公开(公告)号：US11156568B2

公开(公告)日：2021-10-26

申请号：US16844484

申请日：2020-04-09

Applicant: REDLEN TECHNOLOGIES, INC.

Inventor： Krzysztof Iniewski ,  Michael Ayukawa ,  Conny Hansson

IPC: G01N23/20008 ,  G01N23/207

Abstract: Various aspects include methods and devices for reducing the scanning time for an X-ray diffraction scanner system by increasing the count rate or efficiency of the energy discriminating X-ray detector. In a first embodiment, the count rate of the energy discriminating X-ray detector is increased by increasing the number of detectors counting X-ray scatter photon in particular energy bins by configuring individual pixel detectors within a 2-D X-ray detector array to count photons within specific energy bins. In a second embodiment, the gain of amplifier components in the detector processing circuitry is increased in order to increase the energy resolution of the detector. In a third embodiment, the individual pixel detectors within a 2-D X-ray detector array are configured to count photons within specific energy bins and the gain of amplifier components in the detector processing circuitry is increased in order to increase the energy resolution of the detector.

公开(公告)号：US11474050B2

公开(公告)日：2022-10-18

申请号：US17193219

申请日：2021-03-05

Applicant: REDLEN TECHNOLOGIES, INC.

Inventor： Christopher Read ,  Keira Flanagan ,  Michael Ayukawa ,  Jeffrey Allan Walton

IPC: G01N23/046 ,  G01N23/083

Abstract: A radiation detector module includes a frame, a module circuit board connected to the frame, detector units that each include radiation sensors disposed above the frame and electrically connected to the module circuit board, and an optically and infrared radiation opaque, X-ray transparent, electrically insulating detector shield covering a top surface and at least one side surface of the radiation sensors.

公开(公告)号：US10203420B2

公开(公告)日：2019-02-12

申请号：US15592368

申请日：2017-05-11

Applicant: REDLEN TECHNOLOGIES, INC.

Inventor： Pinghe Lu ,  Michael Ayukawa ,  Christopher Read ,  Robert Crestani ,  Jeffrey Walton

IPC: C09J7/00 ,  G01T1/17 ,  B29C65/48 ,  B29L31/34

Abstract: A cathode conductive strip can be attached to a semiconductor radiation sensor by using a double sided dual adhesive electrically conductive tape in a sensor assembly or a detector module to provide reliable electrical connection between the semiconductor radiation sensor and the cathode conductive strip. The double sided dual adhesive electrically conductive tape includes an electrically conductive backing with two different adhesion strength adhesives on both sides. The high adhesion strength side is bonded to the cathode electrode of the semiconductor radiation sensor. The lower adhesion strength side is bonded to the conductive face of the cathode conductive strip.

公开(公告)号：US11733408B2

公开(公告)日：2023-08-22

申请号：US17225416

申请日：2021-04-08

Applicant: REDLEN TECHNOLOGIES, INC.

Inventor： Krzysztof Iniewski ,  Michael K. Jackson ,  Michael Ayukawa

IPC: G01T1/29 ,  H01L27/146

CPC classification number: G01T1/2928 ,  H01L27/1463 ,  H01L27/14658 ,  H01L27/14696

Abstract: A radiation detector includes a semiconductor layer having opposing first and second surfaces, anodes disposed over the first surface of the semiconductor layer in a pixel pattern, a cathode disposed over the second surface of the semiconductor layer, and an electrically conductive pattern disposed over the first surface of the semiconductor layer in interpixel gaps between the anodes. At least a portion of the electrically conductive pattern is not electrically connected to an external bias source.

公开(公告)号：US11067707B2

公开(公告)日：2021-07-20

申请号：US15972717

申请日：2018-05-07

Applicant: REDLEN TECHNOLOGIES, INC.

Inventor： Robert Crestani ,  Christopher Read ,  Michael Ayukawa ,  Glenn Bindley ,  Krzysztof Iniewski

IPC: G01T1/17 ,  G01T1/24 ,  G01T1/20

Abstract: A radiation detector unit includes an interposer, at least one radiation sensor bonded to a front side of an interposer, an application-specific integrated chip (ASIC) bonded to a backside of the interposer, a carrier board bonded to the backside of the interposer and located on a backside of the ASIC, and at least one flex cable assembly attached to a respective side of the carrier board.