公开(公告)号：US09332648B2

公开(公告)日：2016-05-03

申请号：US14403922

申请日：2013-02-14

Applicant: RMT Limited

Inventor： Vasiliy Sergeevich Anosov ,  Vasiliy Vasilevich Volodin ,  Gennadiy Gyusamovich Gromov ,  Elena Vladmirovna Mazikina ,  Aleksandr Aleksandrovich Nazarenko ,  Sergey Sergeevich Ryabov

IPC: H05K3/02 ,  H05K3/06 ,  H05K3/24 ,  H01L23/498 ,  H01L21/48 ,  H05K1/03

CPC classification number: H05K3/065 ,  H01L21/4846 ,  H01L23/498 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/244 ,  H05K2201/0338 ,  H05K2203/107 ,  Y10T29/49156 ,  H01L2924/00

Abstract: The method for producing conductive tracks includes applying continuous metallization layers to a non-conductive substrate, forming a metallization pattern, and applying to the formed tracks a protective barrier layer and a layer for soldering and/or welding elements of parts to the conductive tracks. The continuous metallization layers are applied by consecutively applying an adhesive layer, a conductive layer, and a metal layer, acting as a mask, to the non-conductive substrate. To form the metallization pattern, a mask is formed by laser ablation on sections of the metal layer not occupied by conductive tracks, then selective chemical etching removes the conductive layer and adhesive sublayer from the exposed sections, and selective chemical etching removes the mask, after which the protective barrier layer and layer for soldering and/or welding are applied.

Abstract translation: 用于制造导电迹线的方法包括将连续的金属化层施加到非导电基底上，形成金属化图案，以及向形成的轨道施加保护性阻挡层和用于将元件的元件焊接和/或焊接到导电迹线的层。 连续金属化层通过连续施加作为掩模的粘合剂层，导电层和金属层施加到非导电基材上。 为了形成金属化图案，在未被导电轨迹占据的金属层的部分上通过激光烧蚀形成掩模，然后选择性化学蚀刻从暴露部分去除导电层和粘合剂子层，并且选择性化学蚀刻除去掩模 其中施加用于焊接和/或焊接的保护屏障层和层。

公开(公告)号：US20150173202A1

公开(公告)日：2015-06-18

申请号：US14403922

申请日：2013-02-14

Applicant: RMT Limited

Inventor： Vasiliy Sergeevich Anosov ,  Vasiliy Vasilevich Volodin ,  Gennadiy Gyusamovich Gromov ,  Elena Vladmirovna Mazikina ,  Aleksandr Aleksandrovich Nazarenko ,  Sergey Sergeevich Ryabov

IPC: H05K3/06 ,  H05K3/24

CPC classification number: H05K3/065 ,  H01L21/4846 ,  H01L23/498 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/244 ,  H05K2201/0338 ,  H05K2203/107 ,  Y10T29/49156 ,  H01L2924/00

Abstract: The invention forms conductive tracks in electronics and microelectronics for the commutation of electronic circuits and semiconductor devices. The method for producing conductive tracks includes applying continuous metallization layers to a non-conductive substrate, forming a metallization pattern, and applying to the formed tracks a protective barrier layer and a layer for soldering and/or welding elements of parts to the conductive tracks. The continuous metallization layers are applied by consecutively applying an adhesive layer, a conductive layer, and a metal layer, acting as a mask, to the non-conductive substrate. To form the metallization pattern, a mask is formed by laser ablation on sections of the metal layer not occupied by conductive tracks, then selective chemical etching removes the conductive layer and adhesive sublayer from the exposed sections, and selective chemical etching removes the mask, after which the protective barrier layer and layer for soldering and/or welding are applied.

Abstract translation: 本发明在用于电子电路和半导体器件的换向的电子和微电子中形成导电轨迹。 用于制造导电迹线的方法包括将连续的金属化层施加到非导电基底上，形成金属化图案，以及向形成的轨道施加保护性阻挡层和用于将元件的元件焊接和/或焊接到导电迹线的层。 连续金属化层通过连续施加作为掩模的粘合剂层，导电层和金属层施加到非导电基材上。 为了形成金属化图案，在未被导电轨迹占据的金属层的部分上通过激光烧蚀形成掩模，然后选择性化学蚀刻从暴露部分去除导电层和粘合剂子层，并且选择性化学蚀刻除去掩模 其中施加用于焊接和/或焊接的保护屏障层和层。