公开(公告)号：US20180068867A1

公开(公告)日：2018-03-08

申请号：US15688238

申请日：2017-08-28

Applicant: R&D CIRCUITS, INC.

Inventor： Donald Thompson ,  Cosimo Cantatore

IPC: H01L21/48 ,  H01R12/70 ,  H01R12/52 ,  H01R13/11 ,  H01R13/24

CPC classification number: H01L21/486 ,  B33Y80/00 ,  G01R1/0483 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16227 ,  H01L2224/1623 ,  H01L2224/16235 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01R12/52 ,  H01R12/7082 ,  H01R13/112 ,  H01R13/2414 ,  H05K1/092 ,  H05K3/4069 ,  H05K7/1061 ,  H05K2203/107 ,  H05K2203/1131

Abstract: The present invention provides for a structure and a mechanism by which by utilizing additive manufacturing processes electrical connections are created that connect the top and bottom of a block in a customizable pattern. Specifically connection points can be created on the surface of the block and route them to alternate locations transforming the original pattern to a smaller, larger, or alternate pattern.

公开(公告)号：US20250085332A1

公开(公告)日：2025-03-13

申请号：US18958656

申请日：2024-11-25

Applicant: R & D Circuits, Inc.

Inventor： Donald Thompson ,  Thomas Smith

IPC: G01R31/28 ,  G01R31/70 ,  H05K3/00 ,  H05K3/42

Abstract: A method for detecting failed back-drills in PCBs in the process of fabricating a PCB so that the failed back-drill can be screened out or repaired. A short to ground connection is added for every back-drill via that will be cut when the back-drill removes the via stub. If the back-drill is bad or failed the short to ground will fail the subsequent electrical tests. The PCB can be repaired by re-drilling the hole or via. Failed back-drills may be detected in the manufacturing stage using standard equipment and test procedures. This process creates a simple pass-fail measurement that uses an existing common test process to catch failed back drills in the PCB fabrication facility. This allows for easy and cost-effective repair and guarantees back-drill failures do not pass into the field.

公开(公告)号：US10559476B2

公开(公告)日：2020-02-11

申请号：US15688238

申请日：2017-08-28

Applicant: R&D Circuits, Inc.

Inventor： Donald Thompson ,  Cosimo Cantatore

IPC: H01L21/48 ,  H01R12/52 ,  H01R12/70 ,  H01R13/11 ,  H01R13/24

Abstract: The present invention provides for a structure and a mechanism by which by utilizing additive manufacturing processes electrical connections are created that connect the top and bottom of a block in a customizable pattern. Specifically connection points can be created on the surface of the block and route them to alternate locations transforming the original pattern to a smaller, larger, or alternate pattern.