2020-01-15
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien Huang , Tsung-Ta LI , Kuo-Wei LEE
Abstract: A fan arrangement to generate increased airflow in a chassis is disclosed. The chassis includes one area having electronic components. A first row of fan modules is located in the chassis relative to the electronic components to generate airflow in a direction of the length of the chassis through the electronic components. The first row of fan modules includes at least one gap between the fan modules. A second row of fan modules is located a predetermined distance from the first row. The second row of fan modules includes at least one gap between the fan modules. Each of the fan modules in the second row is staggered from one of the fan modules of the first row. A first panel connects one of fan modules in the first row with one of the fan modules of the second row to create a channel.
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公开(公告)号：US10779439B2
公开(公告)日：2020-09-15
申请号：US16114962
申请日：2018-08-28
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Erh-Kai Fang
IPC: H05K7/20
Abstract: An apparatus for cooling an electronic component is provided. The apparatus includes a heat-absorbing base configured to contact the electronic component within a server device and a heat-dissipating body connected to the heat-absorbing base. The heat-dissipating body includes a heat-dissipating static feature and at least one heat-dissipating dynamic feature. The at least one heat-dissipating dynamic feature is configured to be repositioned about the heat-dissipating static feature to increase a surface area of the heat-dissipating body. Using hinge device and flexible metal conduit connect and transfer heat to them (dynamic and static feature). This apparatus will follow currently assembly process and also not impact the other device assembly method. The more space we have inside the product the more heat we can solve.
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公开(公告)号：US20200214177A1
公开(公告)日：2020-07-02
申请号：US16413238
申请日：2019-05-15
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien Huang , Ching-Yu CHEN , Tsung-Ta LI
IPC: H05K7/20
Abstract: A dynamic air impedance mechanism is provided which has particular utility in changing the impedance of air flow within servers. The mechanism comprises an air duct having a plurality of vent holes, a control plate defining a plurality of openings, and relative movement between the openings in the control plate and the corresponding vent holes in the air duct to change the impedance of air flow through the server.
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