公开(公告)号：US09698173B2

公开(公告)日：2017-07-04

申请号：US14593812

申请日：2015-01-09

Applicant: ROYOLE CORPORATION

Inventor： Peng Wei ,  Xiaojun Yu ,  Ze Yuan ,  Jigang Zhao ,  Haojun Luo ,  Zihong Liu

IPC: H01L27/12 ,  H01L49/02 ,  H01L29/786 ,  H01L21/283 ,  H01L21/441 ,  H01L27/32

CPC classification number: H01L27/1255 ,  H01L21/283 ,  H01L21/441 ,  H01L27/124 ,  H01L27/1288 ,  H01L27/3248 ,  H01L27/3276 ,  H01L28/60 ,  H01L29/45 ,  H01L29/458 ,  H01L29/78669 ,  H01L29/78678 ,  H01L29/78684 ,  H01L2227/323

Abstract: A thin film transistor (TFT) device is provided. The TFT device includes a first conductive layer including a gate electrode and a connection pad. The TFT device further includes a first dielectric layer covering the gate electrode, and a semiconductor layer disposed on the dielectric layer and overlapping the gate electrode. The TFT device further includes a second dielectric layer disposed on the semiconductor layer and the first dielectric layer so as to expose first and second portions of the semiconductor layer and the connection pad. The TFT device further includes a second conductive layer which includes a source electrode portion covering the first portion of the semiconductor layer; a pixel electrode portion extending to the source electrode portion; a drain electrode portion covering the second portion of the semiconductor layer; and an interconnection portion disposed on the connection pad and extending to the drain electrode portion.

公开(公告)号：US09594287B2

公开(公告)日：2017-03-14

申请号：US14507608

申请日：2014-10-06

Applicant: ROYOLE CORPORATION

Inventor： Xiaojun Yu ,  Peng Wei ,  Ze Yuan ,  Zihong Liu

IPC: H01L27/32 ,  G02F1/167 ,  H01L51/52 ,  G02F1/1368 ,  H01L51/00 ,  H01L51/56 ,  B29D11/00 ,  B32B17/10 ,  G02F1/1333 ,  G02F1/136

CPC classification number: G02F1/167 ,  B29D11/0073 ,  B32B17/10504 ,  G02F1/133305 ,  G02F1/133345 ,  G02F1/1368 ,  G02F2001/13613 ,  G02F2201/501 ,  G02F2202/022 ,  G02F2202/28 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/5256 ,  H01L2227/326 ,  Y02E10/549 ,  Y02P70/521

Abstract: A substrate-less display device is disclosed. The substrate-less display device includes a barrier stack. The barrier stack includes a plurality of inorganic barrier films and a plurality of polymer films. The inorganic barrier films and the polymer films are alternatively disposed. The substrate-less display device further includes a thin-film-transistor (TFT) device layer disposed on the barrier stack, a display medium layer disposed on the TFT device layer, and an encapsulation layer disposed on the display medium layer.

Abstract translation: 公开了一种无基板显示装置。 无基板显示装置包括阻挡层叠层。 阻挡层包括多个无机阻挡膜和多个聚合物膜。 交替地设置无机阻挡膜和聚合物膜。 无衬底显示装置还包括设置在势垒堆叠上的薄膜晶体管（TFT）器件层，设置在TFT器件层上的显示介质层和设置在显示介质层上的封装层。

公开(公告)号：US10236446B2

公开(公告)日：2019-03-19

申请号：US15574788

申请日：2016-06-08

Applicant: ROYOLE CORPORATION

Inventor： Xiaojun Yu ,  Ze Yuan ,  Peng Wei ,  Zihong Liu

IPC: B32B43/00 ,  H01L51/00 ,  H01L27/12 ,  H01L51/56 ,  H01L27/32

Abstract: This application discloses a method of forming a flexible substrate using a detachment apparatus. The flexible substrate includes a debonding region, and one or more edge regions located in proximity to one or more edges of the flexible substrate. The detachment apparatus detaches the one or more edge regions of the flexible substrate from a rigid carrier that is configured to support the flexible substrate device, and detach the debonding region of the flexible substrate from the rigid carrier to which a bottom surface of the debonding region is configured to adhere. Specifically, the detachment apparatus detaches the debonding region by contacting the top surface of the flexible substrate at a plurality of suction locations located on the debonding region of the flexible substrate, and applying detachment force at the plurality of suction locations to peel the flexible substrate off the rigid carrier.

公开(公告)号：US10529924B2

公开(公告)日：2020-01-07

申请号：US15566163

申请日：2016-04-13

Applicant: ROYOLE CORPORATION

Inventor： Xiaojun Yu ,  Peng Wei ,  Ze Yuan ,  Zihong Liu

IPC: H01L51/00 ,  H01L21/683

Abstract: This application discloses a flexible substrate device that includes a flexible substrate and a plurality of electronic devices. The flexible substrate includes a top surface and a bottom surface opposite to the top surface, and the plurality of electronic devices formed on the top surface of the flexible substrate. The bottom surface further includes one or more strong adhesion regions and one or more normal adhesion regions that are distinct from the one or more strong adhesion regions. Each of the one or more strong adhesion regions and the one or more normal adhesion regions are configured to attach to a rigid carrier with first adhesion strength and second adhesion strength, respectively. The first adhesion strength is substantially larger than the second adhesion strength. In some embodiments, the flexible substrate device is a thin film transistor (TFT) device, and the plurality of electronic devices includes a TFT array.